Uninzi lwefektri yokucubungula i-pcba iya kudibana nesiganeko esibi, amacandelo e-chip ye-SMT kwinkqubo yokuphakanyiswa kokuphela kwe-chip.Le meko yenzeke kumacandelo amancinci e-chip capacitive, ngakumbi i-0402 chip capacitors, i-chip resistors, le nto idla ngokubizwa ngokuba "yi-monolithic phenomenon".
Izizathu zokusekwa
(1) amacandelo kwiziphelo zozibini zexesha lokunyibilikisa intlama ye-solder ayidityaniswanga okanye ukuxinezeleka komphezulu kuyahluka, njengokushicilelwa okulambathayo kwe-solder paste (enye isiphelo inesiphene), incama bias, amacandelo solder ekupheleni ubukhulu yahlukile.Ngokuqhelekileyo hlala unamathela kwi-solder emva kokuba isiphelo sokunyibilika sitsaliwe.
(2) Uyilo lwePad: ubude bokufikelela kwiphedi linoluhlu olufanelekileyo, lufutshane kakhulu okanye lude kakhulu luthambekele kwinto yokuma kwesikhumbuzo.
3Kule meko, amacandelo aya lula ukuvuthelwa ngumoya oshushu ukuba kwenzeke isenzeko yokuma lesikhumbuzo.
(4) Ukusetwa kwegophe lobushushu: i-monoliths iyenzeka ngokubanzi ngeli xesha xa i-solder joint iqala ukunyibilika.Isantya sokunyuka kweqondo lokushisa kufuphi nendawo yokunyibilika kubaluleke kakhulu, ngokukhawuleza kungcono ukuphelisa i-monolith phenomenon.
(5) Esinye seziphelo ze-solder zecandelo i-oxidised okanye ingcolisekile kwaye ayikwazi ukumanziswa.Nika ingqalelo ngokukodwa kumacandelo anomaleko omnye wesilivere ekupheleni kwe-solder.
(6) I-pad ingcolile (nge-silkscreen, i-solder resist inki, ibambelele kwizinto zangaphandle, i-oxidised).
Ubume bokwenza:
Xa i-reflow soldering, ukushisa kusetyenziswe phezulu nangaphantsi kwecandelo le-chip ngexesha elifanayo.Ngokubanzi, ihlala i-pad eneyona ndawo inkulu eveziweyo efudumala kuqala kwiqondo lokushisa ngaphezu kwendawo yokunyibilika ye-solder paste.Ngale ndlela, isiphelo secandelo elithi kamva limanziswe yi-solder livame ukutsalwa yi-tension yomhlaba we-solder kwelinye icala.
Izisombululo:
(1) imiba yoyilo
Uyilo olufanelekileyo lwepadi - ubungakanani bokufikelela kufuneka bube nengqiqo, kangangoko kunokwenzeka ukuphepha ubude bokufikelela bubandakanya i-engile yangaphandle ye-pad (ethe tye) yokumanzisa engaphezu kwama-45 °.
(2) Indawo yokuvelisa
1. ngenkuthalo sula umnatha ukuqinisekisa ukuba solder Cola amanqaku imizobo ngokupheleleyo.
2. indawo yokubeka echanekileyo.
3. Sebenzisa i-non-eutectic solder paste kwaye unciphise izinga lokunyuka kweqondo lokushisa ngexesha lokuphinda udibanise (ukulawula phantsi kwe-2.2 ℃ / s).
4. Nciphisa ubukhulu bentlama ye-solder.
(3) Izinto ezifikayo
Lawula ngokungqongqo umgangatho wezinto ezingenayo ukuze uqinisekise ukuba indawo esebenzayo yamacandelo asetyenzisiweyo ilingana nobukhulu obufanayo kuzo zombini iziphelo (isiseko sokuvelisa ukunyanzeliswa komhlaba).
Iimpawu ze-NeoDen IN12C Reflow Oven
1. Inkqubo yokucoca i-welding eyakhiweyo, ukuhluzwa okusebenzayo kweegesi ezinobungozi, ukubonakala okuhle kunye nokukhuselwa kwendalo, ngakumbi ngokuhambelana nokusetyenziswa kwendawo ephezulu.
I-2.Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
3. Ubukrelekrele, buhlanganiswe ne-PID yokulawula i-algorithm yenkqubo yokulawula ehlakaniphile, elula ukuyisebenzisa, enamandla.
4. professional, unique 4-indlela ibhodi inkqubo esweni ubushushu umphezulu, ukuze umsebenzi wokwenene ngexesha kwaye data ingxelo ebanzi, nkqu iimveliso ezintsonkothileyo ze-elektroniki kunokuba ngempumelelo.
5. Ibhanti ye-mesh ye-B-uhlobo oluphuhliswe ngokwezifiso, ehlala ixesha elide kwaye ayinxibi.Ukusetyenziswa kwexesha elide akulula ukwenza i-deformation
6. Intle kwaye inomsebenzi we-alamu obomvu, ophuzi kunye nohlaza woyilo lwesalathisi.
Ixesha lokuposa: May-11-2023