Iingqwalasela zoYilo lwe-PCB

Ukuze kube lula imveliso, PCB ukuthunga ngokubanzi kufuneka ukuyila Mark point, V-slot, inkqubo edge.

I. Ubume bepleyiti yopelo

1. Isakhelo sangaphandle sebhodi yokudibanisa ye-PCB (i-clamping edge) kufuneka ivaliwe-loop uyilo ukuqinisekisa ukuba ibhodi yokudibanisa ye-PCB ayiyi konakala emva kokuba ilungisiwe kwi-fixture.

2. Ububanzi be-PCB splice ≤ 260mm (umgca we-SIEMENS) okanye ≤ 300mm (umgca we-FUJI);ukuba unikezelo oluzenzekelayo luyafuneka, ububanzi be-PCB ububanzi x ubude ≤ 125 mm x 180 mm.

3. PCB splicing ibhodi imilo kufutshane nesikwere kangangoko kunokwenzeka, kucetyiswa 2 × 2, 3 × 3, …… ibhodi splicing;kodwa musa ukupela kwibhodi yeyin kunye neyang.

II.V-slot

1. emva kokuvula i-V-slot, ubukhulu obuseleyo X kufuneka bube (1/4 ~ 1/3) ubukhulu bebhodi L, kodwa ubuncinci be-X kufuneka bube ≥ 0.4mm.Umda ophezulu webhodi yomthwalo onzima unokuthatyathwa, umda ophantsi webhodi yokuthwala imithwalo elula.

2. I-V-slot kumacala omabini eenotshi eziphezulu nezisezantsi zokungahambi kakuhle kwe-S kufuneka zibe ngaphantsi kwe-0.1mm;ngenxa yobuncinci obusebenzayo bezithintelo, ubukhulu obungaphantsi kwebhodi ye-1.2mm, akufanele isebenzise i-V-slot spell board way.

III.Phawula inqaku

1. Seta indawo yokubeka isalathisi, ngokuqhelekileyo kwindawo yokumisa ejikeleze ikhefu 1.5 mm enkulu kunommandla wayo ongenakuxhathisa.

2. Isetyenziselwa ukunceda ukubekwa kwamehlo kumatshini wokubekwa inesixhobo se-chip kwibhodi ye-PCB edayagonal ubuncinane iingongoma ezimbini zereferensi e-asymmetric, yonke indawo ye-PCB ye-optical point kunye ne-reference point ngokuqhelekileyo ikuyo yonke indawo ye-diagonal ye-PCB ehambelanayo;Iqhekeza le-PCB yokubeka i-optical point enendawo yereferensi ngokubanzi kwiqhekeza le-PCB diagonal ehambelanayo kwindawo.

3. kwisithuba esikhokelayo ≤ 0.5mm i-QFP (i-square flat package) kunye nesithuba sebhola ≤ 0.8mm BGA (i-ball grid array package) izixhobo, ukwenzela ukuba kuphuculwe ukuchaneka kokubekwa, iimfuno ze-IC ezimbini iiseti ze-diagonal zamanqaku okubhekisela.

IV.Umda wenkqubo

1. Isakhelo sangaphandle sebhodi yokuchwetheza kunye nebhodi encinci yangaphakathi, ibhodi encinci kunye nebhodi encinci phakathi kwendawo yokudibanisa kufuphi nesixhobo ayinakuba yizixhobo ezinkulu okanye eziphumayo, kunye namacandelo kunye nomphetho webhodi ye-PCB kufuneka ishiywe ngaphezu kwesixhobo. I-0.5mm yendawo yokuqinisekisa ukusebenza okuqhelekileyo kwesixhobo sokusika.

V. imingxuma yokubeka ibhodi

1. Ukubekwa kwe-PCB yebhodi yonke kunye nokubeka izixhobo ze-benchmark yezixhobo, ngokomgaqo, i-pitch engaphantsi kwe-0.65mm ye-QFP kufuneka ibekwe kwindawo yayo ye-diagonal;Iisimboli ze-PCB zokubeka ibhentshimakhi kufuneka zisetyenziswe ngababini, zicwangciswe kwidiagonal yezinto zokubeka.

2. Amacandelo amakhulu kufuneka ashiywe ngeekholomu zokubeka okanye imingxuma yokubeka, egxininise kwi-interfaces ye-I / O, i-microphones, i-battery interfaces, i-microswitches, i-headphone interfaces, ii-motor, njl.

Umyili wePCB olungileyo, kuyilo lokwabiwa, ukuqwalasela izinto zemveliso, ukuququzelela ukusetyenzwa, ukuphucula ukusebenza kakuhle kwemveliso kunye nokunciphisa iindleko zemveliso.