PCB Board Substrate Material Classification

Iindidi ezininzi zesubstrates ezisetyenziselwa iiPCBs, kodwa zahlulahlulwe ngokubanzi zibe ziindidi ezimbini, ezizezi, imathiriyeli ye-inorganic substrate kunye nemathiriyeli ye-organic substrate.

Izinto ze-inorganic substrate

I-substrate ye-inorganic ubukhulu becala ziipleyiti ze-ceramic, i-substrate yesekethe ye-ceramic yi-96% ye-alumina, kwimeko yokufuna i-substrate enamandla kakhulu, i-99% ye-alumina ecocekileyo ingasetyenziswa kodwa ubunzima bokucwangcisa i-alumina ephezulu, izinga lesivuno liphantsi, ngoko ke ukusetyenziswa kwexabiso elisulungekileyo alumina liphezulu.I-Beryllium oxide iyimathiriyeli ye-ceramic substrate, yi-oxide yensimbi, ineempawu ezilungileyo zokugquma umbane kunye ne-thermal conductivity egqwesileyo, inokusetyenziswa njenge-substrate yeesekethe zoxinaniso lwamandla aphezulu.

Ii-substrates zesekethe yeCeramic zisetyenziswa ikakhulu kwiisekethe ezidityanisiweyo nezibhityileyo zefilimu edibeneyo, i-multi-chip micro-assembly circuits, enezibonelelo zokuba i-organic material circuit substrates ayinakuhambelana.Ngokomzekelo, i-CTE ye-ceramic circuit substrate inokufanisa ne-CTE yezindlu ze-LCCC, ngoko ke ukuthembeka kwe-solder edibeneyo kuya kufumaneka xa kuhlanganiswa izixhobo ze-LCCC.Ukongeza, ii-substrates ze-ceramic zifanelekile kwinkqubo yokukhupha i-vacuum kwi-chip yokwenziwa kwe-chip kuba ayikhuphi inani elikhulu leegesi ze-adsorbed ezibangela ukuhla kwinqanaba le-vacuum naxa lishushu.Ukongeza, ii-substrates ze-ceramic zikwanokumelana nobushushu obuphezulu, ukugqiba kakuhle komphezulu, uzinzo oluphezulu lweekhemikhali, yeyona ndawo ikhethiweyo yesekethe yeesekethe ezishinyeneyo nezibhityileyo zefilimu kunye neesekethe ze-multi-chip micro-assembly.Nangona kunjalo, kunzima ukucubungula kwi-substrate enkulu kunye ne-flat, kwaye ayinakwenziwa ibe yi-multi-piece edibeneyo yesakhiwo sebhodi yesitampu esidibeneyo ukuhlangabezana neemfuno zemveliso ezenzekelayo Ukongeza, ngenxa ye-dielectric enkulu engaguqukiyo yezinto ze-ceramic, ngoko ke. nayo ayifanelekanga kwi-high-speed circuit substrates, kwaye ixabiso liphezulu.

Izinto ze-Organic substrate

Izinto ze-Organic substrate zenziwe ngezinto zokuqinisa ezifana ne-glass fiber cloth (i-fiber paper, i-glass mat, njl.), ifakwe kwi-resin binder, yomiswe ibe yinto engenanto, emva koko igqunywe nge-foil yobhedu, kwaye yenziwe ngubushushu obuphezulu kunye noxinzelelo.Olu hlobo lwe-substrate lubizwa ngokuba yi-copper-clad laminate (CCL), eyaziwa ngokuba ngamapaneli e-copper-clad, iyona nto iphambili yokuvelisa ii-PCBs.

I-CCL ezininzi iintlobo, ukuba izinto zokuqinisa ezisetyenziselwa ukwahlula, zinokuhlulwa zibe yi-paper-based, i-glass fiber cloth-based, i-composite base (CEM) kunye neentlobo ezine zetsimbi;ngokuhambelana ne-organic resin binder esetyenziselwa ukwahlula, kwaye inokwahlulwa ibe yi-phenolic resin (PE) epoxy resin (EP), i-polyimide resin (PI), i-polytetrafluoroethylene resin (TF) kunye ne-polyphenylene ether resin (PPO);ukuba i-substrate iqinile kwaye iguquguqukayo yokwahlula, kwaye inokwahlulwa ibe yiCCL eqinile kunye neCCL eguquguqukayo.

Okwangoku isetyenziswa ngokubanzi kwimveliso ye-PCB enamacala amabini yi-epoxy glass fiber circuit substrate, edibanisa iingenelo zamandla alungileyo efiber yeglasi kunye ne-epoxy resin toughness, enamandla kunye ne-ductility.

I-epoxy glass fiber circuit substrate yenziwa ngokungena kuqala kwiresin ye-epoxy kwilaphu lefiber yeglasi ukwenza i-laminate.Ngelo xesha, ezinye iikhemikhali zongezwa, ezifana ne-agent ephilisayo, i-stabilizers, i-anti-flammability agents, i-adhesives, njl. Emva koko i-foil yobhedu igxininiswe kwaye icinezele kwelinye okanye kumacala omabini e-laminate ukwenza i-copper-clad epoxy glass fiber. laminate.Ingasetyenziselwa ukwenza iiPCB ezahlukeneyo ezinamacala elinye, ezinamacala amabini kunye nezininzi.