Inkqubo yokusetyenziswa kwebhodi ye-PCBA, kuya kubakho i-phenomenon ye-pad off, ngokukodwa kwixesha lokulungisa ibhodi ye-PCBA, xa usebenzisa intsimbi yokuxubha, kulula kakhulu ukudibanisa i-pad off the phenomenon, i-PCB factory kufuneka ibe yindlela yokujongana nayo?Kweli phepha, izizathu pad off ezinye uhlalutyo.
1. Iingxaki zomgangatho wepleyiti
Ngenxa yobhedu-clad laminate ipleyiti ngefoyile yobhedu kunye epoxy resin phakathi intlaka encamatheleyo encamatheleyo ukuncamathela ihlwempuzekile, oko kukuthi, nokuba indawo enkulu ngefoyile yobhedu yebhodi yesekethe ifoyile yobhedu bushushu kancinane okanye phantsi kwamandla oomatshini, kakhulu. kulula ukwahlula kwi-epoxy resin ekhokelela ekukhutshweni kweepads okanye kwifoyile yobhedu kunye neminye imiba.
2. Impembelelo yeemeko zokugcina ibhodi yesekethe
Ukuchatshazelwa yimozulu okanye ukugcinwa kwexesha elide kwindawo efumileyo, ukufunxwa kokufuma kwebhodi yePCB kukhokelela kumanzi amaninzi, ukuze kuphunyezwe isiphumo esinqwenelekayo se-welding, i-welding ye-patch ihlawulela ubushushu obuthathiweyo ngenxa yokunyuka komswakama, ubushushu be-welding kunye nexesha. kufuneka zandiswe, iimeko welding ezinjalo zithande ukuba kubangele ibhodi yesekethe ifoyile yobhedu kunye epoxy resin delamination, ngoko ke iplanti PCB processing kufuneka ingqalelo ukufuma kokusingqongileyo xa ugcina ibhodi PCB.
3. Iingxaki zokuwelda intsimbi
Ukubambelela ngokubanzi kwebhodi ye-PCB kunokuhlangabezana ne-welding eqhelekileyo, akuyi kubakho i-pad off phenomenon, kodwa iimveliso zombane ziyakwazi ukulungiswa, ukulungiswa ngokuqhelekileyo kusetyenziswa ukulungiswa kwe-welding welding yentsimbi, ngenxa yobushushu obuphezulu bendawo ye-soldering yentsimbi kaninzi ifikelela kwi-300- I-400 ℃, ekhokelela kwiqondo lokushisa eliphezulu lendawo ngokukhawuleza, i-welding ye-resin engaphantsi kwe-foil yobhedu ngokuwa kobushushu obuphezulu, ukubonakala kwe-pad off.Ukudilizwa kwentsimbi ye-soldering kwakhona kulula kwintloko yentsimbi edibeneyo kumandla omzimba wediski ye-welding, ekhokelela kunobangela we-pad off.
Iimpawu zeNeoDen IN12C Refow Oven
1. Inkqubo yokucoca i-welding eyakhiweyo, ukuhluzwa okusebenzayo kweegesi ezinobungozi, ukubonakala okuhle kunye nokukhuselwa kwendalo, ngakumbi ngokuhambelana nokusetyenziswa kwendawo ephezulu.
2. Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
3. Uyilo lwemodyuli yokufudumala eyodwa, kunye nokulawulwa kokushisa okuchanekileyo, ukusabalalisa ukushisa okufanayo kwindawo yembuyekezo ye-thermal, ukusebenza okuphezulu kwembuyekezo ye-thermal, ukusetyenziswa kwamandla aphantsi kunye nezinye iimpawu.
4. Uyilo lokukhusela ukufudumala ukushisa, ukushisa kwegobolondo kunokulawulwa ngokufanelekileyo.
5. Inokugcina iifayile ezisebenzayo ezingama-40.
6. Ukuya kuthi ga kwi-4-way-time real-time display of PCB board surface welding temperature curve.
7. I-lightweight, i-miniaturization, uyilo lwezoshishino lobuchwephesha, iimeko zesicelo eziguquguqukayo, ubuntu ngakumbi.
8. Ukugcinwa kwamandla, ukusetyenziswa kwamandla aphantsi, iimfuno eziphantsi zonikezelo lwamandla, umbane oqhelekileyo oqhelekileyo unokuhlangabezana nokusetyenziswa, xa kuthelekiswa neemveliso ezifanayo ngonyaka unokugcina iindleko zombane kwaye uthenge iyunithi enye yale mveliso.
Ixesha lokuposa: Jul-11-2023