Phambi kokwenziwa kweebhodi ezomeleleyo eziguquguqukayo kuqalise, uyilo loyilo lwePCB luyafuneka.Nje ukuba uyilo lumiselwe, ukuveliswa kunokuqalisa.
Inkqubo yokuvelisa i-rigid-flexible idibanisa ubuchule bokuvelisa iibhodi eziqinileyo kunye neziguquguqukayo.Ibhodi engqongqo-eguquguqukayo yimfumba eqinile kwaye ibhetyebhetye umaleko wePCB.Amacandelo ahlanganiswe kwindawo eqinile kwaye adibaniswe nebhodi edibeneyo edibeneyo ngokusebenzisa indawo eguquguqukayo.Uqhagamshelo lomaleko ukuya kumaleko luziswa nge-dias ecwecwe.
Ukwenziwa kwe-Rigid-flexible fabrication kubandakanya la manyathelo alandelayo.
1. Lungiselela i-substrate: Isinyathelo sokuqala kwinkqubo yokuvelisa i-rigid-flexible bonding kukulungiswa okanye ukucocwa kwe-laminate.I-Laminates equkethe i-copper layers, kunye okanye ngaphandle kwe-adhesive coating, ihlanjululwe kwangaphambili ngaphambi kokuba ifakwe kuyo yonke inkqubo yokuvelisa.
2. Ukuveliswa kwepateni: Oku kwenziwa ngoshicilelo lwesikrini okanye umfanekiso wefoto.
3. Inkqubo ye-Etching: Amacala omabini e-laminate kunye neepatheni zesekethe eziqhotyoshelweyo zifakwe ngokuzifakela kwi-bath etching okanye ukuzitshiza ngesisombululo se-etchant.
4. Inkqubo yokugaya i-Mechanical drilling: Inkqubo yokugaya ngokuchanekileyo okanye ubuchule busetyenziselwa ukubhobhoza imingxuma yesiphaluka, iipads kunye neepatheni ezingaphezulu kwemingxuma ezifunekayo kwipaneli yokuvelisa.Imizekelo ibandakanya iindlela zokubhola ngelaser.
5. Inkqubo yokufakwa kobhedu: Inkqubo yobhedu yobhedu ijolise ekufakeni ubhedu olufunekayo ngaphakathi kwe-vias ecwecwe ukwenza uqhagamshelo lombane phakathi kweeleya zephaneli ezidityanisiweyo eziqinileyo.
6. Ukusetyenziswa kwe-overlay: Izinto eziphathekayo (ngokuqhelekileyo ifilimu ye-polyimide) kunye ne-adhesive ziprintwa phezu kwebhodi eqinile-eguquguqukayo ngokuprintwa kwesikrini.
7. I-Overlay lamination: Ukubambelela ngokufanelekileyo kwe-overlay kuqinisekiswa ngokugqithwa kwiqondo lokushisa elithile, uxinzelelo kunye nemida ye-vacuum.
8. Ukusetyenziswa kwemivalo yokuqinisa: Ngokuxhomekeke kwiimfuno zoyilo lwebhodi engqongqo-eguquguqukayo, imivalo yokongezwa kwendawo ingasetyenziswa ngaphambi kwenkqubo eyongezelelweyo yokucoca.
9. Ukusika iipaneli eziguquguqukayo: Iindlela ze-hydraulic punching okanye ii-punching iimela ezikhethekileyo zisetyenziselwa ukusika iipaneli eziguquguqukayo ezivela kwiipaneli zokuvelisa.
10. Uvavanyo loMbane kunye noQinisekiso: Iibhodi ezingqongqo-eziguquguqukayo zivavanywa ngombane ngokuhambelana ne-IPC-ET-652 izikhokelo zokuqinisekisa ukuba ukugquma kwebhodi, ukudibanisa, umgangatho, kunye nokusebenza kuyahlangabezana neemfuno zenkcazo yoyilo.Iindlela zovavanyo zibandakanya uvavanyo lwe-flying probe kunye neenkqubo zovavanyo lwegridi.
Inkqubo yokwenziwa eguquguqukayo engqongqo ilungele ukwakha iisekethe kwicandelo lezonyango, i-aerospace, emkhosini, kunye nelonxibelelwano lomnxeba ngenxa yokusebenza okugqwesileyo kunye nokusebenza ngokuchanekileyo kwezi bhodi, ngakumbi kwiindawo ezirhabaxa.
Ixesha lokuposa: Aug-12-2022