Iziphene zokupakisha ikakhulu ziquka i-lead deformation, i-base offset, i-warpage, i-chip breakage, i-delamination, i-voids, ukupakishwa okungalinganiyo, ii-burrs, amasuntswana angaphandle kunye nokunyanga okungaphelelanga, njl.
1. Lead deformation
I-lead deformation ngokuqhelekileyo ibhekisela kwi-lead displacement okanye i-deformation ebangelwa ngexesha lokuhamba kwe-plastic sealant, edla ngokubonakaliswa ngumlinganiselo x / L phakathi kweyona ndawo iphezulu ye-lateral lead displacement x kunye nobude obukhokelayo L. Ukugoba okukhokelayo kunokukhokelela kwiifutshane zombane (ingakumbi. kuxinaniso oluphezulu lweepakethe zesixhobo se-I/O).Ngamanye amaxesha uxinzelelo oluveliswa ngokugoba lunokukhokelela ekuqhekekeni kwendawo yokudibanisa okanye ukunciphisa amandla ebhondi.
Izinto ezichaphazela i-lead bonding zibandakanya uyilo lwephakheji, i-lead layout, i-lead material kunye nobukhulu, iipropati zeplastiki zokubumba, inkqubo ye-lead bonding, kunye nenkqubo yokupakisha.Iiparamitha ezikhokelayo ezichaphazela ukugoba okukhokelayo ziquka ububanzi bokukhokela, ubude bokukhokela, umthwalo okhokelayo wekhefu kunye nokuxinana okukhokelela, njl.
2. Isiseko se-offset
Isiseko se-offset sibhekiselele kwi-deformation kunye ne-offset ye-carrier (isiseko se-chip) esixhasa i-chip.
Izinto ezichaphazela i-base shift shift zibandakanya ukuhamba kwe-compound yokubumba, i-leadframe assembly design, kunye nezinto eziphathekayo ze-molding compound kunye ne-leadframe.Iipakethi ezifana ne-TSOP kunye ne-TQFP zichaphazeleka kwisiseko sokutshintsha kunye nokuguqulwa kwe-pin ngenxa yeefreyimu zabo ezinqabileyo.
3. I-Warpage
I-Warpage kukugoba ngaphandle kwenqwelo-moya kunye nokuguqulwa kwesixhobo sephakheji.I-Warpage ebangelwa yinkqubo yokubumba ingakhokelela kwinani lemiba ethembekileyo efana ne-delamination kunye ne-chip cracking.
I-Warpage inokukhokelela kuluhlu lweengxaki zokuvelisa, ezifana ne-plasticized ball grid array (PBGA) izixhobo, apho i-warpage ingakhokelela kwi-coplanarity yebhola ye-solder embi, ebangela iingxaki zokubekwa ngexesha lokuhamba kwakhona kwesixhobo sokuhlanganisana kwibhodi yesekethe eprintiweyo.
Iipateni ze-Warpage ziquka iintlobo ezintathu zeepateni: i-concave yangaphakathi, i-convex yangaphandle kwaye idibene.Kwiinkampani ze-semiconductor, i-concave ngamanye amaxesha ibizwa ngokuba "ubuso obuncumo" kunye ne-convex "njengobuso obukhalayo".Ezona zizathu ziphambili ze-warpage ziquka ukungafani kwe-CTE kunye nokunyanga / ukunyanzeliswa kokunciphisa.Le yokugqibela ayizange ifumane ingqwalasela enkulu ekuqaleni, kodwa uphando olunzulu lubonise ukuba i-chemical shrinkage ye-compound yokubumba nayo idlala indima ebalulekileyo kwi-warpage yesixhobo se-IC, ngokukodwa kwiiphakheji ezinobunzima obuhlukeneyo phezulu nangaphantsi kwe-chip.
Ngethuba lokunyanga kunye nenkqubo yokunyanga, i-compound yokubumba iya kuba ne-chemical shrinkage kwiqondo lokushisa eliphezulu lokunyanga, elibizwa ngokuba yi-"thermochemical shrinkage".Ukucutheka kweekhemikhali okwenzeka ngexesha lokunyanga kunokuncitshiswa ngokunyusa iqondo lokushisa lokutshintsha kweglasi kunye nokunciphisa utshintsho kwi-coefficient yokwanda kwe-thermal malunga ne-Tg.
I-Warpage nayo inokubangelwa zizinto ezifana nokubunjwa kwe-compound yokubumba, umswakama kwi-compound yokubumba, kunye nejometri yephakheji.Ngokulawula izinto zokubumba kunye nokubunjwa, iiparameters zenkqubo, isakhiwo sephakheji kunye ne-pre-encapsulation environment, i-warpage yepakethe ingancitshiswa.Kwezinye iimeko, i-warpage inokuhlawulwa ngokufaka i-encapsulating kwicala elingasemva lendibano ye-elektroniki.Ngokomzekelo, ukuba udibaniso lwangaphandle lwebhodi ye-ceramic okanye ibhodi ye-multilayer ikwicala elifanayo, ukuyifaka kwicala elingasemva kunokunciphisa i-warpage.
4. Ukuqhekeka kwetshiphu
Uxinzelelo olwenziwe kwinkqubo yokupakisha lunokukhokelela ekuqhekekeni kwe-chip.Inkqubo yokupakisha ngokuqhelekileyo iyandisa i-micro-cracks eyenziwe kwinkqubo yangaphambili yokuhlanganisa.I-Wafer okanye i-chip thinning, ukucola ngasemva, kunye ne-chip bonding ngawo onke amanyathelo anokukhokelela ekuhlumeni kweentanda.
Itshiphu eqhekekileyo, engaphumeleliyo ngoomatshini ayithethi ukuba ikhokelele ekusilelekeni kombane.Nokuba ukugqabhuka kwetshiphu kuya kubangela ukusilela kombane ngoko nangoko kwesixhobo nako kuxhomekeke kwindlela yokukhula yokuqhekeka.Ngokomzekelo, ukuba i-crack ibonakala ngasemva kwe-chip, ayinakuchaphazela naziphi na izakhiwo ezibucayi.
Ngenxa yokuba ii-wafers zesilicon zibhityile kwaye zibhityile, ukupakishwa kwe-wafer-level kuchaphazeleka ngakumbi kukugqabhuka kwetshiphu.Ngoko ke, iiparamitha zenkqubo ezifana noxinzelelo lwe-clamping kunye noxinzelelo lwenguqu yokubumba kwinkqubo yokubumba yokudlulisa kufuneka ilawulwe ngokungqongqo ukukhusela ukuphuka kwe-chip.Iipakethe ezipakishwe nge-3D zithande ukuphuka ngenxa yenkqubo yokupakisha.Izinto zoyilo ezichaphazela ukuphuka kwe-chip kwiiphakheji ze-3D ziquka isakhiwo se-chip stack, ubukhulu be-substrate, umthamo wokubumba kunye nobukhulu bemikhono yokubumba, njl.
Ixesha lokuposa: Feb-15-2023