Indlela yokusebenzisa i-solder paste kwinkqubo ye-PCBA?
(1) Indlela elula yokugweba i-viscosity ye-solder paste: Gxuma i-solder paste nge-spatula malunga nemizuzu emi-2-5, thatha i-solder encinci kunye ne-spatula, kwaye uvumele i-solder paste iwe phantsi ngokwemvelo.I-viscosity iphakathi;ukuba i-solder paste ayisuki kwaphela, i-viscosity ye-solder paste iphezulu kakhulu;ukuba i-solder paste iqhubeka ikhupha ngokukhawuleza, i-viscosity ye-solder paste incinci kakhulu;
(2) Imiqathango yokugcinwa kwe-solder paste: faka efrijini kwifom evaliweyo kwiqondo lokushisa kwe-0 ° C ukuya kwi-10 ° C, kwaye ixesha lokugcinwa ngokubanzi kwiinyanga ezi-3 ukuya kwezi-6;
(3) Emva kokuba i-solder paste ikhutshiwe ngaphandle kwefriji, kufuneka ifudunyezwe kwiqondo lobushushu begumbi ngaphezu kweeyure ezi-4 ngaphambi kokuba isetyenziswe.Indlela yokufudumeza ayinakusetyenziswa ukubuyela kwiqondo lokushisa;emva kokuba i-solder paste ifudumala, idinga ukuxutywa (njengokuxuba umatshini, ukuvuselela i-1-2 Minutes, ukuvuselela ngesandla kufuneka kuqhutywe ngaphezu kwemizuzu emi-2) ngaphambi kokusetyenziswa;
(4) Ubushushu be-ambient bokushicilela kwi-solder paste kufuneka bube yi-22℃～28℃, kwaye ukufuma kufuneka kube ngaphantsi kwe-65%;
(5) Ushicilelo lwe-solder paste
1. Xa uprinta i-solder paste, kucetyiswa ukuba usebenzise i-solder paste kunye nomxholo wetsimbi we-85% ukuya kwi-92% kunye nobomi benkonzo yeeyure ezingaphezu kwe-4;
2. Isantya sokushicilela Ngexesha lokuprinta, isantya sokuhamba se-squeegee kwi-template yokushicilela sibaluleke kakhulu, kuba i-solder paste idinga ixesha lokuhamba kunye nokugeleza kwi-die hole.Umphumo ungcono xa i-solder paste ijikeleza ngokulinganayo kwi-stencil.
3. Uxinzelelo lokuprinta Uxinzelelo lokuprinta kufuneka lulungelelaniswe kunye nobunzima be-squeegee.Ukuba uxinzelelo luphantsi kakhulu, i-squeegee ayiyi kuhlambulula i-solder paste kwi-template.Ukuba uxinzelelo lukhulu kakhulu okanye i-squeegee ithambile kakhulu, i-squeegee iya kutshona kwi-template.Yomba intlama ye-solder kumngxuma omkhulu.Ifomula yovavanyo loxinzelelo: Sebenzisa iskrayi kwitemplate yentsimbi.Ukuze ufumane uxinzelelo oluchanekileyo, qala ngokufaka i-1 kg yoxinzelelo kwi-50 mm yobude be-scraper.Ngokomzekelo, i-300 mm scraper isebenzisa uxinzelelo lwe-6 kg ukunciphisa ngokuthe ngcembe uxinzelelo.De i-solder paste iqale ukuhlala kwi-template kwaye ayikrwelwe ngokucocekileyo, ngoko ngokuthe ngcembe yandise uxinzelelo de i-solder paste ikhutshiwe.Ngeli xesha, uxinzelelo luphezulu.
4. Inkqubo yolawulo lwenkqubo kunye nemigaqo yenkqubo Ukuze ufezekise iziphumo ezilungileyo zokuprinta, kuyimfuneko ukuba ube nezinto ezichanekileyo zokunamathisela i-solder (i-viscosity, umxholo wesinyithi, ubukhulu bepowder ubungakanani kunye nomsebenzi ophantsi kakhulu we-flux), izixhobo ezichanekileyo (umatshini wokushicilela, itemplate). kunye nokudityaniswa kwe-scraper) kunye nenkqubo echanekileyo (ukubekwa kakuhle, ukucocwa kunye nokusula).Ngokweemveliso ezahlukeneyo, misela iparameters inkqubo yoshicilelo oluhambelanayo kwinkqubo yoshicilelo, ezifana lobushushu ukusebenza, uxinzelelo ukusebenza, isantya squeegee, isantya demoulding, umjikelo oluzenzekelayo template ukucoca, njl Kwangaxeshanye, kuyimfuneko ukwenza inkqubo engqongqo. inkqubo yolawulo kunye nemigaqo yenkqubo.
① Sebenzisa intlama ye-solder ngaphakathi kwexesha lokuqinisekisa ngokungqongqo ngokuhambelana ne-brand ekhethiweyo.I-solder paste kufuneka igcinwe efrijini ngeentsuku zeveki.Kufuneka ibekwe kwindawo yokushisa kwegumbi ngaphezu kweeyure ezingama-4 ngaphambi kokusetyenziswa, kwaye ke isiciko sinokuvulwa ukusetyenziswa.I-solder paste esetyenzisiweyo kufuneka ivalwe kwaye igcinwe ngokwahlukileyo.Ingaba umgangatho ufanelekile.
② Phambi kwemveliso, umqhubi usebenzisa imela ekhethekileyo yensimbi engenasici ukushukumisa intlama yesolder ukuze ilingane.
③ Emva kohlahlelo lokuqala loshicilelo okanye uhlengahlengiso lwesixhobo emsebenzini, umvavanyi wobungqingqwa be-solder paste uyakusetyenziswa ukulinganisa ubukhulu boshicilelo lwencama ye-solder.Amanqaku okuvavanya akhethwe kumanqaku angama-5 kwindawo yokuvavanya kwibhodi eprintiweyo, kubandakanywa nephezulu kunye nezantsi, ngasekhohlo nasekunene naphakathi, kwaye urekhode amaxabiso.Ubukhulu be-solder paste buvela kwi--10% ukuya kwi-+15% yobukhulu betemplate.
④ Ngexesha lenkqubo yokuvelisa, ukuhlolwa kwe-100% kwenziwa kumgangatho wokushicilela we-solder paste.Umxholo ophambili kukuba ingaba ipateni yokuncamathisela ye-solder igqityiwe, ingaba ubukhulu bufanayo, nokuba kukho i-solder paste tipping.
⑤ Coca ithempleyithi ngokweemfuno zenkqubo emva kokuba umsebenzi wasemsebenzini ugqityiwe.
⑥ Emva kovavanyo loshicilelo okanye ukusilela koshicilelo, i-solder paste kwibhodi eprintiweyo kufuneka icocwe ngokucokisekileyo ngezixhobo zokucoca ze-ultrasonic kwaye zomiswe, okanye zicocwe ngotywala kunye negesi yoxinzelelo oluphezulu ukuthintela ukuncamatheliswa kwe-solder ebhodini ukuba kungabangelwa xa kusenziwa. isetyenziswe kwakhona.Iibhola ze-Solder kunye nezinye izinto eziye zenzeka emva kokuthengiswa kwakhona
I-NeoDen ibonelela ngezisombululo zomgca wendibano ye-SMT epheleleyo, kubandakanywa i-oven ye-SMT reflow, umatshini wokuthengisa amaza, umatshini wokukhetha kunye nendawo, umshicileli we-solder paste, isilayishi se-PCB, i-PCB yokothula, i-chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, Isixhobo somgca we-SMT, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl.njl naluphi na uhlobo oomatshini be-SMT onokubafuna, nceda uqhagamshelane nathi ngolwazi oluthe kratya:
IHangzhou NeoDen Technology Co., Ltd
Ixesha lokuposa: Jul-21-2020