Izikhululo zokuvuselela i-SMT zinokuhlulwa zibe ziindidi ezi-4 ngokokwakhiwa kwazo, ukusetyenziswa kunye nobunzima: uhlobo olulula, uhlobo olunzima, uhlobo lwe-infrared kunye nohlobo lomoya oshushu we-infrared.
1. Uhlobo olulula: olu hlobo lwezixhobo zokuphinda zisebenze zixhaphake kakhulu kunomsebenzi wesixhobo sesinyithi esizimeleyo, ungakhetha ukusebenzisa iinkcukacha ezahlukeneyo zentloko yentsimbi ngokweenkcukacha zecandelo, inxalenye yenkqubo kunye neqonga elisebenzayo le-PCB, ngokukodwa kwi-hole. ukufudumeza icandelo, i-chip soldering kunye nokususwa kwe-chip, njl.
2. Uhlobo oluntsonkothileyo: izixhobo ezintsonkothileyo zokuphinda zisebenze kunye nohlobo olulula lwezixhobo zokuphinda zisebenze, xa kuthelekiswa nazo zombini ziyakwazi ukuqhawuka amacandelo, intlama ye-solder yokwambathisa, amacandelo axhonywayo kunye namacandelo e-welding, eyona ibaluleke kakhulu yinkqubo yokubeka umfanekiso, inkqubo yokulawula ubushushu, ukufunxa i-vacuum elawulwayo kunye inkqubo yokukhulula, njl njl. Olu hlobo lwezixhobo lunesixhobo sokusebenza kwakhona se-GOOT,BGA isikhululo sokusebenza kwakhona, njl.
3. Uhlobo lwe-infrared: uhlobo lwesixhobo sokuphinda sisebenze kusetyenziso lwe-infrared radiation ukufudumeza isiphumo ukugqibezela ukuphinda kusetyenzwe kwakhona amacandelo, isiphumo sokufudumeza kwemitha ye-infrared sinokufana, akukho nto yokupholisa yendawo eyenzekayo xa ukufudumeza komoya oshushu, ukufudumala kwangoko kucotha, ukufudumeza kade ngokukhawuleza, ukungena ngamandla nokomelela, kodwa rework izihlandlo eziliqela ibhodi PCB kulula ukubangela delamination ngomngxuma ayisebenzi.
4. Uhlobo lomoya oshushu we-infrared: izixhobo zokuvuselela umoya oshushu owenziwe nge-infrared ngokudityaniswa kwe-infrared kunye ne-thermal sub heat ye-rework, kugxininise inzuzo ye-infrared kunye ne-hot air rework equipment.Ukuba usebenzisa i-infrared epheleleyo ukufudumeza okuqhubekayo, kulula ukukhokelela ekungazinzini kobushushu, umphezulu wokufudumala we-infrared uya kuba mkhulu kakhulu, ngoko ke ezinye ibhodi yebhodi ukuba ayikhuselwanga, yenza i-BGA iya kukhokelela ekuqhumeni kwetoti ejikelezileyo, njengokulungiswa kwe-laptop ngokubanzi. hayi ubushushu obugcweleyo be-infrared, kodwa ukusetyenziswa kwe-infrared eshushu indibaniselwano yokufudumeza.
Iimpawu zeNeoDenBGA rework station
Unikezelo lwamandla: AC220V±10%, 50/60HZ
Amandla: 5.65KW(Max) ,Ihitha ephezulu(1.45KW)
Isifudumezisi esisezantsi (1.2KW), IR Preheater (2.7KW), Okunye(0.3KW)
Ubungakanani bePCB: 412*370mm(Max);6*6mm(Min)
Ubungakanani be-BGA Chip: 60 * 60mm(Max); 2 * 2mm (Min)
Ubungakanani bokufudumala kwe-IR: 285 * 375mm
Inzwa yobushushu: 1 pcs
Indlela yokuSebenza: 7″ isikrini se-HD esichukumisayo
Inkqubo yokulawula: Inkqubo yokulawula ukufudumeza okuzimeleyo V2 (ilungelo lokushicilela lesoftware)
Inkqubo yokubonisa: 15″ SD isiboniso soshishino (720P isikrini sangaphambili)
Inkqubo yoLungelelaniso: Iimiliyoni ezi-2 zePixel SD inkqubo yokucinga yedijithali, ukusondeza okuzenzekelayo okubonakalayo ngelaser: isalathisi esinechaphaza elibomvu
Vacuum Adsorption: Ngokuzenzekelayo
Ulungelelwaniso oluchanekileyo: ± 0.02mm
Ulawulo lobushushu: K-uhlobo lwe-thermocouple oluvaliweyo-loop ulawulo ngokuchaneka ukuya kuthi ga ±3℃
Isixhobo sokutyisa: Hayi
Indawo: V-groove enendawo yonke
Ixesha lokuposa: Dec-09-2022