41. I-PLCC (isithwali setshiphu yeplastiki ekhokelayo)
Isithwali sePlastiki setshiphu esinesikhokelo.Enye yeepakethe zentaba.Izikhonkwane ziphuma kumacala amane epakethe, zifana ne-ding, kwaye ziyimveliso yeplastiki.Yamkelwa okokuqala yi-Texas Instruments e-United States ye-64k-bit ye-DRAM kunye ne-256kDRAM, kwaye ngoku isetyenziswa ngokubanzi kwiisekethe ezifana nee-logic LSIs kunye ne-DLDs (okanye izixhobo ze-logic).Umgama weziko le-pin yi-1.27mm kunye nenani lezikhonkwane ukusuka kwi-18 ukuya kwi-84. Izikhonkwane ezinobumba be-J azinakuguqulwa kwaye zilula ukuphatha kune-QFPs, kodwa ukuhlolwa kwe-cosmetic emva kwe-soldering kunzima kakhulu.I-PLCC iyafana ne-LCC (ekwaziwa ngokuba yi-QFN).Ngaphambili, umahluko kuphela phakathi kwezi zibini yayikukuba yangaphambili yenziwe ngeplastiki kwaye le yokugqibela yenziwe ngeceramic.Nangona kunjalo, ngoku kukho iipakethi ezibunjwe nge-J ezenziwe nge-ceramic kunye neepakethi ezingenazikhonkwane ezenziwe ngeplastiki (eziphawulwe njengeplastiki ye-LCC, i-PC LP, i-P-LCC, njl.), ezingaqondakaliyo.
42. I-P-LCC (i-plastic teadless chip carrier) (i-plastic leadedchip currier)
Ngamanye amaxesha ligama leplastiki le-QFJ, ngamanye amaxesha lisisibizo se-QFN (iplastiki ye-LCC) (jonga i-QFJ kunye ne-QFN).Abanye abavelisi be-LSI basebenzisa i-PLCC yephakheji ehamba phambili kunye ne-P-LCC yephakheji engenamkhokheli ukubonisa umahluko.
43. QFH (quad flat high package)
Ipakethe ecaba enequad enezikhonkwane ezishinyeneyo.Uhlobo lweplastiki ye-QFP apho umzimba we-QFP wenziwa unzima ukukhusela ukuphuka kwe-package body (jonga i-QFP).Igama elisetyenziswe ngabanye abavelisi be-semiconductor.
44. I-QFI (i-quad flat I-lead packgac)
Quad flat Iphakheji I-ekhokelayo.Enye yeepakethi zokunyuka komphezulu.Izikhonkwane zikhokelwa ukusuka kumacala amane epakethe kwindlela ye-I-shaped ezantsi.Ikwabizwa ngokuba yi-MSP (jonga i-MSP).Intaba i-touch-soldered kwi-substrate eprintiweyo.Ekubeni izikhonkwane zingabonakali, unyawo olunyukayo luncinci kune-QFP.
45. QFJ (quad flat J-lead package)
Quad flat iphakheji J-lead.Enye yeepakethi zokunyuka komphezulu.Izikhonkwane zikhokelwa kumacala amane epakethe kwi-J-shape ezantsi.Eli ligama elichazwe yiJapan Electrical and Mechanical Manufacturers Association.Umgama ophakathi kwephini yi-1.27mm.
Kukho iintlobo ezimbini zezinto eziphathekayo: iplastiki kunye ne-ceramic.Iiplastiki ze-QFJs zibizwa ngokuba yi-PLCCs (jonga i-PLCC) kwaye zisetyenziswa kwiisekethe ezifana ne-microcomputers, i-gate displays, i-DRAMs, i-ASSPs, i-OTPs, njl. I-Pin counts isuka kwi-18 ukuya kwi-84.
Ii-QFJ zeCeramic zikwabizwa ngokuba yi-CLCC, JLCC (jonga i-CLCC).Iiphakheji zefestile zisetyenziselwa ii-EPROM zokucima i-UV kunye neesekethe ze-microcomputer chip ezine-EPROMs.Amanani ePin aqala kuma-32 ukuya kuma-84.
46. QFN (quad flat non-leaded package)
Quad flat iphakheji non-leaded.Enye yeepakethi zokunyuka komphezulu.Kule mihla, ikakhulu ibizwa ngokuba yi-LCC, kwaye i-QFN ligama elichazwe yi-Japan Electrical and Mechanical Manufacturers Association.Iphakheji ixhotywe ngoqhagamshelwano lwe-electrode kumacala amane, kwaye ngenxa yokuba ingenayo izikhonkwane, indawo yokunyuka incinci kune-QFP kwaye ukuphakama kungaphantsi kwe-QFP.Nangona kunjalo, xa uxinzelelo lwenziwa phakathi kwe-substrate eprintiweyo kunye nephakheji, ayikwazi ukukhululeka kwi-electrode contacts.Ngoko ke, kunzima ukwenza ezininzi zoqhagamshelwano ze-electrode njengezikhonkwane ze-QFP, eziqhelekileyo ngokubanzi ukusuka kwi-14 ukuya kwi-100. Kukho iintlobo ezimbini zezinto eziphathekayo: i-ceramic kunye neplastiki.Amaziko oqhagamshelwano lwe-electrode ahlukene nge-1.27 mm.
I-Plastiki QFN yiphakheji yexabiso eliphantsi kunye nesiseko se-substrate yeglasi eprintiweyo.Ukongeza kwi-1.27mm, kukho kwakhona i-0.65mm kunye ne-0.5mm ye-electrode imigama yeziko loqhagamshelwano.Le phakheji ikwabizwa ngokuba yi-plastiki LCC, PCLC, P-LCC, njl.
47. QFP (quad flat package)
Quad flat package.Enye yeepakethi zokunyuka komphezulu, izikhonkwane zikhokelwa kumacala amane kwiphiko le-seagull (L) imilo.Kukho iintlobo ezintathu ze-substrates: i-ceramic, isinyithi kunye neplastiki.Ngokumalunga nobuninzi, iipakethi zeplastiki zenza uninzi.Ii-QFP zePlastiki zezona zixhaphakileyo i-multi-pin LSI iphakheji xa izinto eziphathekayo zingaboniswanga ngokuthe ngqo.Ayisetyenziswanga kuphela kwiisekethe ze-digital logic LSI ezifana ne-microprocessors kunye neziboniso zesango, kodwa nakwiisekethe ze-analog LSI ezifana nokusetyenzwa kwesignali ye-VTR kunye nokulungiswa kwesignali ye-audio.Inani eliphezulu lezikhonkwane kwi-pitch ye-0.65mm yeziko yi-304.
48. QFP (FP) (QFP ibala elihle)
I-QFP (i-QFP fine pitch) ligama elichazwe kumgangatho we-JEM.Ibhekisela kwii-QFP ezinomgama weziko le-pin ye-0.55mm, 0.4mm, 0.3mm, njl. ngaphantsi kwe-0.65mm.
49. I-QIC (iphakheji ye-ceramic yomgca we-quad)
I-alias ye-ceramic QFP.Abanye abavelisi be-semiconductor basebenzisa igama (jonga i-QFP, iCerquad).
50. QIP (quad in-line ipakethe yeplastiki)
I-alias yeplastiki ye-QFP.Abanye abavelisi be-semiconductor basebenzisa igama (jonga i-QFP).
51. QTCP (quad tape carrier package)
Enye yeepakethi ze-TCP, apho izikhonkwane zenziwa kwi-tape yokukhusela kwaye ziholele ngaphandle kwamacala amane epakethe.Yiphakheji encinci esebenzisa iteknoloji ye-TAB.
52. QTP (quad tape carrier package)
Ipakethe ye-Quad tape ethwala.Igama elisetyenziselwa i-QTCP form factor esekwe yi-Japan Electrical and Mechanical Manufacturers Association ngo-Aprili 1993 (jonga i-TCP).
53, QUIL(quad emgceni)
Isibizo se-QUIP (bona i-QUIP).
54. QUIP (quad in-line package)
Ipakethe ye-Quad ekwi-line enemiqolo emine yezikhonkwane.Izikhonkwane zikhokelwa kumacala omabini epakethe kwaye ziyagxadazwa kwaye zigobe phantsi zibe yimiqolo emine enye kwenye.Umgama weziko le-pin yi-1.27mm, xa ufakwe kwi-substrate eprintiweyo, umgama weziko lokufakela uba yi-2.5mm, ngoko unokusetyenziswa kwiibhodi zeesekethe eziqhelekileyo eziprintiweyo.Yimpahla encinci kuneDIP eqhelekileyo.Ezi phakheji zisetyenziswa yi-NEC kwii-microcomputer chips kwiikhompyuter zedesktop kunye nezixhobo zasekhaya.Kukho iintlobo ezimbini zezinto eziphathekayo: i-ceramic kunye neplastiki.Inani leephini ngama-64.
55. SDIP (ucuthe kabini emgceni ipakethe)
Enye yeephakheji ze-cartridge, imilo iyafana ne-DIP, kodwa umgama weziko le-pin (1.778 mm) lincinci kune-DIP (2.54 mm), ngoko ke igama.Inani lezikhonkwane lisuka kwi-14 ukuya kwi-90, kwaye likwabizwa ngokuba yi-SH-DIP.Kukho iintlobo ezimbini zezinto eziphathekayo: i-ceramic kunye neplastiki.
56. SH-DIP (i-shrink-in-line package)
Ngokufanayo ne-SDIP, igama elisetyenziswa ngabanye abavelisi be-semiconductor.
57. SIL (enye emgceni)
Igama le-SIP (jonga i-SIP).Igama elithi SIL lisetyenziswa kakhulu ngabavelisi besemiconductor baseYurophu.
58. I-SIMM (imodyuli yememori enye ekwi-line)
Imodyuli enye yememori engaphakathi.Imodyuli yememori ene-electrode kufuphi necala elinye kuphela le-substrate eprintiweyo.Ngokuqhelekileyo ibhekisa kwilungu elifakwe kwisokethi.IiSIMM eziqhelekileyo zifumaneka nge-electrode ezingama-30 kumgama ophakathi kwe-2.54mm kunye ne-72 electrode kumgama ophakathi kwe-1.27mm.IiSIMM ezine-1 kunye ne-4 megabit DRAMs kwiiphakheji ze-SOJ kwelinye okanye kumacala omabini e-substrate eprintiweyo zisetyenziswa ngokubanzi kwiikhomputha zomntu, iindawo zokusebenza, kunye nezinye izixhobo.Ubuncinci i-30-40% yee-DRAMs zihlanganiswe kwii-SIMMs.
59. SIP (iphakheji enye yomgca)
Iphakheji yomgca omnye.Izikhonkwane zikhokelwa kwelinye icala lepakethe kwaye zihlelwe ngendlela echanekileyo.Xa uhlanganiswe kwi-substrate eprintiweyo, ipakethe ikwindawo esecaleni.Umgama wombindi we-pin uqhelekile ukuba yi-2.54mm kwaye inani lezikhonkwane lisuka kwi-2 ukuya kwi-23, ubukhulu becala kwiipakethe zesiko.Ubume bepakethe iyahluka.Ezinye iipakethe ezinemilo efanayo ne-ZIP zikwabizwa ngokuba yi-SIP.
60. I-SK-DIP (i-skinny dual in-line package)
Uhlobo lwe-DIP.Ibhekisela kwi-DIP emxinwa enobubanzi obuyi-7.62mm kunye nomgama weziko le-pin ye-2.54mm, kwaye idla ngokubizwa ngokuba yi-DIP (jonga i-DIP).
61. I-SL-DIP (iphakheji encinci ye-dual in-line)
Uhlobo lwe-DIP.I-DIP emxinwa kunye nobubanzi be-10.16mm kunye nomgama we-pin centre ye-2.54mm, kwaye idla ngokubizwa ngokuba yi-DIP.
62. SMD (izixhobo zokubeka umphezulu)
Izixhobo zokukhwela ngaphezulu.Ngamanye amaxesha, abanye abavelisi be-semiconductor bahlela i-SOP njenge-SMD (jonga i-SOP).
63. SO (umzobo omncinci)
Igama le-SOP.Esi sibizo sisetyenziswa ngabavelisi abaninzi be-semiconductor kwihlabathi jikelele.(Jonga i-SOP).
64. I-SOI (iphakheji encinci ye-I-lead)
I-pin emile okwe-pin encinci ye-out-line package.Enye yeepakethi zokunyuka komhlaba.Izikhonkwane zikhokelwa phantsi ukusuka kumacala omabini epakethe kwi-I-shape kunye nomgama ophakathi kwe-1.27mm, kwaye indawo yokunyuka incinci kune-SOP.Inani lezikhonkwane 26.
65. I-SOIC (isekethe edibeneyo yomgca omncinci)
Igama le-SOP (jonga i-SOP).Uninzi lwabavelisi be-semiconductor bangaphandle baye bamkela eli gama.
66. I-SOJ (iPhakheji encinci ye-J-Leaded)
Ipakethe yolwandlalo oluncinci olumilise uJ.Enye yeepakethe zentaba.Izikhonkwane ezivela kumacala omabini epakethe zikhokelela ezantsi kwi-J-shaped, ebizwa kanjalo.Izixhobo ze-DRAM kwiiphakheji ze-SO J zidityaniswa kakhulu kwii-SIMMs.Umgama weziko le-pin yi-1.27mm kunye nenani lezikhonkwane ukusuka kwi-20 ukuya kwi-40 (jonga i-SIMM).
67. I-SQL (Ipakethe ekhokelwa nguL eNcinane yangaphandle)
Ngokomgangatho we-JEDEC (iBhunga leSixhobo soBunjineli esiDibeneyo soMbane) wegama elamkelweyo le-SOP (jonga i-SOP).
68. SONF (Umgca omncinci ongaphandle ongeyo-Fin)
I-SOP ngaphandle kwe-sink yobushushu, ifana ne-SOP yesiqhelo.Uphawu lwe-NF (non-fin) longezwe ngabom ukubonisa umahluko kumandla e-IC iipakethi ngaphandle kwe-heat sink.Igama elisetyenziswe ngabanye abavelisi be-semiconductor (jonga i-SOP).
69. I-SOF (iphakheji encinci ye-Out-line)
Ipakethe yolwandlalo oluncinci.Enye yeepakethe ze-surface mount, izikhonkwane ziphuma kumacala omabini epakethe ngendlela yamaphiko e-seagull (i-L-shaped).Kukho iintlobo ezimbini zezinto eziphathekayo: iplastiki kunye ne-ceramic.Ikwabizwa ngokuba yi-SOL kunye ne-DFP.
I-SOP ayisetyenziswanga kwimemori ye-LSI kuphela, kodwa nakwi-ASSP kunye nezinye iisekethe ezingekho nkulu kakhulu.I-SOP iyona nto idume kakhulu kwi-package ye-surface iphakheji kwintsimi apho i-input and output terminals ayidluli kwi-10 ukuya kwi-40. Umgama weziko le-pin yi-1.27mm, kunye nenani lezikhonkwane ukusuka kwi-8 ukuya kwi-44.
Ukongezelela, ii-SOP ezinomgama weziko le-pin ngaphantsi kwe-1.27mm zikwabizwa ngokuba yi-SSO;Ii-SOP ezinobude bendibano obungaphantsi kwe-1.27mm zikwabizwa ngokuba zii-TSOPs (jonga i-SSOP, TSOP).Kukwakho neSOP enesinki yobushushu.
70. I-SOW (Ipakethe ye-Outline encinci (i-Wide-Jype)
Ixesha lokuposa: May-30-2022