Ukuhlangabezana neemfuno ze-thermal zesicelo, abaqulunqi kufuneka bathelekise iimpawu ze-thermal zeentlobo zephakheji ze-semiconductor ezahlukeneyo.Kweli nqaku, i-Nexperia ixoxa ngeendlela ezishushu zeepakethi zebhondi yocingo kunye neepakethe ze-chip bond ukwenzela ukuba abaqulunqi banokukhetha iphakheji efanelekileyo.
Iphunyelelwa njani i-Thermal Coduction kwi-Wire Bonded Devices
Isiseko sobushushu esiphambili kwisixhobo esibotshiweyo sisuka kwindawo yesalathiso sesiphambuka ukuya kumalungu e-solder kwibhodi yesekethe eprintiweyo (PCB), njengoko kubonisiwe kuMfanekiso 1. Ukulandela i-algorithm elula yokuqikelelwa komyalelo wokuqala, isiphumo samandla esibini. ishaneli yokusetyenziswa (eboniswe kumzobo) ayinanto kwisibalo sokumelana ne-thermal.
Iitshaneli ezishushu kwizixhobo ezibotshelelwe ngocingo
Iitshaneli zokuqhutywa kwe-thermal ezimbini kwisixhobo se-SMD
Umahluko phakathi kwepakethe ye-SMD kunye nepakethe ebotshelelwe ngocingo ngokwemigaqo yokuchitha ubushushu kukuba ubushushu obusuka kwindawo ekudityanwa kuyo isixhobo bunokuchithwa ngamajelo amabini ahlukeneyo, oko kukuthi, ngefreyimi ekhokelayo (njengakwimeko yeepakethe ezibotshelelwe ngocingo) kwaye ngesakhelo sekliphu.
Ukutshintshwa kobushushu kwiphakheji edibeneyo ye-chip
Inkcazo yokumelana ne-thermal ye-junction ukuya kwi-solder joint Rth (j-sp) inzima ngakumbi kubukho beendawo ezimbini zokubhekisela kwi-solder.Ezi ndawo zereferensi zinokuba namaqondo okushisa ahlukeneyo, okubangela ukuxhathisa kwe-thermal ibe yinethiwekhi ehambelanayo.
I-Nexperia isebenzisa indlela efanayo yokukhupha ixabiso le-Rth(j-sp) kuzo zombini izixhobo ezidityaniswe ngetshiphu kunye nezixhobo ezithengiswa ngocingo.Eli xabiso libonisa indlela ephambili ye-thermal ukusuka kwi-chip ukuya kwi-leadframe ukuya kumalungu e-solder, okwenza amaxabiso ezixhobo eziboshwe nge-chip zifane namaxabiso ezixhobo ezithengiswa ngocingo kwi-PCB efanayo.Nangona kunjalo, itshaneli yesibini ayisetyenziswanga ngokupheleleyo xa kutsalwa ixabiso le-Rth(j-sp), ngoko ke amandla obushushu esixhobo aqheleke kakhulu.
Ngapha koko, ijelo lesibini elibalulekileyo lokutshisa ubushushu linika abayili ithuba lokuphucula uyilo lwePCB.Ngokomzekelo, kwisixhobo esithengiswa ngocingo, ubushushu bunokuchithwa kuphela ngomjelo omnye (ubuninzi bobushushu be-diode buchithwa ngepini ye-cathode);kwisixhobo esibotshwe kwikliphu, ubushushu bunokuchithwa kuzo zombini iitheminali.
Ukulinganisa ukusebenza kweThermal yeSemiconductor Devices
Imifuniselo yokulinganisa ibonise ukuba ukusebenza kwe-thermal kunokuphuculwa kakhulu ukuba zonke iitheminali zesixhobo kwi-PCB zineendlela ezishushu.Ngokomzekelo, kwi-CFP5-packaged PMEG6030ELP diode (Umfanekiso 3), i-35% yobushushu idluliselwa kwiiphini ze-anode ngokusebenzisa i-copper clamps kwaye i-65% idluliselwe kwi-cathode pin ngokusebenzisa i-leadframes.
CFP5 epakishwe diode
"Uvavanyo lokulinganisa luye lwaqinisekisa ukuba ukwahlula i-heat sink ibe ngamacandelo amabini (njengoko kubonisiwe kuMfanekiso 4) kulungelelaniso lokutshatyalaliswa kobushushu.
Ukuba i-heatsink eyi-1 cm² yahlulahlulwe ibe zii-heatsink ezimbini eziyi-0.5 cm² ezibekwe ngaphantsi kwe-terminal nganye kwezi zimbini, ubungakanani bamandla anokulahlwa yi-diode kubushushu obufanayo bonyuka nge-6%.
Iiheatsink ezimbini ze-3 cm² zonyusa ukutshatyalaliswa kwamandla malunga neepesenti ezingama-20 xa kuthelekiswa noyilo oluqhelekileyo lwesinki yobushushu okanye i-6 cm² yeheatsink encanyathiselwe kuphela kwi-cathode.
Iziphumo zokulinganisa i-Thermal kunye neeSinki zokushisa kwiindawo ezahlukeneyo kunye neendawo zeBhodi
I-Nexperia inceda abaqulunqi bakhethe iipakethi ezizilungele ngcono usetyenziso lwabo
Abanye abavelisi besixhobo se-semiconductor ababoneleli abaqulunqi ngolwazi oluyimfuneko ukumisela ukuba loluphi uhlobo lwepakethe oluya kubonelela ngokusebenza okungcono kwe-thermal kwisicelo sabo.Kweli nqaku, i-Nexperia ichaza iindlela ezishushu kwisixhobo sayo esibotshelelwe ngocingo kunye nezixhobo ezibotshelelwe kwitshiphu ukunceda abaqulunqi benze izigqibo ezingcono kwizicelo zabo.
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Ixesha lokuposa: Sep-13-2023