I-SMT yitekhnoloji ye-surface Mount, okwangoku yeyona teknoloji idumileyo kunye nenkqubo kwishishini lokuhlanganisa i-elektroniki.Ukubekwa kwe-SMT kubhekiselele kuthotho lweenkqubo ezisekelwe kwi-PCB ngokufutshane.PCB ithetha ibhodi yesekethe eprintiweyo.
Inkqubo
Amacandelo enkqubo esisiseko ye-SMT: ushicilelo lwe-solder paste ->Umatshini wokuxhoma we-SMTukubekwa -> phezu kwe-oveni yokunyanga ->reflow oveni-soldering –> AOI optical inspection –> ukulungisa –> sub-board –> grinding board –> ibhodi yokuhlamba.
1. Ukuprintwa kwe-Solder paste: Indima yayo kukuvuza i-tin-free paste kwi-pads ye-PCB, ukulungiselela ukuwelda kwamacandelo.Izixhobo ezisetyenzisiweyo ngumatshini wokuprinta isikrini, obekwe phambili kumgca wokuvelisa we-SMT.
2. I-chip mounter: indima yayo kukufaka ngokuchanekileyo amacandelo endibano yomphezulu kwindawo emiselweyo yePCB.Izixhobo ezisetyenzisiweyo yi-mounter, efumaneka kumgca wokuvelisa i-SMT emva komatshini wokushicilela isikrini.
3. Ngaphezulu kwe-oven ukunyanga: indima yayo kukunyibilikisa i-adhesive ye-SMD, ukwenzela ukuba amacandelo endibano yomphezulu kunye nebhodi ye-PCB ihlanganiswe ngokuqinileyo.Izixhobo ezisetyenziselwa ukunyanga i-oven, ebekwe kumgca wemveliso ye-SMT emva komatshini wokubeka.
4. Reflow i-oven soldering: indima yayo kukunyibilikisa i-solder paste, ukwenzela ukuba amacandelo endibano yomphezulu kunye nebhodi ye-PCB idibaniswe ngokuqinileyo kunye.Izixhobo ezisetyenzisiweyo yi-oven yokuphinda iphinde iphinde ifakwe, ibekwe kumgca wemveliso ye-SMT emva kwebhondi.
5. Umatshini we-SMT AOIukuhlolwa okubonakalayo: indima yayo kukuhlanganisa ibhodi yePCB yomgangatho wokuwelda kunye nokuhlolwa komgangatho wendibano.Izixhobo ezisetyenzisiweyo kukuhlola okuzenzekelayo (i-AOI), umthamo womyalelo udla ngokuba ngaphezu kwamawaka alishumi, umthamo womyalelo uncinci ngokuhlola ngesandla.Indawo ngokweemfuno zokubhaqwa, inokulungiswa kumgca wemveliso kwindawo efanelekileyo.Ezinye kwi-soldering ye-reflow ngaphambili, ezinye kwi-solder ye-reflow emva.
6. Ugcino: indima yalo kukubona ukusilela kwebhodi yePCB ukuba iphinde isebenze.Izixhobo ezisetyenzisiweyo ziziintsimbi zokuthambisa, iindawo zokusebenzela ngokutsha, njl. njl. Iqwalaselwe kuhlolo lwe-AOI emva koko.
7. I-Sub-board: indima yayo kukunqumla i-multi-linked board PCBA, ukuze ihlulwe ukuba yenze umntu ohlukeneyo, ngokubanzi usebenzisa i-V-cut kunye nendlela yokusika umatshini.
8. Ibhodi yokusila: indima yayo kukukrazula iindawo ze-burr, ukwenzela ukuba zibe zigudi kwaye zibe flat.
9. Ibhodi yokuhlamba: indima yayo kukudibanisa ibhodi yePCB ngaphezu kweentsalela ze-welding ezinobungozi ezifana ne-flux esusiwe.Ukwahlulwe kwi-manual yokucoca kunye nokucoca umatshini wokucoca, indawo ayinakulungiswa, ingaba kwi-intanethi, okanye ingabikho kwi-intanethi.
Iimpawu zeNeoDen10khetha kwaye ubeke umatshini
I-1.Ixhobisa ikhamera yekhamera ephindwe kabini + ikhamera yecala eliphindwe kabini elichanekileyo elihambayo liqinisekisa isantya esiphezulu kunye nokuchaneka, isantya sangempela ukuya kwi-13,000 CPH.Ukusebenzisa i-algorithm yexesha lokwenene lokubala ngaphandle kweeparamitha ezibonakalayo zokubala ngesantya.
I-2.Ngaphambili nangasemva kunye ne-2 isizukulwana sesine isizukulwana esiphezulu se-high speed flying flying camera systems, i-US ON sensors, i-28mm lens yezoshishino, i-flying shots kunye nokuqaphela ukuchaneka okuphezulu.
I-3.8 iintloko ezizimeleyo ezinenkqubo yokulawula i-loop evaliweyo ngokupheleleyo yonke i-8mm feeder pick up ngaxeshanye, isantya ukuya kwi-13,000 CPH.
I-4.Inkxaso ye-1.5M yokubekwa kwebar yokukhanya kwe-LED (uqwalaselo olukhethwayo).
5.Phakamisa i-PCB ngokuzenzekelayo, igcina i-PCB kwinqanaba elifanayo lomphezulu ngexesha lokubeka, uqinisekise ukuchaneka okuphezulu.
Ixesha lokuposa: Jun-09-2022