Okwangoku, ukukopa kwePCB kukwabizwa ngokuba yiPCB cloning, uyilo olubuyela umva lwePCB, okanye iPCB ebuyisela umva iR&D kushishino.Kukho izimvo ezininzi malunga nenkcazo yokukhuphela iPCB kushishino nakwimfundo ephakamileyo, kodwa aziphelelanga.Ukuba sifuna ukunika inkcazo echanekileyo yokukhuphela i-PCB, sinokufunda kwilabhoratri yokukhuphela i-PCB e-China: iBhodi yokukhuphela i-PCB, oko kukuthi, kwisiseko seemveliso ze-elektroniki ezikhoyo kunye neebhodi zesekethe, uhlalutyo olubuyisela umva lweebhodi zesekethe luyenziwa. ngokusebenzisa iteknoloji ye-R & D eguqukayo, kunye namaxwebhu e-PCB, amaxwebhu e-BOM, amaxwebhu e-schematic diagram kunye namaxwebhu emveliso ye-silkscreen ye-PCB yeemveliso zokuqala zibuyiselwa kumlinganiselo we-1: 1, kwaye iibhodi ze-PCB kunye namacandelo zenziwe ngokusebenzisa la maxwebhu obugcisa. kunye namaxwebhu emveliso Amacandelo ukuwelda, uvavanyo flying pin, ibhodi yesekethe debugging, ikopi epheleleyo template ibhodi yesekethe yokuqala.Ngenxa yokuba iimveliso zombane zenziwe ngazo zonke iintlobo zeebhodi zesekethe, iseti yonke yedatha yobugcisa yazo naziphi na iimveliso zombane zinokukhutshwa kwaye iimveliso zinokukotshwa kwaye zenziwe ngendlela eyiyo ngokusebenzisa inkqubo yokukopa iPCB.
Inkqubo yokuphunyezwa kobugcisa bokufundwa kwebhodi ye-PCB ilula, oko kukuthi, ibhodi yokuqala yokuskena ibhodi yesekethe ukuba ikhutshelwe, irekhodi indawo yecandelo elineenkcukacha, emva koko uchithe amacandelo ukwenza i-BOM kwaye ulungiselele ukuthengwa kwezinto eziphathekayo, emva koko uskena ibhodi engenanto ukuthatha imifanekiso. , kwaye emva koko ziqhubekeke ngebhodi yokufunda software ukuzibuyisela PCB iifayile umzobo ibhodi, uze uthumele iifayile PCB kumzi-mveliso ipleyiti ukwenza iibhodi.Emva kokuba iibhodi zenziwe, ziya kuthengwa Amacandelo adityaniswe kwi-PCB, kwaye emva koko avavanywe kwaye ahlaziywe.
Amanyathelo obugcisa athile alandelayo:
Inyathelo 1: fumana i-PCB, qala urekhode imodeli, iiparamitha, kunye nezikhundla zawo onke amacandelo ephepheni, ngakumbi ulwalathiso lwe-diode, ityhubhu enezigaba ezintathu, kunye nenotshi ye-IC.Kungcono ukuthatha imifanekiso emibini yendawo yesiqalelo segesi ngekhamera yedijithali.Ngoku ibhodi yesekethe ye-PCB iqhubela phambili ngakumbi, kwaye i-diode triode kuyo ayibonakali.
Inyathelo lesi-2: Susa zonke iinxalenye kunye netoti kumngxunya wepadi.Coca i-PCB ngotywala kwaye uyibeke kwiskena.Xa iskena siskena, kufuneka sinyuse kancinane iipikseli zokuskena ukufumana umfanekiso ocacileyo.Emva koko upholise umaleko ongaphezulu kunye nomgangatho ophantsi kancinci ngephepha le-gauze lamanzi de kube ifilimu yobhedu ikhazimle, uyibeke kwi-scanner, qalisa i-Photoshop, kwaye utshayela iileya ezimbini ngombala.Qaphela ukuba iPCB mayibekwe ngokuthe tye nangokuthe nkqo kwiskena, kungenjalo umfanekiso oskeniweyo awunakusetyenziswa.
Inyathelo lesi-3: Lungisa umahluko kunye nokuqaqamba kweseyile ukwenza umahluko phakathi kwendawo enefilim yobhedu kunye nenxalenye engenafilim yobhedu yomelele.Emva koko jika umfanekiso wesibini ubemnyama namhlophe ukujonga ukuba imigca icacile na.Ukuba akunjalo, phinda eli nyathelo.Ukuba icacile, gcina umzobo njengefayile ye-BMP ephezulu kunye ne-BOT ye-BMP kwifomathi ye-BMP emnyama namhlophe.Ukuba kukho nayiphi na ingxaki ngomzobo, ungasebenzisa iPhotoshop ukuyilungisa kwaye uyilungise.
Isinyathelo sesine: guqula iifayile ezimbini zefomati ye-BMP kwiifayile zefomathi ye-PROTEL, kwaye uzidlulisele kwimigangatho emibini kwi-PROTEL.Ukuba indawo ye-PAD kunye ne-VIA ngaphezulu kwamanqanaba amabini ihambelana ngokusisiseko, ibonisa ukuba amanyathelo okuqala ambalwa alungile kakhulu, kwaye ukuba kukho ukutenxa, phinda amanyathelo wesithathu.Ngoko ukukopa kwebhodi ye-PCB ngumsebenzi womonde kakhulu, kuba ingxaki encinane iya kuchaphazela umgangatho kunye nesidanga esihambelanayo emva kokukopishwa kwebhodi.Inyathelo lesi-5: guqula iBMP yomaleko ongaphezulu ukuya kwiPCB ephezulu.Nikelani ingqalelo ukuyiguqulela kwi-silk layer, eyiyellow layer.
Emva koko unokulandelela umgca kwinqanaba eliphezulu, kwaye ubeke isixhobo ngokomzobo kwisinyathelo 2. Cima i-silk layer emva kokudweba.Phinda kwakhona de zonke iileya zizotyiwe.
Inyathelo lesi-6: tshintshela kwiPCB ephezulu kunye neBOT PCB kwiProtel kwaye uzidibanise zibe ngumfanekiso omnye.
Inyathelo lesi-7: sebenzisa umshicileli welaser ukuprinta umaleko ongaphezulu kunye namaleko asezantsi kwifilimu ebonakalayo (1:1 ratio), kodwa ifilimu ekuloo PCB, kwaye uthelekise ukuba kukho impazamo.Ukuba unyanisile, uya kuphumelela.
Ibhodi yokukopa efana nebhodi yokuqala yazalwa, kodwa yagqitywa nje ngesiqingatha.Kufuneka kwakhona sivavanye ukuba ukusebenza kobugcisa bombane kwibhodi kuyafana na naleyo yebhodi yokuqala.Ukuba iyafana, yenziwe ngokwenene.
Qaphela: ukuba ibhodi ye-multilayer, kufuneka ihlanjululwe ngokucophelela kwinqanaba langaphakathi, kwaye uphinde ulandele amanyathelo okukopisha ukusuka kwisinyathelo sesi-3 ukuya kwisinyathelo sesi-5. Ngokuqinisekileyo, igama lomfanekiso likwahluke.Kufuneka kumiselwe ngokwenani leeleya.Ngokubanzi, ukukopishwa kwebhodi enamacala amabini kulula kakhulu kunebhodi ye-multilayer, kwaye ulungelelwaniso lwebhodi ye-multilayer ithanda ukungachanekanga, ngoko ke ukukopishwa kwebhodi ye-multilayer kufuneka kuqaphele kwaye kuqaphele umngxuma wangaphakathi kunye ne-Kulula ukuba neengxaki kunye nemingxunya ephumayo).
Indlela yokukopa ibhodi enamacala amabini:
1. Skena umphezulu ongaphezulu nosezantsi webhodi yesekethe, kwaye ugcine imifanekiso emibini ye-BMP.
2. Vula isoftware yebhodi yokukopisha, cofa "ifayile" kunye "nemephu yesiseko evulekileyo" ukuvula umfanekiso oskeniweyo.Yandisa isikrini ngephepha, bona iphedi, cinezela PP ukubeka iphedi, bona umgca, kwaye ucinezele i-PT ukuya kwindlela Kanye njengomzobo womntwana, zoba kanye kule software, kwaye ucofe "gcina" ukuvelisa ifayile ye-B2P.
3. Cofa “ifayile” kwaye “vula ezantsi” kwakhona ukuze uvule imephu yombala eskeniweyo yomnye umaleko;4. Cofa "ifayile" kwaye "vula" kwakhona ukuze uvule ifayile ye-B2P egcinwe ngaphambili.Sibona ibhodi esandul 'ukukopishwa, efakwe kulo mfanekiso - ibhodi yePCB efanayo, imingxuma ikwindawo efanayo, kodwa uxhulumaniso lwesiphaluka luhluke.Ngoko sicinezela "iinketho" - "Izicwangciso zeLayer", apha cima isiphaluka kunye noshicilelo lwesikrini somgangatho ophezulu wokubonisa, ushiye kuphela i-multi-layer vias.5. I-vias kumaleko angaphezulu ziyafana nezo zikumaleko asezantsi.
Inqaku kunye nemifanekiso evela kwi-intanethi, ukuba kukho naluphi na ulwaphulo pls kuqala uqhagamshelane nathi ukuze ucime.
I-NeoDen ibonelela ngezisombululo zomgca wendibano ye-SMT epheleleyo, kubandakanywa i-oven ye-SMT reflow, umatshini wokuthengisa amaza, umatshini wokukhetha kunye nendawo, umshicileli we-solder paste, isilayishi se-PCB, i-PCB yokothula, i-chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, Isixhobo somgca we-SMT, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl.njl naluphi na uhlobo oomatshini be-SMT onokubafuna, nceda uqhagamshelane nathi ngolwazi oluthe kratya:
IHangzhou NeoDen Technology Co., Ltd
Web2:www.neodensmt.com
I-imeyile:info@neodentech.com
Ixesha lokuposa: Jul-20-2020