Intshayelelo kwi-PCB substrate

Ukuhlelwa kwee substrates

Ibhodi eprintiweyo ngokubanzi izinto ze-substrate zinokwahlulwa zibe ngamacandelo amabini: izinto eziqinileyo ze-substrate kunye ne-flexible substrate materials.Uhlobo olubalulekileyo lwezinto eziqhelekileyo eziqinileyo ze-substrate yi-copper clad laminate.Yenziwe nge-Reinforeing Material, ifakwe kwi-resin binder, yomisiwe, inqunywe kwaye i-laminated ibe yinto engenanto, emva koko ihlanganiswe nge-foil yobhedu, isebenzisa i-sheet sheet njenge-mold, kwaye iqhutywe ngubushushu obuphezulu kunye noxinzelelo oluphezulu kwi-press eshushu.I-multilayer semi-cured sheet ngokubanzi, inxibe ubhedu kwinkqubo yemveliso yeemveliso ezigqityiweyo (ubukhulu becala ilaphu leglasi elifakwe kwintlaka, ngokomisa).

Kukho iindlela ezahlukeneyo zokuhlela i-copper clad laminate.Ngokuqhelekileyo, ngokwezinto ezahlukeneyo zokuqinisa ibhodi, inokwahlulwa ibe ngamacandelo amahlanu: isiseko sephepha, isiseko selaphu leglasi yeglasi, isiseko esihlanganisiweyo (uchungechunge lweCEM), isiseko sebhodi ye-laminated multilayer kunye nesiseko sezinto ezikhethekileyo (i-ceramics, isiseko sentsimbi yentsimbi, njl.).Ukuba ibhodi esetyenziswe ngama-adhesives e-resin ahlukeneyo yokuhlelwa, iphepha eliqhelekileyo - elisekelwe kwi-CCI.Kukho: i-phenolic resin (XPc, XxxPC, FR 1, FR 2, njl.), i-epoxy resin (FE 3), i-polyester resin kunye nezinye iintlobo.I-CCL eqhelekileyo yi-epoxy resin (FR-4, FR-5), eyona nto isetyenziswa kakhulu kwilaphu lefiber yeglasi.Ukongezelela, kukho ezinye ii-resin ezikhethekileyo (i-glass fiber cloth, i-polyamide fiber, i-cloth engeyilukiweyo, njl., njengezinto ezongeziweyo) : i-bismaleimide modified trizine resin (BT), i-polyimide resin (PI), i-diphenyl ether resin (PPO), maleic anhydride imide — styrene resin (MS), polycyanate ester resin, polyolefin resin, njl.

Ngokokusebenza kwe-CCL ye-flame retardant, inokwahlulwa ibe yi-flame retardant type (UL94-VO, UL94-V1) kunye ne-non-flame retardant type (Ul94-HB).Kwiminyaka eyi-12 edlulileyo, njengoko ingqwalasela engakumbi ihlawulwe ekukhuselweni kwendalo, uhlobo olutsha lwe-CCL ye-flame-retardant ngaphandle kwe-bromine luye lwahlula, olunokuthiwa "i-CCL eluhlaza i-flame-retardant".Ngophuhliso olukhawulezayo lwetekhnoloji yemveliso ye-elektroniki, i-cCL ineemfuno eziphezulu zokusebenza.Ngoko ke, ukusuka kuhlelo lokusebenza lweCCL, kwaye yahlulahlulwe kwi-CCL yokusebenza ngokubanzi, i-CCL ephantsi ye-dielectric engaguqukiyo, ukumelana nobushushu obuphezulu CCL (ipleyiti jikelele L kwi-150 ℃ ngasentla), i-coefficient yokwandisa i-thermal ephantsi ye-CCL (isetyenziswa ngokubanzi kwi-substrate yokupakisha) kunye nezinye iindidi. .

Umgangatho wokuphunyezwa kwe-substrate

Ngophuhliso kunye nenkqubela phambili eqhubekayo yobuchwepheshe be-elektroniki, iimfuno ezintsha zihlala zibekwe phambili kwizinto eziprintiweyo zebhodi engaphantsi, ukuze kukhuthazwe uphuhliso oluqhubekayo lwemigangatho yepleyiti yobhedu.Okwangoku, imigangatho ephambili yezinto ze-substrate zilandelayo.
1) ImiGangatho yeSizwe yeeSubstrates Okwangoku, Imigangatho yesizwe ye-substrates e-China iquka i-GB/T4721 — 4722 1992 kunye ne-GB 4723 — 4725 — 1992. Umgangatho we-copper clad laminates kwingingqi yaseTaiwan yaseChina ngumgangatho we-CNS, osekelwe kumgangatho we-JIs yaseJapan kwaye yakhutshwa ngo-1983.

Ngophuhliso kunye nenkqubela phambili eqhubekayo yobuchwepheshe be-elektroniki, iimfuno ezintsha zihlala zibekwe phambili kwizinto eziprintiweyo zebhodi engaphantsi, ukuze kukhuthazwe uphuhliso oluqhubekayo lwemigangatho yepleyiti yobhedu.Okwangoku, imigangatho ephambili yezinto ze-substrate zilandelayo.
1) ImiGangatho yeSizwe yeeSubstrates Okwangoku, imigangatho yesizwe yaseTshayina yee-substrates ibandakanya i-GB/T4721 — 4722 1992 kunye ne-GB 4723 — 4725 — 1992. Umgangatho we-copper clad laminates kwingingqi yaseTaiwan yaseChina ngumgangatho we-CNS, osekelwe kwi-CNS. Imigangatho ye-JIs yaseJapan kwaye yakhutshwa ngo-1983.
2) Eminye imigangatho yelizwe iquka umgangatho we-JIS waseJapan, i-ASTM yaseMelika, i-NEMA, i-MIL, i-IPc, i-ANSI kunye ne-UL standard, i-British Bs standard, i-German DIN kunye ne-VDE standard, i-French NFC kunye ne-UTE standard, i-Canadian CSA standard, i-Australian AS standard, umgangatho we-FOCT yeyayesakuba yiSoviet Union, kunye nomgangatho we-IEC wamazwe ngamazwe

Umgangatho wesishwankathelo somgangatho wesizwe ubizwa ngokuba lisebe lokuqulunqwa kwamagama asemgangathweni
I-JIS- iMigangatho yoShishino lwaseJapan - i-Japan Specification Association
I-ASTM- Umbutho waseMelika weMigangatho yeMathiriyeli yeLabhoratri -Umbutho waseMelika weFof Testi 'ng kunye neMathiriyeli
I-NEMA- Umbutho weSizwe woMgangatho woMveliso woMbane -iNafiomll yoMbane woMbane
I-MH- iMigangatho yoMkhosi yase-United States-iSebe lezoKhuselo kunye neMigangatho yeSebe lezoKhuselo
IPC- American Circuit Interconnection and Packaging Association Standard -Iveki eyinyani ye-Interoonnecting kunye nokuPakisha iiSekethe ze-EIectronics
ANSl- Iziko loMgangatho weSizwe laseMelika