I-110 yeendawo zolwazi zokusetyenzwa kwetshiphu ye-SMT - Icandelo loku-1

I-110 yeendawo zolwazi zokusetyenzwa kwetshiphu ye-SMT - Icandelo loku-1

1. Ngokubanzi, ubushushu beworkshop yeSMT chip yi-25 ± 3 ℃;
2. Izinto kunye nezinto ezifunekayo kushicilelo lwe-solder paste, ezifana ne-solder paste, i-steel plate, i-scraper, iphepha lokusula, iphepha elingenalo uthuli, into yokucoca kunye nemela yokuxuba;
3. Ukuqulunqwa okuqhelekileyo kwe-solder paste alloy yi-Sn / Pb alloy, kunye nesabelo se-alloy yi-63 / 37;
4. Kukho izinto ezimbini eziphambili kwi-solder paste, ezinye ziyi-tin powder kunye ne-flux.
5. Indima ephambili ye-flux kwi-welding kukususa i-oxide, ukonakalisa ukunyanzeliswa kwangaphandle kwe-tin etyhidiweyo kwaye ugweme ukubuyisela kwakhona.
6. Ubungakanani bomthamo we-tin powder particles ukuya kwi-flux malunga ne-1: 1 kunye nomlinganiselo wecandelo malunga ne-9: 1;
7. Umgaqo we-solder paste ungowokuqala ngaphandle;
8. Xa i-solder paste isetyenziswe eKaifeng, kufuneka ihlaziye kwaye idibanise ngeenkqubo ezimbini ezibalulekileyo;
9. Iindlela eziqhelekileyo zokuvelisa ipleyiti yensimbi zezi: i-etching, i-laser kunye ne-electroforming;
10. Igama elipheleleyo le-SMT chip processing yiteknoloji ye-surface mount (okanye ukunyuswa), okuthetha ukunamathela ngokubonakalayo (okanye ukunyuswa) ubuchwepheshe ngesiTshayina;
11. Igama elipheleleyo le-ESD yi-electrostatic discharge, ethetha ukukhutshwa kwe-electrostatic ngesiTshayina;
12. Xa kusenziwa inkqubo yezixhobo ze-SMT, inkqubo ibandakanya iinxalenye ezintlanu: idatha yePCB;idatha yamanqaku;idatha yesondlo;idatha yephazili;inxalenye yedatha;
13. I-melting point ye-Sn / Ag / Cu 96.5 / 3.0 / 0.5 yi-217c;
14. Ubushushu obusebenzayo kunye nokufuma kweendawo zokomisa i-oven ngu <10%;
15. Izixhobo ezisetyenziswayo ezisetyenziswa ngokuqhelekileyo ziquka ukuchasana, amandla, i-point inductance (okanye i-diode), njl.;izixhobo ezisebenzayo ziquka transistors, IC, njl;
16. Izinto ezisetyenziswayo ezisetyenziswa ngokuqhelekileyo ipleyiti yensimbi ye-SMT yintsimbi engenasici;
17. Ubukhulu bentsimbi ye-SMT esetyenziswa ngokuqhelekileyo yi-0.15mm (okanye i-0.12mm);
18. Iindidi zentlawulo yombane we-electrostatic ziquka impixano, ukwahlukana, ukwenziwa kwe-electrostatic conduction, njl.;impembelelo yentlawulo ye-electrostatic kushishino lombane kukungaphumeleli kwe-ESD kunye nongcoliseko lombane;imigaqo emithathu yokupheliswa kwe-electrostatic yi-electrostatic neutralization, isiseko kunye nokukhusela.
19. Ubude x ububanzi benkqubo yesiNgesi yi-0603 = 0.06inch * 0.03inch, kunye ne-metric system yi-3216 = 3.2mm * 1.6mm;
20. Ikhowudi ye-8 "4" ye-erb-05604-j81 ibonisa ukuba kukho iisekethe ezi-4, kwaye ixabiso lokumelana ngu-56 ohm.I-capacitance ye-eca-0105y-m31 yi-C = 106pf = 1NF = 1 × 10-6f;
21. Igama elipheleleyo lesiTshayina le-ECN sisaziso sotshintsho lobunjineli;igama elipheleleyo lesiShayina le-SWR ngulo: umyalelo womsebenzi oneemfuno ezizodwa, eziyimfuneko ukuba ziphinde zisayinwe ngamasebe afanelekileyo kwaye zisasazwe phakathi, eziluncedo;
22. Imixholo ethile ye-5S kukucoca, ukuhlela, ukucoca, ukucocwa kunye nomgangatho;
23. Injongo yokupakishwa kwe-PCB ye-vacuum kukuthintela uthuli kunye nokufuma;
24. Umgaqo-nkqubo womgangatho ngulo: lonke ulawulo lomgangatho, landela imigaqo, unikeze umgangatho ofunwa ngabathengi;umgaqo-nkqubo wokuthatha inxaxheba ngokupheleleyo, ukuphathwa kwangexesha, ukufikelela kungabikho siphene;
25. Le migaqo-nkqubo mithathu yokungabi nabulunga yile: ukungamkelwa kweemveliso ezineziphene, ukuveliswa kweemveliso ezineziphene kunye nokungaphumi kweemveliso ezineziphene;
26. Phakathi kweendlela ezisixhenxe ze-QC, i-4m1h ibhekisela (isiTshayina): umntu, umatshini, izinto eziphathekayo, indlela kunye nokusingqongileyo;
27. Ukuqulunqwa kwe-solder paste kubandakanya: umgubo wesinyithi, i-Rongji, i-flux, i-agent e-anti vertical flow and agent esebenzayo;ngokwecandelo, i-akhawunti ye-metal powder kwi-85-92%, kunye ne-volume integral metal powder akhawunti kwi-50%;phakathi kwabo, amacandelo aphambili omgubo wensimbi yi-tin kunye ne-lead, isabelo ngu-63/37, kunye ne-melting point yi-183 ℃;
28. Xa usebenzisa i-solder paste, kuyimfuneko ukuyikhupha ngaphandle kwefriji yokubuyisela ubushushu.Injongo kukwenza ubushushu be-solder paste bubuyele kubushushu obuqhelekileyo bokushicilela.Ukuba iqondo lokushisa alibuyiswanga, i-solder bead kulula ukwenzeka emva kokuba i-PCBA ingena ngokutsha;
29. Iifom zokubonelela ngoxwebhu lomatshini ziquka: ifom yokulungiselela, ifom yonxibelelwano oluphambili, ifom yoqhagamshelwano kunye nefom yokudibanisa ngokukhawuleza;
30. Iindlela ze-PCB zokubeka i-SMT zibandakanya: Ukubekwa kwe-vacuum, indawo yokubeka imingxuma ngoomatshini, i-double clamp positioning kunye nokubekwa komphetho webhodi;
31. Ukuxhatshazwa kunye ne-272 yesikrini se-silk (uphawu) yi-2700 Ω, kunye nesimboli (isikrini sesilika) sokumelana nexabiso lokumelana ne-4.8m Ω yi-485;
32. Ukuprintwa kwesikrini sesilika kumzimba we-BGA kubandakanya umenzi, inombolo yenxalenye yomenzi, umgangatho kunye noDatecode / (inombolo yeqashiso);
33. I-pitch ye-208pinqfp yi-0.5mm;
34. Phakathi kweendlela ezisixhenxe ze-QC, umzobo we-fishbone ugxile ekufumaneni ubudlelwane be-causal;
37. I-CPK ibhekiselele kubuchule benkqubo obuphantsi kolawulo lwangoku;
38. I-Flux yaqala ukuguquka kwindawo yokushisa rhoqo yokucoca imichiza;
39. Igophe elifanelekileyo lendawo yokupholisa kunye negophe lendawo ye-reflux yimifanekiso yesibuko;
40. Ijiko le-RSS kukufudumeza → ubushushu obungaguqukiyo → i-reflux → ukupholisa;
41. Izinto zePCB esizisebenzisayo yiFR-4;
42. Umgangatho we-warpage we-PCB awugqithi kwi-0.7% ye-diagonal yayo;
43. I-laser incision eyenziwe yi-stencil yindlela enokuthi iphinde ihlaziywe;
44. Ububanzi bebhola ye-BGA ehlala isetyenziswa kwibhodi ephambili yekhompyuter yi-0.76mm;
45. Inkqubo ye-ABS ilungelelanisa kakuhle;
46. ​​Impazamo yeceramic chip capacitor eca-0105y-k31 yi ± 10%;
47. I-Panasert Matsushita igcwele iMounter esebenzayo ene-voltage ye-3?200 ± 10vac;
48. Ukupakishwa kweengxenye ze-SMT, ububanzi be-tape reel yi-13 intshi kunye ne-7 intshi;
49. Ukuvulwa kwe-SMT kudla ngokuba yi-4um encinci kune-PCB pad, enokuphepha ukubonakala kwebhola le-solder elibi;
50. Ngokwemigaqo yokuhlolwa kwe-PCBA, xa i-angle ye-dihedral ingaphezu kwama-90 degrees, ibonisa ukuba i-solder paste ayinayo i-adhesion kumzimba we-solder wave;
51. Emva kokuba i-IC ikhutshwe, ukuba umswakama ekhadini mkhulu kune-30%, ibonisa ukuba i-IC imanzi kwaye i-hygroscopic;
52. Umlinganiselo ochanekileyo wecandelo kunye nomlinganiselo wevolumu ye-tin powder kwi-flux kwi-solder paste yi-90%: 10%, 50%: 50%;
53. Izakhono zokudibanisa ukubonakala kwangaphambili zivela kwimikhosi yemikhosi kunye ne-Avionics phakathi kwe-1960s;
54. Imixholo ye-Sn kunye ne-Pb kwi-solder paste esetyenziswa kakhulu kwi-SMT yahlukile.