1. 0.5mm pitch QFP pad ubude ubude kakhulu, kubangele isekethe elifutshane.
2. Iipadi ze-socket ze-PLCC zifutshane kakhulu, ezikhokelela ekuthengiseni okungamanga.
3. Ubude bephedi ye-IC's mde kakhulu kwaye inani le-solder paste likhulu likhokelela kwisekethe emfutshane ekuqhubekeni kwakhona.
4. Iipads ze-chip ezibunjwe ngamaphiko zide kakhulu ukuchaphazela ukuzaliswa kwe-solder yesithende kunye nokumanzisa isithende esibi.
5. Ubude bepadi bamacandelo e-chip bufutshane kakhulu, okubangela ukutshintshwa, isiphaluka esivulekileyo, asikwazi ukuthengiswa kunye nezinye iingxaki ze-soldering.
6. Ubude bepadi yamacandelo e-chip-type bude kakhulu, okubangela ukuba ilitye lesikhumbuzo limile, isiphaluka esivulekileyo, i-solder joints less tin kunye nezinye iingxaki ze-soldering.
7. Ububanzi bepadi bubanzi kakhulu obubangela ukufuduswa kwecandelo, i-solder engenanto kunye netoti eyaneleyo kwi-pad kunye nezinye iziphene.
8. Ububanzi bepadi bubanzi kakhulu, ubungakanani bepakethe yecandelo kunye nokungahambelani kweepadi.
9. Ububanzi be-pad buncinci, buchaphazela ubungakanani be-solder etyhidiweyo ecaleni kwecandelo le-solder ekupheleni kunye ne-metal surface wetting esasazeka kwi-PCB pad indibaniselwano, echaphazela ukuma kwe-solder joint, ukunciphisa ukuthembeka kwe-solder joint.
10. I-Pad idibaniswe ngokuthe ngqo kwindawo enkulu ye-foil yobhedu, okubangela ukuba isikhumbuzo esimileyo, i-solder yobuxoki kunye nezinye iziphene.
11. I-pad pitch inkulu kakhulu okanye incinci kakhulu, isiphelo se-solder yecandelo asikwazi ukugqithela kunye ne-pad overlap, iya kuvelisa isikhumbuzo, ukufuduka, i-solder yobuxoki kunye nezinye iziphene.
12. I-pad pitch inkulu kakhulu ebangela ukungakwazi ukwenza i-solder joint.
Ixesha lokuposa: Dec-16-2021