1. I-0.5mm pitch QFP ubude bephedi ide kakhulu, ibangela isiphaluka esifutshane.
2. Iipadi ze-socket ze-PLCC zifutshane kakhulu, ezikhokelela ekuthengiseni okungamanga.
3. Ubude bePad be-IC bude kakhulu kwaye inani le-solder paste likhulu libangela isiphaluka esifutshane ekuqhutyeni kwakhona.
4. Iipads ze-Wing chip zide kakhulu zichaphazela isithende sokuzaliswa kwe-solder kunye nokumanzisa kakubi kwesithende.
5. Ubude be-pad bamacandelo e-chip bufutshane kakhulu, okukhokelela kwiingxaki ze-solder ezifana nokutshintsha, isekethe evulekileyo, kunye nokungakwazi ukuthengisa.
6. Ubude obude kakhulu beepads zecandelo le-chip kubangela iingxaki zokubethela ezifana nelitye lesikhumbuzo elimileyo, isekethe evulekileyo, kunye ne-tin encinci kwi-solder joints.
7. Ububanzi bepadi bubanzi kakhulu obukhokelela kwiziphene ezinjengokususwa kwecandelo, i-solder engenanto kunye netoti eyoneleyo kwi-pad.
8. Ububanzi bepadi bubanzi kakhulu kwaye ubungakanani bepakethe yecandelo abuhambelani nephedi.
9. Ububanzi bephedi ye-Solder bumxinwa, obuchaphazela ubungakanani be-solder etyhidiweyo ecaleni kwecandelo le-solder ekupheleni kunye ne-PCB pads kwindibaniselwano ye-metal surface wetting spread inokufikelela, echaphazela ukumila kwe-solder joint, ukunciphisa ukuthembeka kwe-solder joint. .
10.Iipads ze-Solder zixhunywe ngokuthe ngqo kwiindawo ezinkulu ze-foil zethusi, ezibangela iziphene ezifana nezikhumbuzo ezimileyo kunye ne-solder yobuxoki.
11. I-pad ye-solder pitch inkulu kakhulu okanye incinci kakhulu, isiphelo se-solder yecandelo asikwazi ukugqithela kunye ne-pad overlap, eya kuvelisa iziphene ezifana nelitye lesikhumbuzo elimileyo, ukufuduka, kunye ne-solder yobuxoki.
12. Isithuba se-solder pad inkulu kakhulu ebangela ukungakwazi ukwenza i-solder joints.
Ixesha lokuposa: Jan-14-2022