Uhlalutyo lomsebenzi wezixhobo ezahlukeneyo zokuhlola inkangeleko ye-SMT AOI

a) : Isetyenziselwa ukulinganisa umatshini wokuhlola umgangatho wokushicilela we-solder wokushicilela umgangatho we-SPI emva komatshini wokushicilela: Ukuhlolwa kwe-SPI kwenziwa emva kokuprintwa kwe-solder paste, kunye neziphene kwinkqubo yokushicilela inokufumaneka, ngaloo ndlela kuncitshiswa iziphene ze-solder ezibangelwa yi-solder ephosakeleyo. ukuprinta ubuncinci.Iziphene zokuprinta eziqhelekileyo ziquka ezi ngongoma zilandelayo: i-solder eyaneleyo okanye egqithisileyo kwiipads;printing offset;iibhulorho zetin phakathi kweepads;ubukhulu kunye nomthamo we-solder eprintiweyo.Ngeli nqanaba, kufuneka kubekho idatha yokubeka iliso yenkqubo enamandla (i-SPC), njenge-offset yokushicilela kunye nolwazi lwevolumu ye-solder, kunye nolwazi olusemgangathweni malunga ne-solder eprintiweyo nayo iya kuveliswa ukuhlalutya kunye nokusetyenziswa ngabasebenzi benkqubo yokuvelisa.Ngale ndlela, inkqubo iyaphuculwa, inkqubo iphuculwe, kwaye iindleko ziyancitshiswa.Olu hlobo lwezixhobo okwangoku lwahlulwe lwaba ziindidi ze-2D kunye ne-3D.I-2D ayikwazi ukulinganisa ubukhulu be-solder paste, kuphela imilo ye-solder paste.I-3D inokulinganisa zombini ubukhulu be-solder paste kunye nommandla we-solder paste, ukwenzela ukuba umthamo we-solder paste ingabalwa.Ngokuxutywa kwamacandelo amancinci, ubukhulu be-solder paste efunekayo kumacandelo afana ne-01005 yi-75um kuphela, ngelixa ubukhulu bamanye amacandelo amakhulu aqhelekileyo malunga ne-130um.Umshicileli ozenzekelayo onokuprinta ubuninzi bencama ye-solder eyahlukeneyo ivelile.Ngoko ke, kuphela i-3D SPI inokuhlangabezana neemfuno zolawulo lwenkqubo yokuncamathisela ye-solder yexesha elizayo.Ngoko ke luhlobo luni lweSPI esinokukhawulelana neemfuno zenkqubo kwixesha elizayo?Ikakhulu ezi mfuno:

1. Kufuneka ibe yi-3D.
2. Ukuhlolwa kwesantya esiphezulu, umlinganiselo wangoku we-laser SPI ubukhulu buchanekile, kodwa isantya asikwazi ukuhlangabezana ngokupheleleyo neemfuno zemveliso.
3. Ukwandiswa okuchanekileyo okanye okuhlengahlengiswayo (i-optical and digital magnification yiparameters ezibaluleke kakhulu, ezi parameters zinokumisela ukukwazi ukufumanisa okokugqibela kwesixhobo. Ukubona ngokuchanekileyo izixhobo ze-0201 kunye ne-01005, ukukhulisa i-optical kunye nedijithali kubaluleke kakhulu, kwaye kuyimfuneko ukuqinisekisa ukuba I-algorithm yokufumanisa enikezelwe kwi-software ye-AOI inesisombululo esaneleyo kunye nolwazi lomfanekiso).Nangona kunjalo, xa i-pixel yekhamera ilungisiwe, ukukhuliswa kuhambelana ngokungafaniyo ne-FOV, kwaye ubungakanani be-FOV buya kuchaphazela isantya somatshini.Kwibhodi enye, amacandelo amakhulu kunye amancinci akhona ngexesha elifanayo, ngoko ke kubalulekile ukukhetha isisombululo esifanelekileyo okanye isisombululo se-optical adjustable ngokobukhulu bamacandelo kwimveliso.
4. Umthombo wokukhanya okhethiweyo: ukusetyenziswa kwemithombo yokukhanya ecwangcisiweyo iya kuba yindlela ebalulekileyo yokuqinisekisa izinga eliphezulu lokufumanisa isiphene.
5. Ukuchaneka okuphezulu kunye nokuphindaphinda: I-miniaturization yamacandelo yenza ukuchaneka kunye nokuphindaphinda kwezixhobo ezisetyenziswa kwinkqubo yokuvelisa kubaluleke ngakumbi.
6. Izinga lokugweba kakubi kakhulu: Kuphela ngokulawula izinga lokugweba okungalunganga okunokuthi ukufumaneka, ukukhetha kunye nokusebenza kolwazi olulethwe ngumatshini kwinkqubo yokusetyenziswa ngokwenene.
7. Uhlalutyo lwenkqubo ye-SPC kunye nokwabelana ngolwazi lwesiphene kunye ne-AOI kwezinye iindawo: uhlalutyo lwenkqubo ye-SPC enamandla, injongo yokugqibela yokuhlola imbonakalo kukuphucula inkqubo, ukulungelelanisa inkqubo, ukufezekisa imeko efanelekileyo, kunye nokulawula iindleko zokuvelisa.

b) .I-AOI phambi kwesithando somlilo: Ngenxa ye-miniaturization yamacandelo, kunzima ukulungisa iziphene zecandelo le-0201 emva kwe-soldering, kwaye iziphene ze-01005 zamacandelo azikwazi ukulungiswa ngokusisiseko.Ngoko ke, i-AOI phambi kwesithando somlilo iya kuba yinto ebaluleke ngakumbi nangakumbi.I-AOI phambi kwesithando somlilo inokubona iziphene zenkqubo yokubeka ezifana nokungahambi kakuhle, iindawo ezingalunganga, iindawo ezingekhoyo, iindawo ezininzi, kunye ne-polarity reverse.Ngoko ke, i-AOI phambi kwesithando somlilo kufuneka ibe kwi-intanethi, kwaye izibonakaliso ezibaluleke kakhulu zihamba ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokuphindaphinda, kunye nokugwetywa okuphantsi.Kwangaxeshanye, inokwabelana ngolwazi lwedatha kunye nenkqubo yokutya, ukubona kuphela iindawo ezingalunganga zamacandelo e-refueling ngexesha le-refueling, ukunciphisa ingxelo engalunganga yenkqubo, kwaye iphinde idlulisele ulwazi lokutenxa lwamacandelo kwinkqubo yenkqubo ye-SMT ukuguqula. inkqubo yomatshini we-SMT ngoko nangoko .

c) I-AOI emva kwesithando somlilo: I-AOI emva kokuba iziko lihlulwe libe ziifom ezimbini: i-intanethi kunye ne-offline ngokwendlela yokukhwela.I-AOI emva kweziko ngumgcini-sango wokugqibela wemveliso, ngoko ke ngoku yeyona AOI isetyenziswa kakhulu.Kufuneka ibone iziphene zePCB, iziphene zecandelo kunye nazo zonke iziphene zenkqubo kuwo wonke umgca wemveliso.Kuphela imibala emithathu yokukhanya okuphezulu kwedome ye-LED umthombo wokukhanya onokuthi ubonise ngokupheleleyo imiphezulu eyahlukeneyo yokumanzisa i-solder ukubona ngcono iziphene zokuthengisela.Ngoko ke, kwixesha elizayo, kuphela yi-AOI yalo mthombo wokukhanya enendawo yophuhliso.Ngokuqinisekileyo, kwixesha elizayo, ukwenzela ukujongana neePCB ezahlukeneyo Umyalelo wemibala kunye ne-RGB yemibala emithathu nayo icwangciswa.Ibhetyebhetye ngakumbi.Ngoko ke, luhlobo luni lwe-AOI emva kweziko ezinokuhlangabezana neemfuno zophuhliso lwethu lwemveliso ye-SMT kwixesha elizayo?Yiyo i:

1. isantya esiphezulu.
2. Ukuchaneka okuphezulu kunye nokuphindaphinda okuphezulu.
3. Iikhamera zesisombululo esiphezulu okanye iikhamera eziguquguqukayo: ukuhlangabezana neemfuno zesantya kunye nokuchaneka ngexesha elinye.
4. Isigwebo esingafanelekanga esiphantsi kunye nesigwebo esiphosiweyo: Oku kufuneka kuphuculwe kwi-software, kwaye ukubonwa kweempawu ze-welding kunokubangela ukugwetywa kakubi kunye nesigwebo esiphosakeleyo.
5. I-AXI emva kwesithando somlilo: Iziphene ezinokuthi zihlolwe ziquka: i-solder joints, iibhulorho, i-tombstones, i-solder eyaneleyo, i-pores, i-solder elahlekileyo, i-IC yaphakamisa iinyawo, i-IC encinci ye-tin, njl. njenge-BGA, i-PLCC, i-CSP, njl. Sisongezo esilungileyo kukukhanya okubonakalayo kwe-AOI.