1. BGA(uluhlu lwegridi yebhola)
Uboniso lomfowunelwa webhola, enye yeepakethe zohlobo lokunyuka komphezulu.Amaqhuma ebhola enziwa ngasemva kwi-substrate eprintiweyo yokutshintsha izikhonkwane ngokuhambelana nendlela yokubonisa, kwaye i-chip ye-LSI ihlanganiswe ngaphambili kwi-substrate eprintiweyo kwaye itywinwe nge-resin etyhidiweyo okanye indlela yokubumba.Oku kukwabizwa ngokuba yi-bump display carrier (PAC).Izikhonkwane zingadlula i-200 kwaye luhlobo lwepakethe esetyenziselwa ii-multi-pin LSIs.Umzimba wepakethi unokwenziwa umncinci kune-QFP (i-quad side pin flat package).Ngokomzekelo, i-360-pin ye-BGA enamaziko e-pin ye-1.5mm yi-square ye-31mm kuphela, ngelixa i-304-pin QFP kunye namaziko e-pin ye-0.5mm yi-40mm square.Kwaye i-BGA ayinakukhathazeka malunga ne-pin deformation njenge-QFP.Iphakheji yaphuhliswa yi-Motorola e-United States kwaye yamkelwa okokuqala kwizixhobo ezinjengeefowuni eziphathwayo, kwaye kusenokwenzeka ukuba idume e-United States kwiikhompyuter zobuqu kwixesha elizayo.Ekuqaleni, isikhonkwane (iqhuma) umgama osembindini we-BGA yi-1.5mm kwaye inani lezikhonkwane yi-225. I-500-pin BGA iyaphuhliswa ngabanye abavelisi be-LSI.Ingxaki ye-BGA kukuhlolwa kwenkangeleko emva kokuhamba kwakhona.
2. BQFP(quad flat package enebumper)
Iphakheji ye-quad flat ene-bumper, enye yeephakheji ze-QFP, ine-bumps (i-bumper) kwiimbombo ezine zomzimba wepakethe ukukhusela ukugoba kwezikhonkwane ngexesha lokuthutha.Abavelisi be-semiconductor base-US basebenzisa le phakheji ngokukodwa kwiisekethe ezifana ne-microprocessors kunye ne-ASICs.Umgama weziko lePin ngu-0.635mm, inani lezikhonkwane ukusuka kwi-84 ukuya kwi-196 okanye kunjalo.
3. I-Bump solder PGA(i-butt joint pin grid array) Alias of surface mount PGA.
4. C-(i-ceramic)
Uphawu lwephakheji yeceramic.Umzekelo, i-CDIP ithetha i-ceramic DIP, ehlala isetyenziswa ekusebenzeni.
5. Cerdip
I-Ceramic double in-line package etywinwe ngeglasi, esetyenziselwa i-ECL RAM, i-DSP (i-Digital Signal Processor) kunye nezinye iisekethe.I-Cerdip enefestile yeglasi isetyenziselwa uhlobo lwe-UV erasure EPROM kunye neesekethe ze-microcomputer ezine-EPROM ngaphakathi.Umgama weziko le-pin yi-2.54mm kwaye inani lezikhonkwane lisuka kwi-8 ukuya kwi-42.
6. I-Cerquad
Enye yeepakethi zokunyuka komphezulu, i-ceramic QFP ene-underseal, isetyenziselwa ukupakisha iisekethe ze-LSI ezinje nge-DSPs.I-Cerquad enefestile isetyenziselwa ukupakisha iisekethe ze-EPROM.Ukutshatyalaliswa kobushushu kungcono kune-QFPs zeplastiki, ukuvumela i-1.5 ukuya kwi-2W yamandla phantsi kweemeko zokupholisa umoya wendalo.Nangona kunjalo, ixabiso lephakheji li-3 ukuya kumaxesha e-5 aphezulu kuneeplastiki ze-QFPs.Umgama weziko le-pin yi-1.27mm, 0.8mm, 0.65mm, 0.5mm, 0.4mm, njl. Inani lezikhonkwane livela kwi-32 ukuya kwi-368.
7. I-CLCC (isithwali setshiphu ekhokele ngeceramic)
I-Ceramic lead chip carrier enezikhonkwane, enye yeepakethe zokunyuka komhlaba, izikhonkwane zikhokelwa kumacala amane epakethe, ngokuma kwe-ding.Ngefestile yepakethe ye-UV yohlobo lokucima i-EPROM kunye nesekethe ye-microcomputer nge-EPROM, njl. Le phakheji ikwabizwa ngokuba yi-QFJ, QFJ-G.
8. COB (itshiphu ebhodini)
I-chip kwipakethe yebhodi yenye yetekhnoloji yokufakwa kwe-chip engenanto, i-semiconductor chip ifakwe kwibhodi yesekethe eprintiweyo, uqhagamshelo lombane phakathi kwe-chip kunye ne-substrate lwenziwa ngendlela yokuthunga okukhokelela, uqhagamshelwano lombane phakathi kwe-chip kunye ne-substrate lufezekiswa ngendlela yokuthunga okukhokelayo. , kwaye igqunywe nge-resin ukuqinisekisa ukuthembeka.Nangona i-COB iyeyona ilula itekhnoloji yokunyusela itshiphu, kodwa ukuxinana kwepakethi yayo ingaphantsi kakhulu kwi-TAB kunye netekhnoloji yokuthengisela itshiphu eguqulweyo.
9. DFP(iphakheji eflethi ezimbini)
Iphakeji ye-flat ye-pin yecala elibini.Ligama le-SOP.
10. I-DIC(iphakheji ye-ceramic ephindwe kabini)
I-Ceramic DIP (eneglasi yokutywina) isiteketiso.
11. DIL(ezimbini emgceni)
DIP ilias (jonga iDIP).Abavelisi besemiconductor baseYurophu basebenzisa kakhulu eli gama.
12. I-DIP(i-package e-in-line ephindwe kabini)
Ipakethe ephindwe kabini emgceni.Enye yephakeji ye-cartridge, izikhonkwane zikhokelwa kumacala omabini epakethe, impahla yephakheji ineentlobo ezimbini zeplastiki kunye ne-ceramic.I-DIP iyona phakheji ye-cartridge ethandwa kakhulu, izicelo zibandakanya i-logic eqhelekileyo ye-IC, imemori ye-LSI, i-microcomputer circuits, njl.ezinye iipakethe ezinobubanzi be-7.52mm kunye ne-10.16mm zibizwa ngokuba yi-skinny DIP kunye ne-DIP encinci ngokulandelelanayo.Ukongeza, ii-ceramic DIPs ezitywinwe ngeglasi enyibilikayo ephantsi zikwabizwa ngokuba yi-cerdip (jonga i-cerdip).
13. I-DSO(i-lint encinci kabini)
Isibizo se-SOP (jonga i-SOP).Abanye abavelisi besemiconductor basebenzisa eli gama.
14. I-DICP(iphakheji yomphathi weteyiphu ezimbini)
Enye ye-TCP (i-tape carrier package).Izikhonkwane zenziwe kwi-tape ye-insulating kwaye zikhokelela kumacala omabini epakethe.Ngenxa yokusetyenziswa kwe-TAB (i-automatic tape carrier soldering) iteknoloji, iprofayili yephakheji incinci kakhulu.Iqhele ukusetyenziswa kwi-LCD umqhubi we-LSIs, kodwa uninzi lwazo lwenziwe ngokwesiko.Ukongeza, iphakheji yencwadana ye-LSI yememori engqindilili eyi-0.5mm iphantsi kophuhliso.EJapan, i-DICP ibizwa ngokuba yi-DTP ngokwe-EIAJ (Amashishini e-Electronic Industries kunye noomatshini baseJapan).
15. I-DIP(iphakheji ye-tape ephethe iteyiphu ezimbini)
Kuyafana nangasentla.Igama le-DTCP kumgangatho we-EIAJ.
16. FP(iphakheji ecaba)
Iphakheji flat.Isibizo se-QFP okanye i-SOP (jonga i-QFP kunye ne-SOP).Abanye abavelisi besemiconductor basebenzisa eli gama.
17. flip-chip
Flip-chip.Enye yeetekhnoloji zokupakisha ezingenanto apho i-metal bump yenziwe kwindawo ye-electrode ye-chip ye-LSI kwaye emva koko i-metal bump i-pressure-soldered kwindawo ye-electrode kwi-substrate eprintiweyo.Indawo ehlala kwiphakheji ngokusisiseko iyafana nobukhulu be-chip.Yeyona incinci kwaye incinci kuzo zonke iitekhnoloji zokupakisha.Nangona kunjalo, ukuba i-coefficient yokwandiswa kwe-thermal ye-substrate ihluke kwi-chip ye-LSI, inokusabela kwi-joint kwaye ngaloo ndlela ichaphazele ukuthembeka koqhagamshelwano.Ngoko ke, kuyimfuneko ukuqinisa i-chip ye-LSI nge-resin kwaye usebenzise i-substrate material malunga ne-coefficient efanayo yokwandiswa kwe-thermal.
18. FQFP(iphakeji entle ye-quad flat)
I-QFP enomgama omncinci weziko le-pin, ngokuqhelekileyo ngaphantsi kwe-0.65mm (jonga i-QFP).Abanye abavelisi bee-conductor basebenzisa eli gama.
19. I-CPAC(i-globe top pad array carrier)
I-Motorola's alias ye-BGA.
20. CQFP(quad fiat package nge ring guard)
Iphakheji ye-quad ye-fiat kunye nomsesane wokulinda.Enye yee-QFP zeplastiki, izikhonkwane zigqunywe ngendandatho ekhuselayo ye-resin ukukhusela ukugoba kunye nokuguqulwa.Ngaphambi kokudibanisa i-LSI kwi-substrate eprintiweyo, izikhonkwane zinqunywe kwindandatho yokulinda kwaye zenziwe kwiphiko le-seagull shape (L-shape).Le phakheji ikwimveliso enkulu eMotorola, eMelika.Umgama ophakathi kwephini ngu-0.5mm, kwaye inani eliphezulu lezikhonkwane li malunga ne-208.
21. H-(ngesinki yobushushu)
Ibonisa uphawu kunye ne-heat sink.Umzekelo, i-HSOP ibonisa i-SOP ene-heat sink.
22. isikhonkwane soluhlu lwegridi (uhlobo lokunyuka komphezulu)
I-surface Mount type ye-PGA idla ngokuba yipakethe yohlobo lwe-cartridge ene-pin ubude malunga ne-3.4mm, kunye nohlobo oluphezulu lwe-PGA lunomboniso wezikhonkwane kwicala elingezantsi lepakethe kunye nobude ukusuka kwi-1.5mm ukuya kwi-2.0mm.Ekubeni umgama weziko le-pin kuphela yi-1.27mm, eyisiqingatha sobukhulu be-cartridge yohlobo lwe-PGA, umzimba wepakethi unokwenziwa ube mncinci, kwaye inani lezikhonkwane lingaphezulu kwelo lohlobo lwekhatriji (250-528), ngoko ke yimpahla esetyenziselwa umgaqo-nkqubo omkhulu we-LSI.I-substrates yepakethe zi-substrates ze-ceramic ze-multilayer kunye ne-glass epoxy resin substrates yokushicilela.Ukuveliswa kweepakethi kunye ne-multilayer ceramic substrates iye yasebenza.
23. I-JLCC (i-J-lead chip carrier)
Umthuthi wetshiphu emile okwe-J.Ibhekisa kwi-CLCC enefestile kunye neceramic efakwe ifestile ye-QFJ alias (bona i-CLCC kunye ne-QFJ).Abanye babenzi be-semi-conductor basebenzisa igama.
24. I-LCC (Isiphathi setshiphu esingenantambo)
Umthwali wetshiphu ongenaphini.Ibhekisela kwiphakheji yokunyuka kwendawo apho kuphela i-electrodes kumacala amane e-substrate ye-ceramic edibeneyo ngaphandle kwezikhonkwane.I-high-speed kunye ne-high-frequency IC package, eyaziwa ngokuba yi-ceramic QFN okanye i-QFN-C.
25. I-LGA (uluhlu lwegridi yomhlaba)
Qhagamshelana nephakheji yokubonisa.Yiphakheji enoluhlu lwabafowunelwa kwicala elingezantsi.Xa ihlanganiswe, inokufakwa kwi-socket.Kukho abafowunelwa abangama-227 (umgama wombindi oyi-1.27mm) kunye nabafowunelwa abangama-447 (umgama osembindini oyi-2.54mm) we-LGAs ze-ceramic, ezisetyenziswa kwi-high-speed logic logic iisekethe ze-LSI.Ii-LGAs ziyakwazi ukufumana igalelo elingaphezulu kunye nezikhonkwane zemveliso kwiphakheji encinci kune-QFPs.Ukongeza, ngenxa yokuchasana okuphantsi kwezikhokelo, ifanelekile kwi-LSI yesantya esiphezulu.Nangona kunjalo, ngenxa yobunzima kunye neendleko eziphezulu zokwenza iziseko, azisetyenziswanga kakhulu ngoku.Imfuno yabo kulindeleke ukuba inyuke kwixesha elizayo.
26. LOC(lead kwitshiphu)
Itekhnoloji yokupakisha ye-LSI sisakhiwo apho isiphelo sangaphambili sesakhelo esikhokelayo singaphezulu kwe-chip kunye ne-bumpy solder joint eyenziwa kufuphi nombindi we-chip, kwaye uqhagamshelo lombane lwenziwa ngokuthunga izikhokelo kunye.Xa kuthelekiswa nesakhiwo sokuqala apho isakhelo esikhokelayo sibekwe kufuphi necala le-chip, i-chip inokuhlaliswa kwipakethi yobukhulu obufanayo kunye nobubanzi obumalunga ne-1mm.
27. I-LQFP (iprofayili ephantsi ye-quad flat package)
I-QFP encinci ibhekisa kwii-QFP ezinobunzima bomzimba we-1.4mm, kwaye ligama elisetyenziswe yi-Japan Electronics Machinery Industry Association ngokuhambelana nefom ye-QFP entsha yefom yenkcazo.
28. L-QUAD
Enye ye-ceramic QFPs.I-Aluminium nitride isetyenziselwa i-substrate yepakethe, kwaye i-thermal conductivity yesiseko i-7 ukuya kumaxesha angama-8 aphezulu kune-aluminium oxide, enikezela ukuchithwa kokushisa okungcono.Isakhelo sepakethe senziwe nge-aluminium oxide, kwaye i-chip itywinwe ngendlela yokubumba, ngaloo ndlela icinezela iindleko.Yiphakheji eyenzelwe i-logic LSI kwaye inokwamkela amandla e-W3 phantsi kweemeko zokupholisa umoya zendalo.I-208-pin (0.5mm center pitch) kunye ne-160-pin (0.65mm center pitch) iipakethe ze-LSI logic ziye zaphuhliswa kwaye zafakwa kwimveliso enkulu ngo-Oktobha ka-1993.
29. MCM(imodyuli yeetshiphu ezininzi)
Imodyuli ye-chip ezininzi.Iphakheji apho ii-chips ezininzi ze-semiconductor ezingenanto zihlanganiswe kwi-substrate ye-wiring.Ngokutsho kwe-substrate material, inokwahlulwa ibe ngamacandelo amathathu, i-MCM-L, i-MCM-C kunye ne-MCM-D.I-MCM-L yindibano esebenzisa i-glass epoxy resin multilayer eprintiweyo substrate eqhelekileyo.Ayixinana kwaye ayibizi mali ininzi.I-MCM-C licandelo elisebenzisa itekhnoloji yefilimu eshinyeneyo ukwenza iingcingo zombane ezininzi nge-ceramic (i-alumina okanye i-glass-ceramic) njenge-substrate, efana ne-ICs eshinyeneyo ye-hybridi yefilimu kusetyenziswa i-substrates ze-ceramic ze-multilayer.Akukho mahluko ubalulekileyo phakathi kwezi zimbini.Uxinaniso lweengcingo luphezulu kunolo lwe-MCM-L.
I-MCM-D licandelo elisebenzisa itekhnoloji yefilimu encinci ukwenza i-multilayer wiring nge-ceramic (i-alumina okanye i-aluminium nitride) okanye i-Si kunye ne-Al njenge-substrates.Ubuninzi be-wiring buphezulu phakathi kweentlobo ezintathu zamacandelo, kodwa ixabiso liphezulu.
30. MFP(iphakheji encinci yeflethi)
Iphakheji encinci yeflethi.I-alias yeplastiki ye-SOP okanye i-SSO (jonga i-SOP kunye ne-SSO).Igama elisetyenziswe ngabanye abavelisi be-semiconductor.
31. MQFP(metric quad flat package)
Ukuhlelwa kwee-QFPs ngokwe-JEDEC (iKomiti yeZixhobo ze-Electronic) ezidibeneyo.Ibhekisela kwi-QFP eqhelekileyo kunye nomgama weziko le-pin ye-0.65mm kunye nobukhulu bomzimba we-3.8mm ukuya kwi-2.0mm (jonga i-QFP).
32. MQUAD(intsimbi yesine)
Iphakheji ye-QFP eyenziwe ngu-Olin, eU.SA.Isiseko seplate kunye nesigqubuthelo senziwe nge-aluminium kwaye sitywinwe nge-adhesive.Inokuvumela i-2.5W ~ 2.8W yamandla phantsi kwemeko yendalo yokupholisa umoya.U-Nippon Shinko Kogyo unikwe ilayisenisi yokuqala ukuvelisa ngo-1993.
33. MSP(iphakheji encinci yesikwere)
I-QFI alias (jonga i-QFI), kwinqanaba lokuqala lophuhliso, elibizwa ngokuba yi-MSP, i-QFI ligama elichazwe yi-Japan Electronics Machinery Industry Association.
34. I-OPMAC(ngaphezulu komthuthi wephedi ebunjiweyo)
I-resin ebunjiweyo etywina i-bump ebonisa umphathi.Igama elisetyenziswe yi-Motorola ukutywinwa kwe-resin ebunjiweyo kwi-BGA (bona i-BGA).
35. P-(iplastiki)
Ibonisa ubhalo lwephakheji yeplastiki.Umzekelo, i-PDIP ithetha iplastiki ye-DIP.
36. PAC(ipad uluhlu oluthwala)
I-Bump display carrier, i-alias ye-BGA (bona i-BGA).
37. I-PCLP(ibhodi yesekethe eprintiweyo iphakheji engena lead)
Ibhodi yesekethe eprintiweyo iphakheji engena leadless.Umgama ophakathi kwePin unemilinganiselo emibini: 0.55mm kunye ne-0.4mm.Okwangoku kwinqanaba lophuhliso.
38. PFPF(iphakheji yeplastiki eflethi)
Iphakheji yeplastiki eflethi.Isibizo seplastiki ye-QFP (jonga i-QFP).Abanye abavelisi beLSI basebenzisa igama.
39. PGA(pin igrid uluhlu)
Ipakethe yoluhlu lwePin.Enye yeepakethi zohlobo lwe-cartridge apho izikhonkwane ezithe nkqo kwicala elingezantsi zicwangciswe ngendlela yokubonisa.Ngokusisiseko, ii-substrates ze-ceramic ezininzi zisetyenziselwa i-substrate yepakethe.Kwiimeko apho igama le-material lingaboniswanga ngokuthe ngqo, uninzi zii-PGA ze-ceramic, ezisetyenziselwa i-speed high-speed, i-logic enkulu yeesekethe ze-LSI.Iindleko ziphezulu.Amaziko e-Pin aqhelekile nge-2.54mm kwaye amanani e-pin avela kwi-64 ukuya malunga ne-447. Ukunciphisa iindleko, i-substrate yepakethe inokutshintshwa yi-glass epoxy eprintiweyo substrate.IPlastiki PG A enama-64 ukuya kuma-256 izikhonkwane nayo iyafumaneka.Kukwakho nepini emfutshane yohlobo lwe-PGA (i-touch-solder PGA) kunye nomgama weziko le-pin oyi-1.27mm.(Jonga uhlobo lokunyuswa komphezulu wePGA).
40. Umva wehagu
Iphakheji epakishwe.Iphakheji ye-ceramic ene-socket, efana nesimo se-DIP, i-QFP, okanye i-QFN.Isetyenziselwa ukuphuhliswa kwezixhobo ezinee-microcomputers ukuvavanya imisebenzi yokuqinisekisa inkqubo.Umzekelo, i-EPROM ifakwe kwisokethi yokulungisa ingxaki.Le phakheji ngokusisiseko imveliso yesiko kwaye ayifumaneki ngokubanzi kwimarike.
Ixesha lokuposa: May-27-2022