Ulwazi oluNxulumene neOven

Hlaziya ulwazi olunxulumene ne-oven

I-Reflow soldering isetyenziselwa indibano ye-SMT, eyinxalenye ephambili yenkqubo ye-SMT.Umsebenzi wayo kukunyibilikisa i-solder paste, ukwenza amacandelo endibano yomphezulu kunye ne-PCB idityaniswe ngokuqinileyo kunye.Ukuba ayinakulawulwa kakuhle, iya kuba nefuthe elibi ekuthembekeni kunye nobomi benkonzo yeemveliso.Zininzi iindlela zokuwelding kwakhona.Iindlela zangaphambili ezidumileyo zi-infrared kunye ne-gas-phase.Ngoku abaninzi abavelisi basebenzisa i-welding ye-hot reflow welding, kwaye ezinye iziganeko eziphambili okanye ezithile zisebenzisa iindlela zokuphinda zibuyele, ezifana ne-hot core plate, ukukhanya okumhlophe kugxininise, i-oven ethe nkqo, njl.

1. I-welding ye-air reflow eshushu

Ngoku, uninzi lwamaziko amatsha okuphinda ajike abizwa ngokuba zii-convection ezinyanzeliswayo zokuhambisa umoya oshushu.Isebenzisa ifeni yangaphakathi ukuvuthela umoya oshushu okanye ujikeleze ipleyiti yendibano.Enye inzuzo yesi sithando somlilo kukuba ngokuthe ngcembe kwaye ngokuqhubekayo inika ukushisa kwi-plate yendibano, kungakhathaliseki ukuba umbala kunye nokuthungwa kweendawo.Nangona, ngenxa yobunzima obahlukeneyo kunye nokuxinana kwecandelo, ukufunxa ubushushu kunokwahluka, kodwa isithando somlilo esinyanzelweyo siyafudumala ngokuthe ngcembe, kwaye umahluko wobushushu kwiPCB enye awahlukanga kakhulu.Ukongeza, isithando somlilo sinokulawula ngokungqongqo ubushushu obuphezulu kunye nezinga lobushushu lejika elibekiweyo lobushushu, elibonelela ngendawo engcono yokuzinza kwendawo kunye nenkqubo ye-reflux elawulwa ngakumbi.

2. Ukuhanjiswa kobushushu kunye nemisebenzi

Kwinkqubo ye-welding air reflow welding, i-solder paste kufuneka ihambe ngezi zigaba zilandelayo: i-solvent volatilization;ukususwa kwe-oksidi kumphezulu we-weldment;i-solder paste iyanyibilika, i-reflow kunye ne-solder paste yokupholisa, kunye nokuqiniswa.Ijika eliqhelekileyo lobushushu (Iprofayili: ibhekisa kwigophe lokuba iqondo lokushisa le-solder joint kwi-PCB litshintsha kunye nexesha xa lidlula kwisithando somlilo) sahlulwe kwindawo yokufudumeza, indawo yokugcina ubushushu, indawo yokubuyisela, kunye nendawo yokupholisa.(jonga ngasentla)

① Indawo yokushisa kwangaphambili: injongo yendawo yokutshisa i-preheating i-PCB kunye namacandelo, ukuphumeza ibhalansi, kunye nokususa amanzi kunye ne-solvent kwi-solder paste, ukuze kuthintelwe ukuwa kwe-solder kunye ne-solder spatter.Iqondo lokunyuka kweqondo lobushushu liya kulawulwa phakathi koluhlu olufanelekileyo (ngokukhawuleza kakhulu kuya kuvelisa ukutshitshiswa kwe-thermal, njengokuqhekeka kwe-multilayer ceramic capacitor, ukutshiza kwe-solder, ukwenza iibhola ze-solder kunye ne-solder joints kunye ne-solder engonelanga kwindawo engadityaniswanga kwi-PCB yonke. Ukucotha kakhulu kuya kuwenza buthathaka umsebenzi wokuguquguquka).Ngokuqhelekileyo, izinga eliphezulu lokunyuka kweqondo lokushisa ngu-4 ℃ / sec, kwaye izinga lokunyuka libekwe njenge-1-3 ℃ / sec, elisemgangathweni we-ECs Ungaphantsi kwe-3 ℃ / sec.

② Indawo yogcino lobushushu (esebenzayo): ibhekisa kwindawo ukusuka kwi-120 ℃ ukuya kwi-160 ℃.Eyona njongo iphambili kukwenza ubushushu becandelo ngalinye kwi-PCB ithande ukufana, ukunciphisa umahluko weqondo lobushushu kangangoko kunokwenzeka, nokuqinisekisa ukuba i-solder inokoma ngokupheleleyo phambi kokufikelela kubushushu bokubuyisela kwakhona.Ekupheleni kwendawo yokugquma, i-oxide kwi-solder pad, ibhola ye-solder paste, kunye ne-component pin iya kususwa, kwaye ubushushu bebhodi yesekethe yonke iya kulungelelaniswa.Ixesha lokucubungula malunga nemizuzwana ye-60-120, kuxhomekeke kubume be-solder.umgangatho we-ECS: 140-170 ℃, max120sec;

③ Indawo yokuhanjiswa kwakhona: iqondo lobushushu lesifudumezi kule ndawo libekwe kwelona nqanaba liphezulu.Ubushushu obuphezulu be-welding buxhomekeke kwi-solder paste esetyenzisiweyo.Kuyacetyiswa ngokubanzi ukongeza i-20-40 ℃ kwindawo yokunyibilika kwiqondo lobushushu lentlama ye-solder.Ngeli xesha, i-solder kwi-solder paste iqala ukunyibilika kwaye ihamba kwakhona, ithatha indawo ye-flux ye-liquid ukuze imanzise i-pad kunye namacandelo.Ngamanye amaxesha, ummandla ukwahlulahlula ube yimimandla emibini: ummandla onyibilikayo kunye nommandla wokubuyisela kwakhona.Ijika elilungileyo lobushushu kukuba indawo egutyungelwe yi "ndawo yencam" ngaphaya kwendawo yokunyibilika yesolder yeyona incinci kwaye i-symmetrical, ngokuqhelekileyo, ixesha elingaphezulu kwe-200 ℃ yi-30-40 sec.Umgangatho we-ECS yi-peak temp.: 210-220 ℃, uluhlu lwexesha ngaphezu kwe-200 ℃: 40 ± 3sec;

④ Indawo yokupholisa: ukupholisa ngokukhawuleza kunokwenzeka kuya kunceda ukufumana i-solder ekhanyayo kunye nemilo epheleleyo kunye ne-angle yokudibanisa ephantsi.Ukupholisa okucothayo kuya kukhokelela ekubolekeni ngakumbi kwepadi kwitoti, okukhokelela kumalungu angwevu narhabaxa e-solder, kwaye ade akhokelele ekungcoleni kwetoti kunye nokuncamathela okubuthathaka kwe-solder.Izinga lokupholisa jikelele lingaphakathi - 4 ℃ / sec, kwaye inokupholiswa malunga ne-75 ℃.Ngokubanzi, ukupholisa ngenkani ngefeni yokupholisa kuyafuneka.

3. Izinto ezahlukeneyo ezichaphazela ukusebenza kwe-welding

Izinto zobuchwepheshe

Welding pretreatment indlela, uhlobo unyango, indlela, ubukhulu, inani leeleya.Ingaba iyatshisa, inqunyulwe okanye iqhutywe ngezinye iindlela ngexesha elivela kunyango ukuya kwi-welding.

Uyilo lwenkqubo ye-welding

Indawo ye-Welding: ibhekisela kubungakanani, i-gap, ibhanti yesikhokelo se-gap (i-wiring): imilo, i-thermal conductivity, amandla obushushu bento edibeneyo: ibhekisela kulwalathiso lwe-welding, isikhundla, uxinzelelo, i-bonding state, njl.

Iimeko zokuwelda

Ibhekisa kubushushu be-welding kunye nexesha, iimeko zokufudumeza kwangaphambili, ukufudumeza, isantya sokupholisa, imowudi yokufudumeza i-welding, uhlobo lomthwali womthombo wobushushu (ubude be-waveleng, isantya sokuqhuba ubushushu, njl.njl.)

izinto zokuwelda

I-Flux: ukubunjwa, ugxininiso, umsebenzi, indawo yokunyibilika, indawo yokubilisa, njl

I-Solder: ukubunjwa, isakhiwo, umxholo wokungcola, indawo yokunyibilika, njl

Isiseko sesinyithi: ukubunjwa, isakhiwo kunye ne-thermal conductivity yesiseko sesinyithi

I-Viscosity, ubunzima obuthile kunye neempawu zethixotropic ze-solder paste

Izinto eziphathekayo, uhlobo, intsimbi yokugubungela, njl.

Inqaku kunye nemifanekiso evela kwi-intanethi, ukuba kukho naluphi na ulwaphulo pls kuqala uqhagamshelane nathi ukuze ucime.
I-NeoDen ibonelela ngezisombululo zomgca wendibano ye-SMT epheleleyo, kubandakanywa i-oven ye-SMT reflow, umatshini wokuthengisa amaza, umatshini wokukhetha kunye nendawo, umshicileli we-solder paste, isilayishi se-PCB, i-PCB yokothula, i-chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, Isixhobo somgca we-SMT, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl.njl naluphi na uhlobo oomatshini be-SMT onokubafuna, nceda uqhagamshelane nathi ngolwazi oluthe kratya:

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