Ukufakwa kwe-Anti-deformation yamacandelo ebhodi yesekethe eprintiweyo

1. Kwisakhelo sokuqinisa kunye nofakelo lwe-PCBA, i-PCBA kunye nenkqubo yofakelo lwe-chassis, i-PCBA ephothiweyo okanye ukuphunyezwa kwesakhelo sokuqinisa ukuphunyezwa kofakelo oluthe ngqo okanye olunyanzelweyo kunye nofakelo lwe-PCBA kwi-chassis ekhubazekileyo.Uxinzelelo lokufakela lubangela umonakalo kunye nokuqhekeka kwecandelo elikhokelela (ingakumbi i-ICs yoxinaniso oluphezulu olufana ne-BGS kunye nezixhobo zokunyuka kwendawo), imingxuma yokudlulisa i-PCBs yamanqanaba amaninzi kunye nemigca yokudibanisa yangaphakathi kunye neepads ze-PCB ezininzi.Ukuya kwi-warpage ayihlangabezani neemfuno ze-PCBA okanye isakhelo esomeleziweyo, umyili kufuneka asebenzisane negcisa phambi kofakelo kwisaphetha salo (esijijekileyo) iinxalenye ukuthatha okanye ukuyila amanyathelo asebenzayo "pad".

2. Uhlalutyo

a.Phakathi kwamacandelo e-chip capacitive, amathuba okuba neziphene kwi-ceramic chip capacitors yeyona iphezulu, ngokuyininzi ilandelayo.

b.PCBA ukugoba kunye deformation okubangelwa uxinzelelo wire bundle ufakelo.

c.I-Flatness ye-PCBA emva kwe-soldering inkulu kune-0.75%.

d.Uyilo lwe-asymmetric yeepads kuzo zombini iziphelo ze-ceramic chip capacitors.

e.Iipads ezisetyenziswayo ezinexesha le-solder elingaphezulu kwe-2s, iqondo lobushushu elingaphezulu kwe-245 ℃, kunye namaxesha e-solder ewonke adlula ixabiso elichaziweyo lamaxesha ama-6.

f.I-coefficient yokwandiswa kwe-thermal eyahlukileyo phakathi kwe-ceramic chip capacitor kunye ne-PCB imathiriyeli.

g.Uyilo lwe-PCB olunemingxuma yokulungisa kunye ne-ceramic chip capacitors esondele kakhulu komnye nomnye kubangela uxinzelelo xa uqiniswa, njl.

h.Nokuba i-ceramic chip capacitor inobukhulu obufanayo bepadi kwi-PCB, ukuba inani le-solder lininzi kakhulu, liya kwandisa uxinzelelo kwi-chip capacitor xa i-PCB igobile;ubungakanani obuchanekileyo be-solder kufuneka ibe yi-1/2 ukuya kwi-2/3 yobude besiphelo se-solder ye-chip capacitor.

i.Naliphi na i-mechanical yangaphandle okanye uxinzelelo lwe-thermal luya kubangela iintanda kwi-ceramic chip capacitors.

• Ukuqhekeka okubangelwa yi-extrusion ye-pick yokunyuka kunye nentloko iya kubonakala kumphezulu wecandelo, ngokuqhelekileyo njenge-crack ejikelezayo okanye enesiqingatha senyanga kunye nokutshintsha kombala, ngaphakathi okanye kufuphi nombindi we-capacitor.
• Iintanda ezibangelwa kuseto olungachanekanga lwekhetha kwaye ubeke umatshiniiiparamitha.Intloko yokuxhoma isebenzisa ityhubhu yokufunxa ivacuum okanye isibambiso esisembindini ukubeka icandelo, kunye noxinzelelo olugqithisileyo lwe-Z-axis ezantsi lungophula icandelo leceramic.Ukuba amandla amakhulu okwaneleyo asetyenziswe kwi-pick kwaye abeke intloko kwindawo ngaphandle kwendawo ephakathi yomzimba we-ceramic, uxinzelelo olufakwe kwi-capacitor lunokuba lukhulu ngokwaneleyo ukulimaza inxalenye.
• Ukukhetha okungafanelekanga kobungakanani be-chip pick kunye nendawo yentloko kunokubangela ukuqhekeka.Idayamitha encinci yokuchola kunye nokubeka intloko iya kugxila kumandla okubekwa ngexesha lokubekwa, okubangela indawo encinci yeceramic chip capacitor ukuba iphantsi koxinzelelo olukhulu, okukhokelela ekuqhekekeni kweecapacitors zeceramic.
• Ubungakanani obungaguqukiyo be-solder buza kuvelisa ukusabalalisa uxinzelelo olungahambelaniyo kwicandelo, kwaye kwelinye icala liya kugxininisa ukugxininiswa kunye nokuqhekeka.
• Ingcambu yesizathu sokuqhekeka yi-porosity kunye nokuqhekeka phakathi kweengqimba ze-ceramic chip capacitors kunye ne-ceramic chip.

3. Amanyathelo esisombululo.

Yomeleza ujongo lwe-ceramic chip capacitors:I-ceramic chip capacitors ijongiwe nge-C-type scanning acoustic microscope (C-SAM) kunye ne-laser acoustic microscope (SLAM) yokuskena (i-SLAM), enokukhusela i-ceramic capacitors enesiphene.