1. Ubume bokushisa ubushushu, ubukhulu kunye nommandla woyilo
Ngokweemfuno zoyilo thermal ezifunekayo amacandelo ukuchithwa ubushushu kufuneka ziqwalaselwe ngokupheleleyo, kufuneka kuqinisekiswe ukuba ubushushu isiphambuka amacandelo okuvelisa ubushushu, PCB umphezulu ubushushu ukuhlangabezana neemfuno zoyilo imveliso.
2. Idizayini yobushushu yokufaka uburhabaxa
Kwiimfuno zolawulo lobushushu obuphezulu bezinto ezivelisa ubushushu obuphezulu, isinki sobushushu kunye namalungu omgangatho orhabaxa onyukayo kufuneka aqinisekiswe ukuba afikelele kwi-3.2µm okanye nokuba yi-1.6µm, yonyuse indawo yoqhagamshelwano yomphezulu wesinyithi, kusetyenziswa ngokupheleleyo ukuhanjiswa kwe-thermal ephezulu. yeempawu zentsimbi, ukunciphisa ukuxhatshazwa kwe-thermal.Kodwa ngokubanzi, uburhabaxa akufunekanga buphakame kakhulu.
3. Ukuzalisa ukhetho lwezinto
Ukuze kuncitshiswe ukuxhathisa kwe-thermal yendawo yoqhagamshelwano yecandelo eliphezulu lamandla aphezulu kunye ne-sink yokushisa, i-interface insulation kunye ne-thermal conductivity materials, izinto zokuzalisa i-thermal conductivity kunye ne-high conductivity ye-thermal kufuneka zikhethwe, umzekelo, ukugquma kunye nokuhanjiswa kwe-thermal. izinto ezifana ne-beryllium oxide (okanye i-aluminiyam trioxide) i-ceramic sheet, ifilimu ye-polyimide, i-mica sheet, izinto zokuzalisa ezifana negrisi ye-silicone ye-thermal conductive, i-rubber ye-vulcanized silicone irabha, i-rubber ye-thermal conductive ye-silicone ye-thermally conductive pad.
4. Umphezulu woqhagamshelwano wofakelo
Ufakelo ngaphandle kokugquma: indawo yokunyusela indawo → isinki sobushushu sokunyusela umphezulu → PCB, umphezulu wodibaniso onemigangatho emibini.
Ufakelo olugqunyiweyo: indawo yokunyusela indawo → isinki sobushushu esifaka umphezulu → umaleko wokugquma → I-PCB (okanye iqokobhe le-chassis), iileya ezintathu zomphezulu woqhagamshelwano.I-Insulation layer efakwe kweyiphi inqanaba, kufuneka isekelwe kwi-party mounting surface okanye iimfuno zokugquma kombane zePCB.
Ixesha lokuposa: Dec-31-2021