Isantya seNdibano
Umatshini we-Wave soldering waziwa ngokunyuka kwawo, ngakumbi xa kuthelekiswa ne-soldering manual.Le nkqubo ikhawulezayo inokuba luncedo olukhulu kwindawo yokuvelisa iPCB ephezulu.Kwelinye icala, isantya sendibano iyonke ye-reflow soldering inokucotha.Nangona kunjalo, oku kuxhomekeke kubunzima kunye nobukhulu bePCB, kunye namacandelo athengiswayo.
Ukuhambelana kwecandelo
Nangona umatshini wokuntywila wamaza unokusetyenziselwa zombini umngxuma kunye nezinto zokukhwela umphezulu, uhlala ufanelekile ngakumbi kwitekhnoloji yomngxuma.Oku kungenxa yobume benkqubo yokuthengiswa kwamaza, efuna ukuvezwa kwi-solder etyhidiweyo.Umatshini we-Reflow soldering usetyenziswa ngokuqhelekileyo kwi-teknoloji yokunyuka komhlaba njengoko usebenzisa indlela yokungaqhagamshelwa kwaye ilungele amacandelo amancinci kunye angcono kwi-SMT.
Umgangatho kunye nokuthembeka
Ngenxa yobume bokungaqhagamshelwa kwe-reflow soldering, ibonelela ngekhwalithi engcono ye-solder yezixhobo zokunyuka kwendawo.Oku kunceda ukunciphisa amathuba okuba nomonakalo wecandelo kunye nokudalwa kweebhulorho ze-solder.Ngokwahlukileyo, i-wave soldering ngamanye amaxesha inokudala iibhulorho ze-solder, ezinokuthi zikhokelela kwiisekethe ezimfutshane kunye neengxaki zombane ezinokwenzeka.Ukongeza, i-wave soldering isenokungasebenzi kakuhle kumacandelo epitch entle njengoko kunokuba ngumceli mngeni ukufikelela kwiziphumo ezichanekileyo zokuthengisa.
Iindleko zeendleko
Iindleko ze-wave kunye ne-reflow soldering systems zingahluka ngokuxhomekeke kwizinto ezininzi, kubandakanywa utyalo-mali lokuqala, ukugcinwa okuqhubekayo kunye neendleko zokusetyenziswa (i-solder, i-flux, njl.).Isixhobo sokuthengisa amaza siqhele ukuba nexabiso eliphantsi lotyalo-mali lokuqala, ngelixa izixhobo zokuphinda zibe nexabiso eliphezulu.Iindleko zokugcinwa kwazo zombini iinkqubo kufuneka ziqwalaselwe, kunye neenkqubo zokuphinda ziphinde zifune ukugcinwa rhoqo ngenxa yobunzima besixhobo.Ukhetho phakathi kwamaza kunye ne-reflow soldering kufuneka lusekelwe kuhlalutyo olunzulu lweendleko-inzuzo, ngokuqwalasela iimfuno ezithile zenkqubo yokuvelisa, iimfuno zevolumu kunye nohlobo lwamacandelo asetyenzisiweyo.
Iimpawu ze-NeoDen IN12C reflow oven
1. Inkqubo yokucoca i-welding eyakhiweyo, ukuhluzwa okusebenzayo kweegesi ezinobungozi, ukubonakala okuhle kunye nokukhuselwa kwendalo, ngakumbi ngokuhambelana nokusetyenziswa kwendawo ephezulu.
2. Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
3. Uyilo olulodwa lwemodyuli yokufudumeza, kunye nokulawula ubushushu obuchanekileyo, ukushisa okufanayoukuhanjiswa kwindawo yembuyekezo ye-thermal, ukusebenza okuphezulu kwembuyekezo ye-thermal, ukusetyenziswa kwamandla aphantsi kunye nezinye iimpawu.
4. Ukusetyenziswa kwe-high-performance aluminium alloy heat plate plate esikhundleni se-tube yokufudumeza, kokubili ukonga amandla kunye nokusebenza kakuhle, xa kuthelekiswa nama-ovens afana ne-reflow kwimarike, ukuphambuka kobushushu becala kuncitshiswe kakhulu.
5. Ulawulo oluhlakaniphile, inzwa yobushushu obuphezulu, ukuqina kobushushu obusebenzayo.
6. Ubukrelekrele, buhlanganiswe ne-PID yokulawula i-algorithm yenkqubo yokulawula ehlakaniphile, elula ukuyisebenzisa, enamandla.
7. Ubuchwephesha, obukhethekileyo bebhodi ye-4-indlela yokuhlola ubushushu bomphezulu webhodi, ukwenzela ukuba umsebenzi ochanekileyo ngexesha elifanelekileyo kunye nedatha yempendulo ebanzi, nakwiimveliso ze-elektroniki ezinzima zinokusebenza.
Ixesha lokuposa: May-25-2023