I-110 lamanqaku olwazi lwe-SMT yokusetyenzwa kwetshiphu inxalenye yesi-2
56. Ekuqaleni kwe-1970, kwakukho uhlobo olutsha lwe-SMD kwishishini, elibizwa ngokuba "i-sealed foot less chip carrier", eyayihlala ithathelwe indawo yi-HCC;
57. Ukuchasana kwemodyuli kunye nesimboli 272 kufuneka kube yi-2.7K ohm;
58. Umthamo wemodyuli ye-100nF uyafana no-0.10uf;
Indawo ye-eutectic ye-63Sn + 37Pb yi-183 ℃;
60. Eyona mathiriyeli isetyenziswa kakhulu ekrwada ye-SMT ziiseramikhi;
61. Elona qondo lobushushu liphezulu lejiko lobushushu le-reflow furnace yi-215C;
62. Iqondo lobushushu letoti lingama-245c xa lihlolwa;
63. Kwiindawo ze-SMT, ububanzi be-coiling plate yi-13 intshi kunye ne-7 intshi;
64. Uhlobo lokuvula lwentsimbi yensimbi luyi-square, i-triangular, i-round, i-star shaped kunye ne-plain;
65. Ngoku esetyenziswa kwicala computer PCB, imathiriyeli yayo ekrwada: glass fiber board;
66. Luluphi uhlobo lwe-substrate ye-ceramic plate yi-solder paste ye-sn62pb36ag2 ukuba isetyenziswe;
67. I-Rosin esekelwe kwi-flux ingahlulwa ibe ziindidi ezine: i-R, i-RA, i-RSA kunye ne-RMA;
68. Ingaba ukuchasana kwecandelo le-SMT kukukhokelela okanye akunjalo;
69. Intlama ye-solder yangoku kwimarike ifuna kuphela iiyure ezi-4 zexesha elincangathi ekusebenzeni;
70. Uxinzelelo lomoya olongezelelweyo oluqhelekileyo olusetyenziswa zizixhobo ze-SMT yi-5kg / cm2;
71. Luluphi uhlobo lwendlela yokuwelda ekufuneka isetyenziswe xa i-PTH kwicala langaphambili ingadluli kwisithando somlilo nge-SMT;
72. Iindlela zokuhlola eziqhelekileyo ze-SMT: ukuhlolwa okubonakalayo, ukuhlolwa kwe-X-ray kunye nokuhlolwa kombono womatshini
73. Indlela yokuqhuba ukushisa kweendawo zokulungisa i-ferrochrome yi-conduction + convection;
74. Ngokutsho kwedatha ye-BGA yangoku, i-sn90 pb10 yibhola ye-tin ephambili;
75. Indlela yokuvelisa ipleyiti yensimbi: ukusika i-laser, i-electroforming kunye ne-chemical etching;
76. Ukushisa kwesithando somlilo: sebenzisa i-thermometer ukulinganisa ukushisa okusebenzayo;
77. Xa iimveliso ze-SMT ze-SMT ezigqityiweyo zithunyelwa kumazwe angaphandle, iindawo zilungiswa kwi-PCB;
78. Inkqubo yolawulo lomgangatho lwangoku tqc-tqa-tqm;
79. Uvavanyo lwe-ICT luvavanyo lwebhedi yenaliti;
80. Uvavanyo lwe-ICT lungasetyenziselwa ukuvavanya iinxalenye ze-elektroniki, kwaye uvavanyo lwe-static lukhethiwe;
81. Iimpawu ze-solder tin kukuba i-melting point iphantsi kunezinye isinyithi, iimpawu ezibonakalayo ziyanelisa, kwaye i-fluidity ingcono kunezinye isinyithi kwiqondo lokushisa eliphantsi;
82. Ijika lokulinganisa kufuneka lilinganiswe ukususela ekuqaleni xa iimeko zenkqubo yeengxenye zesithando somlilo ziguqulwa;
83. I-Siemens 80F / S yeye-electronic control drive;
84. Igeyiji yobukhulu be-solder paste isebenzisa ukukhanya kwelaser ukulinganisa: i-solder paste degree, i-solder paste ubukhulu kunye nobubanzi bokushicilela intlama ye-solder;
85. Amalungu e-SMT abonelelwa nge-oscillating feeder, i-disc feeder kunye ne-coiling belt feeder;
86. Yiyiphi imibutho esetyenziswa kwizixhobo ze-SMT: isakhiwo sekhamera, isakhiwo sebar yecala, isakhiwo se-screw kunye nesakhiwo se-sliding;
87. Ukuba icandelo lokuhlola elibonakalayo alinakubonwa, i-BOM, imvume yomvelisi kunye nebhodi yesampula iya kulandelwa;
88. Ukuba indlela yokupakisha yamacandelo yi-12w8p, isikali se-pinth se-counter kufuneka sihlengahlengiswe kwi-8mm rhoqo;
89. Iindidi zoomatshini bokudibanisa: i-furnace ye-welding air, i-nitrogen welding furnace, i-laser welding furnace kunye ne-infrared welding furnace;
90. Iindlela ezikhoyo zovavanyo lweesampuli ze-SMT: ukuveliswa kokulungelelaniswa, ukufakwa komatshini wokushicilela ngesandla kunye nokunyuka kwesandla sokushicilela;
91. Iimilo zamanqaku ezisetyenziswa ngokuqhelekileyo zezi: isangqa, umnqamlezo, isikwere, idayimani, unxantathu, uWanzi;
92. Ngenxa yokuba iprofayili ye-reflow ayimiselwanga ngokufanelekileyo kwicandelo le-SMT, yindawo yokufudumeza kwangaphambili kunye nendawo yokupholisa enokwenza i-micro crack yamacandelo;
93. Iziphelo ezimbini zeengxenye ze-SMT zifudumala ngokungalingani kwaye kulula ukwenza: i-welding engenanto, ukuphambuka kunye ne-tablet yamatye;
94. Izinto zokulungisa iinxalenye ze-SMT zezi: intsimbi yokudambisa, i-extractor yomoya oshushu, i-tin gun, i-tweezers;
95. I-QC yahlulwe kwi-IQC, IPQC,.I-FQC kunye ne-OQC;
96. Isantya esiphezulu seMounter sinokufaka i-resistor, i-capacitor, i-IC kunye ne-transistor;
97. Iimpawu zombane ongatshintshiyo: umsinga omncinci kunye nefuthe elikhulu ngokufuma;
98. Ixesha lomjikelo womatshini wesantya esiphezulu kunye nomatshini wendalo yonke kufuneka ulungelelaniswe kangangoko kunokwenzeka;
99. Eyona ntsingiselo yomgangatho kukwenza kakuhle okokuqala;
100. Umatshini wokubeka kufuneka uncamathele iindawo ezincinci kuqala kwaye emva koko iindawo ezinkulu;
101. I-BIOS yinkqubo yegalelo / imveliso esisiseko;
102. Amalungu e-SMT anokwahlulwa abe ilothe kwaye angabinalothe nokuba kukho iinyawo;
103. Kukho iintlobo ezintathu ezisisiseko zoomatshini bokubeka okusebenzayo: ukubekwa ngokuqhubekayo, ukubekwa ngokuqhubekayo kunye neendawo ezininzi zokubeka izandla;
104. I-SMT inokuveliswa ngaphandle komlayishi;
105. Inkqubo ye-SMT iqulethe inkqubo yokutya, umshicileli we-solder paste, umatshini wesantya esiphezulu, umatshini wendalo yonke, i-welding yangoku kunye nomatshini wokuqokelela ipleyiti;
106. Xa iqondo lobushushu kunye nokufuma kweendawo ezibuthathaka zivulwa, umbala kwisangqa sekhadi lokufuma uluhlaza okwesibhakabhaka, kwaye iinxalenye zinokusetyenziswa;
107. Umgangatho we-dimension ye-20 mm ayilona ububanzi bomcu;
108. Izizathu zesekethe emfutshane ngenxa yokungashicileli kakuhle kwinkqubo:
a.Ukuba umxholo wesinyithi we-solder paste awulungile, uya kubangela ukuwa
b.Ukuba ukuvulwa kwentsimbi yentsimbi kukhulu kakhulu, umxholo we-tin unzima kakhulu
c.Ukuba umgangatho wentsimbi yentsimbi umbi kwaye i-tin ihlwempuzekile, buyisela itemplate yokusika i-laser
D. kukho intlama ye-solder eshiyekileyo kwicala elingasemva lestencil, yehlisa uxinzelelo lwe-scraper, kwaye ukhethe i-vaccum efanelekileyo kunye ne-solvent.
109. Eyona njongo yobunjineli yezowuni nganye yeprofayile yesithando somlilo sokuqukunjelwa komlilo ngolu hlobo lulandelayo:
a.indawo yokutshisa kwangaphambili;injongo yobunjineli: ukuguquguquka kokuhamba kwintlama ye-solder.
b.indawo yokulinganisa ubushushu;injongo yobunjineli: ukusebenza kwe-flux ukususa i-oxides;ukukhutshwa kokufuma okushiyekileyo.
c.Indawo yokuhanjiswa kwakhona;injongo yobunjineli: ukunyibilika kwe-solder.
d.indawo yokupholisa;injongo yobunjineli: i-alloy solder i-joint joint, inxalenye yonyawo kunye ne-pad iyonke;
110. Kwinkqubo ye-SMT ye-SMT, ezona zizathu ziphambili ze-solder bead zezi: ukubonakaliswa kakubi kwe-PCB pad, ukuboniswa kakubi kokuvulwa kwepleyiti yentsimbi, ubunzulu obugqithisileyo okanye uxinzelelo lokubeka, ukunyuka kwe-slope yeprofayili enkulu kakhulu, ukuwa kwe-solder paste kunye ne-viscosity ephantsi yokunamathisela. .
Ixesha lokuposa: Sep-29-2020