BGA Packaging Inkqubo Flow

I-Substrate okanye i-intermediate layer yinxalenye ebaluleke kakhulu yephakheji ye-BGA, engasetyenziselwa ukulawula i-impedance kunye ne-inductor / resistor / capacitor integration ukongeza kwi-wiring yokudibanisa.Ngoko ke, i-substrate imathiriyeli iyadingeka ukuba ibe ne-glass high transition yeqondo lokushisa rS (malunga ne-175 ~ 230 ℃), ukuzinza okuphezulu kwe-dimensional kunye nokufunxa okuphantsi komswakama, ukusebenza kakuhle kombane kunye nokuthembeka okuphezulu.Ifilimu yesinyithi, i-insulation layer kunye ne-substrate media kufuneka nayo ibe neempawu eziphezulu zokubambelela phakathi kwazo.

1. Inkqubo yokupakishwa kwePBGA ebotshelelwe ilothe

① Ukulungiswa kwe-PBGA substrate

Laminate kakhulu obhityileyo (12 ~ 18μm ubukhulu) ifoyile yobhedu kumacala omabini e-BT resin / glass core ibhodi, ngoko gqobhoza imingxuma ngokusebenzisa-umngxuma metallization.Inkqubo eqhelekileyo ye-PCB kunye ne-3232 isetyenziselwa ukwenza imizobo kumacala omabini e-substrate, njengemigca yesikhokelo, i-electrode, kunye noluhlu lwendawo ye-solder yokunyuswa kweebhola ze-solder.Imaski ye-solder iye yongezwa kwaye imizobo yenziwe ukubonisa i-electrodes kunye neendawo ze-solder.Ukuphucula ukusebenza kakuhle kwemveliso, i-substrate idla ngokuba ne-PBG substrates ezininzi.

② UkuPakisha ukuHamba kweNkqubo

I-wafer ibhityile → ukusika i-wafer → ukudityaniswa kwetshiphu → ukucocwa kweplasma → ukudityaniswa okukhokelayo → ukucocwa kweplasma → iphakheji ebunjiweyo → indibano yeebhola ze-solder → ukupakishwa kwe-oveni yokubuyisela → ukumakishwa komphezulu → ukwahlukana → uhlolo lokugqibela → ukupakishwa kwehopper yovavanyo

I-chip bonding isebenzisa i-epoxy egcwele isilivere enamathelayo ukuze idibanise i-IC chip kwi-substrate, emva koko igolide yokubopha intambo isetyenziselwa ukuqonda ukudibanisa phakathi kwe-chip kunye ne-substrate, ilandelwa yi-encapsulation yeplastiki ebunjiweyo okanye i-adhesive potting ukukhusela i-chip, imigca ye-solder. kunye neepads.Isixhobo sokuchola esenziwe ngokukodwa sisetyenziselwa ukubeka iibhola ze-solder 62/36/2Sn/Pb/Ag okanye 63/37/Sn/Pb ezinendawo yokunyibilika eyi-183°C kunye nobubanzi obuyi-30 mil (0.75mm) iipads, kunye ne-reflow soldering yenziwa kwi-oven yesiqhelo yokuphuma kwakhona, kunye neqondo lokushisa eliphezulu elingekho ngaphezu kwe-230 ° C.I-substrate ke icoca nge-centrifugally kunye ne-CFC ye-inorganic cleaner ukususa i-solder kunye ne-fiber particles eshiywe kwi-package, ilandelwa ngokumakisha, ukwahlukana, ukuhlolwa kokugqibela, ukuvavanywa, kunye nokupakishwa kokugcina.Oku kungasentla yinkqubo yokupakishwa kohlobo lokudibanisa okukhokelela kwi-PBGA.

2. Inkqubo yokupakishwa kweFC-CBGA

① Isiseko seCeramic

I-substrate ye-FC-CBGA yi-multilayer ceramic substrate, ekunzima kakhulu ukuyenza.Ngenxa yokuba i-substrate inoxinano oluphezulu lwe-wiring, isithuba esincinci, kwaye ezininzi ngemingxuma, kunye nemfuno ye-coplanarity ye-substrate iphezulu.Inkqubo yayo ephambili kukuba: okokuqala, i-multilayer ceramic sheets i-co-fired kwiqondo lokushisa eliphezulu ukwenza i-multilayer ceramic metallized substrate, emva koko i-wiring yesinyithi ye-multilayer yenziwe kwi-substrate, kwaye emva koko i-plating yenziwa, njl. Kwindibano ye-CBGA , Ukungafani kwe-CTE phakathi kwe-substrate kunye ne-chip kunye nebhodi ye-PCB yeyona nto ibangela ukusilela kweemveliso ze-CBGA.Ukuphucula le meko, ngaphezu kwesakhiwo seCCGA, enye i-substrate ye-ceramic, i-HITCE ye-ceramic substrate, ingasetyenziswa.

②Ukuhamba kwenkqubo yokupakisha

Ukulungiswa kwee-disc bumps -> i-disc cutting -> i-chip flip-flop kunye ne-reflow soldering -> ukuzaliswa kwegrisi ye-thermal, ukuhanjiswa kwe-solder yokutywina -> i-capping -> indibano yeebhola ze-solder -> i-reflow soldering -> ukuphawula -> ukuhlukana -> ukuhlolwa kokugqibela -> uvavanyo -> ukupakishwa

3. Inkqubo yokupakishwa kwe-lead bonding TBGA

① TBGA iteyiphu yokuthwala

Iteyiphu yokuthwala ye-TBGA idla ngokwenziwa ngezinto ze-polyimide.

Kwimveliso, omabini amacala eteyiphu yokuthwala aqale aqatywe ubhedu, emva koko i-nickel kunye negolide zifakwe, zilandelwa kukugqobhoza ngomngxuma kunye ne-metallization kunye nokuveliswa kwemizobo.Kuba kule TBGA idityanisiweyo ye-lead, isinki yobushushu egqunyiweyo ikwayi-capsulated plus solid and core cavity substrate yeqokobhe letyhubhu, ngoko ke iteyiphu ephetheyo ibotshelelwa kwindawo yokuntywila ubushushu isebenzisa incatho encamathelayo ngoxinzelelo phambi kokugqunywa.

② Ukuhamba kwenkqubo ye-encapsulation

Ukucutha itshiphu→ukusika itshiphu→ukubopha itshiphu→ukucoca→ukudibanisa ilothe→ukucocwa kweplasma→ubumba lwesitywina esilulwelo→ukudibanisa iibhola zesolder→ukuphinda kufakwe i-solder→ukumakishwa komphezulu→ukwahlula→uvavanyo lokugqibela→uvavanyo→ukupakishwa

I-Zhejiang NeoDen Technology Co., LTD., Yasekwa ngo-2010, ngumvelisi oqeqeshiweyo okhethekileyo kwi-SMT pick and place machine, i-oven reflow, umatshini wokushicilela we-stencil, umgca wemveliso we-SMT kunye nezinye iiMveliso ze-SMT.

Sikholelwa ukuba abantu abakhulu kunye namahlakani enza iNeoDen ibe yinkampani enkulu kwaye ukuzinikela kwethu kuTshintsho, iyantlukwano kunye noZinzo kuqinisekisa ukuba i-SMT automation iyafikeleleka kuye wonke umntu othanda ukuzonwabisa kuyo yonke indawo.

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