Inkqubo yoyilo lwePCB

Inkqubo yoyilo olusisiseko lwePCB luhamba ngolu hlobo lulandelayo:

Ukulungiselela kwangaphambili → uyilo lwesakhiwo sePCB → isikhokelo setheyibhile yenethiwekhi → useto lomgaqo → uyilo lwePCB → iingcingo → usetyenziso lweengcingo kunye noshicilelo lwekhusi → inethiwekhi kunye ne-DRC jonga kunye noqwalaselo lwesakhiwo → imveliso yokupeyinta ukukhanya → uphononongo olukhanyayo lwepeyinti → imveliso yebhodi yePCB / isampuli yolwazi → PCB Ubunjineli bomzi-mveliso webhodi uqinisekiso lwe-EQ → isiphumo solwazi lwe-SMD → ukugqitywa kweprojekthi.

1: Ukulungiselela kwangaphambili

Oku kubandakanya ukulungiswa kwethala leencwadi kunye neskimu.Phambi koyilo lwePCB, lungiselela kuqala iphakheji yengqiqo yeSCH kunye nethala leencwadi lePCB.Ilayibrari yepakethe i-PADS iza nelayibrari, kodwa ngokubanzi kunzima ukufumana echanekileyo, kungcono ukwenza ilayibrari yephakheji yakho ngokusekelwe kulwazi lobungakanani obuqhelekileyo besixhobo esikhethiweyo.Ngokomgaqo, yenza kuqala ilayibrari yephakheji ye-PCB, kwaye wenze i-SCH logic package.Ilayibrari yephakheji ye-PCB ifuna kakhulu, ichaphazela ngokuthe ngqo ukufakwa kwebhodi;Iimfuno zephakheji ye-logic ye-SCH zikhululekile, nje ukuba unike ingqalelo kwinkcazo yeempawu ze-pin ezilungileyo kunye nembalelwano kunye nephakheji ye-PCB emgceni.I-PS: nikela ingqalelo kwilayibrari esemgangathweni yezikhonkwane ezifihliweyo.Emva koko luyilo lweskimu, ukulungele ukuqalisa ukwenza uyilo lwePCB.

2: Uyilo lwesakhiwo sePCB

Eli nyathelo ngokwesayizi yebhodi kunye nokubekwa koomatshini kuye kwamiselwa, indawo yoyilo lwePCB ukuzoba umphezulu webhodi yePCB, kunye neemfuno zokubeka indawo yokubekwa kwezihlanganisi ezifunekayo, izitshixo / iiswitshi, imingxuma yesijija, imingxuma yendibano, njl. Kwaye qwalasela ngokupheleleyo kwaye uqikelele indawo yocingo kunye nendawo engeyiyo yocingo (efana nokuba yimalini ejikeleze i-screw hole yendawo engeyiyo yocingo).

3: Khokela uluhlu lomnatha

Kuyacetyiswa ukuba ungenise isakhelo sebhodi phambi kokungenisa i-netlist.Ngenisa DXF ifomathi yebhodi isakhelo okanye emn ifomathi yebhodi isakhelo.

4: Ukumisela umgaqo

Ngokutsho koyilo oluthile lwe-PCB lunokumiselwa umgaqo ofanelekileyo, sithetha ngemithetho ngumphathi we-PADS wokunyanzeliswa, ngokusebenzisa umphathi wokuthintela kuyo nayiphi na inxalenye yenkqubo yoyilo lobubanzi bomgca kunye nemiqobo yokukhusela isithuba, ayihlangani nemiqobo. kokulandelayo ubhaqo lwe-DRC, luzakuphawulwa ngamanqaku e-DRC.

Isicwangciso somgaqo jikelele sibekwe phambi kobeko kuba ngamanye amaxesha umsebenzi we- fanout kufuneka ugqitywe ngexesha lobeko, ngoko ke imithetho kufuneka ibekwe phambi kwe- fanout, kwaye xa iprojekthi yoyilo inkulu, uyilo lungagqitywa ngokufanelekileyo.

Qaphela: Imigaqo imiselwe ukugqiba uyilo olungcono kwaye ngokukhawuleza, ngamanye amazwi, ukuququzelela umyili.

Izicwangciso eziqhelekileyo zi.

1. Ububanzi bomgca omiselweyo/isithuba somgca kwimiqondiso eqhelekileyo.

2. Khetha kwaye usete umngxuma ongaphezulu

3. Ububanzi bomgca kunye nezicwangciso zombala kwiimpawu ezibalulekileyo kunye nezixhobo zombane.

4. izicwangciso zomaleko webhodi.

5: Uyilo lwePCB

Uyilo ngokubanzi ngokwemigaqo elandelayo.

(1) Ngokweempawu zombane zesahlulelo esifanelekileyo, ngokubanzi sahlulahlulwe ibe: indawo yesekethe yedijithali (oko kukuthi, uloyiko lokuphazamiseka, kodwa ikwavelisa ukuphazamiseka), indawo yesekethe ye-analog (uloyiko lokuphazamiseka), indawo yokuqhuba amandla (imithombo yokuphazamiseka). ).

(2) ukugqiba umsebenzi ofanayo wesekethe, kufuneka ibekwe ngokusondeleyo kangangoko, kwaye ulungelelanise amacandelo ukuqinisekisa uxhulumaniso olufutshane kakhulu;ngexesha elifanayo, lungisa indawo ehambelanayo phakathi kweebhloko ezisebenzayo ukwenza uxhulumaniso olufutshane kakhulu phakathi kweebhloko ezisebenzayo.

(3) Ngobunzima bamacandelo kufuneka baqwalasele indawo yofakelo kunye namandla ofakelo;amacandelo okuvelisa ubushushu kufuneka abekwe ngokwahlukileyo kumacandelo e-thermal-sensitive components, kunye nemilinganiselo yokushisa i-thermal kufuneka ithathelwe ingqalelo xa kuyimfuneko.

(4) Izixhobo zomqhubi we-I / O ngokusondeleyo ngangokunokwenzeka kwicala lebhodi eprintiweyo, kufuphi nekhonkco elikhokelayo.

5

(6) kwisiphaluka ngasinye esidibeneyo phakathi kwepini yokufakelwa kwamandla kunye nomhlaba, kufuneka udibanise i-capacitor decoupling (ngokubanzi usebenzisa i-high-frequency performance ye-monolithic capacitor);indawo yebhodi ixinene, unokongeza i-tantalum capacitor malunga neesekethe ezininzi ezidibeneyo.

(7) ikhoyili ye-relay yokongeza i-diode yokukhupha (1N4148 can).

(8) iimfuno zoyilo kufuneka zilungelelaniswe, zilungelelane, zingabi yintloko enzima okanye isinki.

Ingqwalasela ekhethekileyo kufuneka ihlawulwe ekubekweni kwamacandelo, kufuneka siqwalasele ubukhulu bokwenene bamacandelo (indawo kunye nobude obuhlala), indawo ehambelanayo phakathi kwamacandelo ukuqinisekisa ukusebenza kombane webhodi kunye nokuba nokwenzeka kunye nokulula imveliso kunye ukufakela ngaxeshanye, kufuneka kuqinisekise ukuba le migaqo ingasentla ingabonakaliswa kwisiseko sohlengahlengiso olufanelekileyo ekubekeni isixhobo, ukuze sicoceke kwaye simhle, njengesixhobo esifanayo ukuze sibekwe ngokucocekileyo, kwicala elinye.Ayinakubekwa kwi "staggered".

Eli nyathelo lihambelana nomfanekiso opheleleyo webhodi kunye nobunzima be-wiring elandelayo, ngoko kufuneka kuthathelwe ingqalelo umgudu omncinci.Xa ubeka ibhodi, unokwenza i-wiring yokuqala kwiindawo ezingaqinisekanga kangako, kwaye unike ingqwalasela epheleleyo.

6: Iingcingo

Ucingo lweyona nkqubo ibalulekileyo kuyo yonke uyilo PCB.Oku kuya kuchaphazela ngqo ukusebenza kwebhodi PCB ilungile okanye imbi.Kwinkqubo yoyilo lwe-PCB, i-wiring ngokubanzi inemimandla emithathu yolwahlulo.

Okokuqala ilaphu ngokusebenzisa, eyona mfuneko isisiseko kuyilo PCB.Ukuba imigca ayifakwanga, ukwenzela ukuba yonke indawo ibe ngumgca wokundiza, iya kuba yibhodi ephantsi, ngoko ke, ayizange ifakwe.

Okulandelayo kukusebenza kombane ukuhlangabezana.Lo ngumlinganiselo wokuba ibhodi yesekethe eprintiweyo ifanelekile na.Oku kusemva kokuba ilaphu lidlule, lungisa ngononophelo i-wiring, ukuze ikwazi ukufezekisa ukusebenza kakuhle kombane.

Emva koko kuza i-aesthetics.Ukuba ilaphu lakho le-wiring lidlula, akukho nto ichaphazela ukusebenza kombane kule ndawo, kodwa ukrwaqula ixesha elidlulileyo, kunye nemibalabala, intyatyambo, nokuba ukusebenza kwakho kombane kulungile kangakanani, emehlweni abanye okanye iqhekeza lenkunkuma. .Oku kuzisa inkxamleko enkulu kuvavanyo nolondolozo.I-wiring kufuneka icoceke kwaye icoceke, inganqunyulwanga ngaphandle kwemithetho.Oku kukuqinisekisa ukusebenza kombane kunye nokuhlangabezana nezinye iimfuno zomntu ngamnye ukufezekisa imeko, ngaphandle koko kukubeka inqwelo phambi kwehashe.

Iingcingo ngokwemigaqo elandelayo.

(1) Ngokubanzi, eyokuqala kufuneka ifakwe iingcingo zombane kunye nemigca yomhlaba ukuqinisekisa ukusebenza kombane webhodi.Ngaphakathi kwemida yeemeko, zama ukwandisa unikezelo lwamandla, ububanzi bomgca womhlaba, ngokukhethekileyo ububanzi kunomgca wamandla, ubudlelwane babo bu: umgca ophantsi > umgca wamandla > umgca wesignali, ngokuqhelekileyo ububanzi bomgca wesignali: 0.2 ~ 0.3mm (malunga 8-12mil), obona bubanzi buthinne kakhulu ukuya kuthi ga ku-0.05 ~ 0.07mm (2-3mil), intambo yombane idla ngokuba yi-1.2 ~ 2.5mm (50-100mil).100mil).I-PCB yeesekethe zedijithali ingasetyenziselwa ukwenza isekethe yeengcingo zomhlaba obanzi, oko kukuthi, ukwenza inethiwekhi yomhlaba ukuze isetyenziswe (umhlaba wesiphaluka we-analog awukwazi ukusetyenziswa ngolu hlobo).

(2) i-wiring yangaphambili yeemfuno ezingqongqo zomgca (ezifana nemigca ye-high-frequency), i-input kunye ne-output side lines kufuneka igwenywe kufuphi ne-parallel, ukwenzela ukuba ingavelisi ukuphazamiseka okubonakalayo.Ukuba kuyimfuneko, ukuhlukaniswa komhlaba kufuneka kufakwe, kwaye i-wiring yemigangatho emibini esondeleyo kufuneka ibe yi-perpendicular enye kwenye, ihambelane nokuvelisa ngokulula ukudibanisa i-parasitic.

3Clock oscillation sekethe ngezantsi, icandelo ekhethekileyo high-speed logic sesekethe ukunyusa ummandla womhlaba, kwaye akufanele ahambe ezinye imigca umqondiso ukwenza intsimi yombane ezingqongileyo ithande zero;.

(4) kangangoko kunokwenzeka usebenzisa i-45 ° i-wiring yokugoba, musa ukusebenzisa i-90 ° fold, ukuze kuncitshiswe i-radiation ye-high-frequency signals;(iimfuno eziphezulu zomgca zikwasebenzisa umgca we-arc kabini)

(5) naziphi na iilayini zomqondiso azenzi amaluphu, afana nokungathintelekiyo, amaluphu kufuneka abe mancinci kangangoko;imigca yophawu kufuneka ibenemingxuma embalwa kangangoko.

(6) umgca wesitshixo ube mfutshane kwaye ungqindilili kangangoko kunokwenzeka, kwaye kumacala omabini anomhlaba okhuselayo.

(7) ngokusasazwa kwentambo yesicaba yemiqondiso enovakalelo kunye nesandi sebhendi yentsimi yengxolo, ukusebenzisa indlela "yomhlaba - umqondiso - umhlaba" wokukhokelela ngaphandle.

(8) Iimpawu eziphambili kufuneka zigcinwe kwiindawo zokuvavanya ukuququzelela uvavanyo lwemveliso kunye nokugcinwa

(9) Emva kokuba i-wiring ye-schematic igqityiwe, i-wiring kufuneka iphuculwe;kwangaxeshanye, emva kokuba itshekhi yokuqala womnatha kunye DRC itsheki ichanekile, indawo unwireed yokuzaliswa komhlaba, kunye nommandla omkhulu umaleko ubhedu emhlabeni, kwibhodi yesekethe eprintiweyo ayisetyenziswa kwindawo ziqhagamshelwe emhlabeni njengoko. umhlaba.Okanye wenze ibhodi ye-multilayer, amandla kunye nomhlaba ngamnye ubambe umaleko.

Iimfuno zenkqubo yocingo yePCB (inokusetwa kwimithetho)

(1) Umgca

Ngokubanzi, ububanzi bomgca wesignali ye-0.3mm (12mil), ububanzi bomgca wamandla we-0.77mm (30mil) okanye i-1.27mm (50mil);phakathi komgca kunye nomgca kunye nomgama phakathi komgca kunye nepad mkhulu okanye ulingana no-0.33mm (13mil), isicelo sangempela, iimeko kufuneka ziqwalaselwe xa umgama unyuswa.

Ubuninzi be-Wiring buphezulu, bunokuqwalaselwa (kodwa akukhuthazwa) ukusebenzisa izikhonkwane ze-IC phakathi kwemigca emibini, ububanzi bomgca we-0.254mm (10mil), isithuba somgca singekho ngaphantsi kwe-0.254mm (10mil).Kwiimeko ezikhethekileyo, xa izikhonkwane zesixhobo zixinene kunye nobubanzi obuncinci, ububanzi bomgca kunye nesithuba somgca sinokuncitshiswa ngokufanelekileyo.

(2) Iiphedi zeSolder (PAD)

I-solder pad (PAD) kunye nomngxuma wenguqu (VIA) iimfuno ezisisiseko zezi: ububanzi bediski kunobubanzi bomngxuma ukuba ube mkhulu kune-0.6mm;umzekelo, isixhasi isikhonkwane-injongo jikelele, capacitors kunye neesekethe ezidibeneyo, njl, usebenzisa idisk / umngxuma ubukhulu 1.6mm / 0.8mm (63mil / 32mil), iziseko, izikhonkwane kunye diodes 1N4007, njl, usebenzisa 1.8mm / 1.0mm (71mil / 39mil).Ukusetyenziswa okusebenzayo, kufuneka kusekelwe kubukhulu bokwenene bamacandelo ukumisela, xa kukho, kunokufaneleka ukunyusa ubungakanani bepadi.

PCB ibhodi uyilo icandelo ukuxhoma imbobo kufuneka ibe nkulu kunobukhulu obuyinyani becandelo lezikhonkwane 0.2 ~ 0.4mm (8-16mil) okanye njalo.

(3) umngxuma ongaphezulu (VIA)

Ngokubanzi 1.27mm/0.7mm (50mil/28mil).

Xa ubuninzi be-wiring buphezulu, ubukhulu bomngxuma ongaphezulu bunokuncitshiswa ngokufanelekileyo, kodwa akufanele bube buncinci, i-1.0mm / 0.6mm (40mil / 24mil) inokuqwalaselwa.

(4) Iimfuno zezithuba zepadi, umgca kunye ne-vias

I-PAD kunye ne-VIA : ≥ 0.3mm (12mil)

I-PAD kunye ne-PAD : ≥ 0.3mm (12mil)

I-PAD kunye ne-TRACK : ≥ 0.3mm (12mil)

TRACK kunye neTRACK : ≥ 0.3mm (12mil)

Kwiingxinano eziphezulu.

I-PAD kunye ne-VIA : ≥ 0.254mm (10mil)

I-PAD kunye ne-PAD : ≥ 0.254mm (10mil)

I-PAD kunye ne-TRACK : ≥ 0.254mm (10mil)

TRACK kunye neTRACK : ≥ 0.254mm (10mil)

7: Ukulungiswa kweengcingo kunye ne-silkscreen

“Akukho nto ilungileyo, ibhetele kuphela”!Kungakhathaliseki ukuba ugrumba kangakanani kuyilo, xa ugqiba umzobo, emva koko uye kujonga, uya kuziva ukuba iindawo ezininzi zinokuguqulwa.Amava oyilo ngokubanzi kukuba kuthatha ixesha eliphindwe kabini ukunyusa i-wiring njengoko yenzayo ukwenza i-wiring yokuqala.Emva kokuziva ukuba akukho ndawo yokuguqula, unokubeka ubhedu.Ukubeka ubhedu ngokuqhelekileyo ukubeka umhlaba (nikela ingqalelo ukuhlukana kwe-analog kunye nomhlaba wedijithali), ibhodi ye-multi-layer ingaphinda ifune ukubeka amandla.Xa i-silkscreen, qaphela ukuba ungavalwa sisixhobo okanye ususwe ngumngxuma ongaphezulu kunye nephedi.Kwangaxeshanye, uyilo lujonge isikweri kwicala lecandelo, igama elikwinqanaba elisezantsi kufuneka lenziwe ukusetyenzwa komfanekiso wesibuko, ukuze ungabhidanisi inqanaba.

I-8: Inethiwekhi, i-DRC isheke kunye nokujonga isakhiwo

Ngaphandle komzobo wokukhanya ngaphambili, ngokuqhelekileyo kufuneka uhlolisise, inkampani nganye iya kuba noLuhlu lwabo lokuHlola, kubandakanywa umgaqo, uyilo, ukuveliswa kunye neminye imiba yeemfuno.Oku kulandelayo yintshayelelo evela kwimisebenzi emibini ephambili yokukhangela ebonelelwa yisoftware.

I-9: Imveliso yokupeyinta ukukhanya

Ngaphambi kokukhutshwa komzobo okhanyayo, kufuneka uqinisekise ukuba i-veneer yinguqulelo yamva nje egqityiweyo kwaye ihlangabezana neemfuno zoyilo.Iifayile ezikhupha ukukhanya zokukhanya zisetyenziselwa i-factory yebhodi ukwenza ibhodi, i-stencil factory ukwenza i-stencil, i-welding factory yokwenza iifayile zenkqubo, njl.

Iifayile zemveliso zezi (ithatha ibhodi enemigangatho emine njengomzekelo)

1).Umaleko wocingo: ubhekisa kumaleko ophawu oluqhelekileyo, ikakhulu iingcingo.

Inikwe igama elithi L1, L2, L3,L4, apho L imele umaleko wolungelelwaniso.

2).I-Silk-screen layer: ibhekisela kwifayile yokuyila ukusetyenzwa kolwazi lwe-silk-screening kwinqanaba, ngokuqhelekileyo iileya eziphezulu kunye nezantsi zinezixhobo okanye i-logo ye-logo, kuya kuba noluhlu oluphezulu lwe-silk-screening kunye nokuhlolwa kwe-silk-screening.

Ukuthiywa: Umaleko ophezulu unikwe igama SILK_TOP ;umaleko ongezantsi unikwe igama SILK_BOTTOM .

3).Umaleko wokuxhathisa i-Solder: ibhekisa kumaleko kwifayile yoyilo ebonelela ngolwazi lokucubungula i-oyile eluhlaza.

Ukunikwa amagama: Umaleko ophezulu ubizwa ngokuba SOLD_TOP;umaleko ongezantsi unikwe igama SOLD_BOTTOM.

4).I-stencil layer: ibhekisa kwinqanaba kwifayile yoyilo ebonelela ngolwazi lokucubungula kwi-solder paste coating.Ngokuqhelekileyo, kwimeko apho kukho izixhobo ze-SMD kuzo zombini izingqimba eziphezulu kunye nezantsi, kuya kubakho i-stencil top layer kunye ne-stencil ezantsi.

Ukunikwa amagama: Umaleko ophezulu unikwe igama PASTE_TOP ;umaleko ongezantsi unikwe igama elithi PASTE_BOTTOM.

5).Drill layer (iqulathe iifayile ezi-2, NC DRILL CNC ifayile yokomba kunye neDRILL DRAWING umzobo wokomba)

ebizwa ngokuba yi-NC DRILL kunye ne-DRILL DRAWING ngokulandelelanayo.

10: Uphononongo lomzobo olula

Emva kokuphuma komzobo wokukhanya kuphononongo lomzobo wokukhanya, iCam350 evulekileyo kunye nemfutshane yesekethe kunye neminye imiba yetshekhi ngaphambi kokuthumela kwibhodi yefektri yebhodi, kamva kwakhona kufuneka ingqalelo kubunjineli bebhodi kunye nokuphendula ingxaki.

11: Ulwazi lwebhodi yePCB(Ulwazi lweGerber yokupeyinta ukukhanya + iimfuno zebhodi yePCB + umzobo webhodi yendibano)

I-12: I-PCB yebhodi yebhodi yobunjineli be-EQ yokuqinisekisa(ubunjineli bebhodi kunye nempendulo yengxaki)

I-13: imveliso yedatha yokubeka i-PCBA(ulwazi lwe-stencil, imephu yebit yokubeka, ifayile yolungelelwaniso lwecandelo)

Apha lonke uhambo lweprojekthi yoyilo lwePCB lugqityiwe

Uyilo PCB ngumsebenzi eneenkcukacha kakhulu, ngoko ke uyilo kufuneka ilumke kakhulu kwaye nomonde, ukuqwalasela ngokupheleleyo yonke imiba yezinto, kuquka uyilo ukuthatha ingqalelo imveliso yendibano kunye nokucubungula, kwaye kamva ukuququzelela ukugcinwa kunye neminye imiba.Ukongeza, uyilo lweminye imikhwa elungileyo yokusebenza luya kwenza uyilo lwakho lube sengqiqweni ngakumbi, uyilo olusebenzayo ngakumbi, imveliso elula kunye nokusebenza okungcono.Uyilo oluhle olusetyenziswa kwiimveliso zemihla ngemihla, abathengi baya kuqinisekiswa ngakumbi kwaye bathembeke.