1. emva kokuveliswa kunye nokulungiswa kwe-PCB, ukupakishwa kwe-vacuum kufuneka kusetyenziswe okokuqala.Kufuneka kubekho i-desiccant kwingxowa yokupakisha ye-vacuum kwaye ukupakishwa kusondele, kwaye ayikwazi ukunxibelelana namanzi kunye nomoya, ukuze kuthintelwe ukuthengiswa kwempahla.reflow ovenkunye nomgangatho wemveliso ochatshazelwa sisitshizi se-tin kumphezulu we-PCB kunye ne-oxidation ye-solder pad.
2. I-PCB kufuneka ibekwe kwaye ibhalwe ngokweendidi.Emva kokutywinwa, iibhokisi kufuneka zihlulwe kwiindonga, kwaye akufanele zibekwe kwilanga.Kufuneka igcinwe kwikhabhinethi yokugcina umoya kunye neyomileyo kunye nendawo yokugcina indawo efanelekileyo (ubushushu: 22-27 degrees, umswakama: 50-60%).
3. kwiibhodi zesekethe ze-PCB ezingasetyenziswanga ixesha elide, kungcono ukuxubha ubuso beebhodi zesekethe ze-PCB ngepeyinti yobungqina obuthathu, obunokuthi bube bumanzi, buthuli kunye ne-anti-oxidation, ukwenzela ukuba ubomi bokugcina Iibhodi zesekethe zePCB zinokunyuswa zibe ziinyanga ezili-9.
4. Isiqwenga sePCB esingapakishwanga singagcinwa iintsuku ezili-15 phantsi kobushushu obungaguqukiyo kunye nokufuma, kwaye akukho ngaphezu kweentsuku ezi-3 phantsi kobushushu obuqhelekileyo;
5. I-PCB kufuneka isetyenziswe kwiintsuku ezi-3 emva kokukhulula.Ukuba ayisetyenziswanga, vacuum itywina ngengxowa emileyo kwakhona.
6. Ibhodi PCBA emvaUmatshini we-SMTinyusiwe kwaye i-DIP kufuneka ihanjiswe kwaye ibekwe kunye nesibiyeli se-antistatic.
Ixesha lokuposa: Aug-20-2021