1. Imvelaphi
I-soldering ye-wave isetyenziswe kwaye ifudunyezwe nge-solder etyhidiweyo kwizikhonkwane zamacandelo.Ngenxa yentshukumo ehambelanayo ye-wave crest kunye ne-PCB kunye "nokuncamathela" kwe-solder etyhidiweyo, inkqubo yokuthengisa i-wave wave inzima kakhulu kune-reflow welding.Kukho iimfuneko zesithuba sephini, ubude bokwandiswa kwephini kunye nobukhulu bepakethi ekufuneka idityaniswe.Kukwakho iimfuneko zendlela yoyilo, izithuba kunye noqhagamshelo lwemingxuma ekhwelayo kumphezulu webhodi yePCB.Ngamafutshane, inkqubo ye-wave soldering ihlwempuzekile kwaye ifuna umgangatho ophezulu.Isivuno se-welding ngokusisiseko sixhomekeke kuyilo.
2. Iimfuno zokupakisha
a.Amacandelo eentaba alungele ukuthengiswa kwamaza kufuneka abe neziphelo ze-welding okanye iziphelo ezikhokelayo eziveziweyo;Ipakethe yokucoca umzimba womhlaba (Yima) <0.15mm;Ubude <4mm iimfuno ezisisiseko.
Izinto zokunyuka ezihlangabezana nale miqathango ziquka:
I-0603 ~ 1206 ukuxhathisa kwe-chip kunye nezinto ze-capacitance ngaphakathi koluhlu lobungakanani bephakheji;
I-SOP eneziko elikhokelayo lomgama ≥1.0mm kunye nobude <4mm;
I-Chip inductor enobude ≤4mm;
I-coil chip inductor engavezwanga (uhlobo C, M)
b.I-compact pin fitting element ilungele i-wave soldering yiphakheji enomgama omncinci phakathi kwezikhonkwane ezikufutshane ≥1.75mm.
[Amagqabantshintshi]Ubuncinci bezithuba ezifakiweyo zisisiseko esamkelekileyo sokuthengiswa kwamaza.Nangona kunjalo, ukuhlangabezana neyona mfuno incinci yesithuba akuthethi ukuba ukuwelda okukumgangatho ophezulu kunokufezekiswa.Ezinye iimfuno ezinje ngesalathiso soyilo, ubude belothe ephuma kumphezulu wokuwelda, kunye nesithuba seepadi kufuneka kuhlangatyezwane nazo.
I-Chip Mount element, ubungakanani bephakheji <0603 ayifanelekanga ukubethelwa kwamaza, kuba umsantsa phakathi kweziphelo ezimbini zento encinci kakhulu, kulula ukwenzeka phakathi kweziphelo ezimbini zebhulorho.
I-Chip Mount element, ubungakanani bepakethe> 1206 ayifanelekanga ukuthengiswa kwamaza, kuba i-wave soldering ayikuko ukufudumeza okungalinganiyo, ubungakanani obukhulu bokuxhathisa i-chip kunye ne-capacitance element kulula ukuqhekeka ngenxa yokungahambelani kwe-thermal.
3. Isikhokelo sothumelo
Phambi koyilo lwamacandelo kumphezulu we-soldering ye-wave, isalathiso sokudluliselwa kwe-PCB ngesithando somlilo kufuneka simiselwe kuqala, esiyi-"referensi yenkqubo" yoyilo lwamacandelo afakiweyo.Ke ngoko, isalathiso sothumelo kufuneka simiselwe phambi kokucwangciswa kwamacandelo kumphezulu we-solder wave.
a.Ngokubanzi, isikhokelo sothumelo kufuneka sibe kwicala elide.
b.Ukuba i-layout ine-pin eshinyeneyo yokufaka isinxibelelanisi (isithuba <2.54mm), isalathiso soyilo lwesiqhagamshelo kufuneka sibe sisikhokelo sothumelo.
c.Kumphezulu we-wave soldering, isikrini sesilika okanye utolo lwefoyile yobhedu lusetyenziselwa ukuphawula isalathiso sothumelo lokuchonga ngexesha le-welding.
[Amagqabantshintshi]Isalathiso soyilo lwecandelo lubaluleke kakhulu kwi-soldering yamaza, kuba i-wave soldering ine-tin kunye ne-tin ngaphandle kwenkqubo.Ke ngoko, uyilo kunye ne-welding kufuneka ibe kwicala elinye.
Esi sisizathu sokumakisha isalathiso sokuhanjiswa kwe-wave soldering.
Ukuba unokumisela isalathiso sothumelo, njengoyilo lwe-tin pad ebiweyo, isalathiso sokuhanjiswa asinakuchongwa.
4. Indlela yoyilo
Isalathiso soyilo samacandelo ikakhulu sibandakanya amacandelo etshiphu kunye neziqhagamshelo ezininzi.
a.Umgama omde we-PACKAGE yezixhobo ze-SOP kufuneka ulungelelaniswe ngokuhambelana nokuhanjiswa kwe-welding ye-welding ye-wave peak, kwaye umgama omde wamacandelo e-chip kufuneka ube nge-perpendicular kwi-transmission direction ye-welding peak welding.
b.Kwiinxalenye ezininzi ze-plug-in ze-pin-pin, isalathiso soqhagamshelo lweziko le-jack kufuneka sibe yi-perpendicular ukuya kwi-transmission direction ukunciphisa isenzeko esidadayo sesinye isiphelo secandelo.
[Amagqabantshintshi]Ngenxa yokuba umzimba wepakethi ye-patch element inefuthe lokuthintela kwi-solder etyhidiweyo, kulula ukukhokelela kwi-welding yokuvuza kwezikhonkwane emva komzimba wephakheji (icala le-destin).
Ke ngoko, iimfuno ezibanzi zebhodi yokupakisha ayichaphazeli isalathiso sokuhamba koyilo lwe-solder etyhidiweyo.
Ukudityaniswa kweziqhagamshelo ze-multi-pin kwenzeka ngokukodwa ekupheleni kwe-de-tinning / ecaleni lephini.Ukulungelelaniswa kwezikhonkwane zokudibanisa kwindlela yokuhanjiswa kunciphisa inani leephini zokuqhawula kwaye, ekugqibeleni, inani leeBridges.Kwaye ke ukuphelisa ibhulorho ngokupheleleyo ngoyilo lwe-tin pad ebiweyo.
5. Iimfuno zesithuba
Kumalungu epetshi, isithuba sepadi sibhekiselele kwisithuba phakathi kweempawu eziphezulu zokuxhoma (kubandakanywa neepadi) zeepakethe ezimeleneyo;Kumalungu eplagi, isithuba sepad sibhekisa kwisithuba phakathi kweepads.
Kumacandelo e-SMT, i-pad spacing ayiqwalaselwanga kuphela kwi-bridge aspect, kodwa ibandakanya umphumo wokuthintela we-package body enokubangela ukuvuza kwe-welding.
a.Isithuba sePad samalungu eplagi kufuneka jikelele sibe ≥1.00mm.Ukudibanisa i-plug-in ye-fine-pitch, ukunciphisa okuthobekileyo kuvunyelwe, kodwa ubuncinci akufanele bube ngaphantsi kwe-0.60mm.
b.Isithuba phakathi kwepadi yezinto ezifakwe kwiplagi kunye nephedi yamacandelo epatch ye-wave soldering kufuneka ibe ≥1.25mm.
6. Iimfuno ezikhethekileyo zoyilo lwephedi
a.Ukuze kuncitshiswe ukuvuza kwe-welding, kucetyiswa ukuba uyile iipads ze-0805/0603, SOT, SOP kunye ne-tantalum capacitors ngokwezi mfuno zilandelayo.
Kumacandelo e-0805/0603, landela uyilo olucetyiswayo lwe-IPC-7351 (iphedi eyandisiweyo nge-0.2mm kunye nobubanzi buncitshiswe nge-30%).
Kwi-SOT kunye ne-tantalum capacitors, iipads kufuneka zandiswe nge-0.3mm ngaphandle kunezo ziyilo oluqhelekileyo.
b.kuba ipleyiti metallized umngxuma, ukomelela joint solder ikakhulu kuxhomekeke uqhagamshelo umngxuma, ububanzi pad ring ≥0.25mm.
c.Kwimingxuma engeyiyo eyentsimbi (iphaneli enye), ukomelela kwejoyinti yesolder kuxhomekeke kubungakanani bepadi, ngokubanzi ububanzi bepadi kufuneka bube ngaphezu kwe-2.5 amaxesha okuvulwa.
d.Ukupakishwa kwe-SOP, iphedi yobusela betoti kufuneka iyilwe ekupheleni kwephini.Ukuba isithuba se-SOP sikhulu kakhulu, uyilo lwephedi yobusela betoti lunokuba lukhulu.
e.kuba isidibanisi multi-pin, kufuneka uyilwe ekupheleni inkonkxa yetoti pad.
7. ubude bokukhokela
a.Ubude obuphambili bunobudlelwane obukhulu kunye nokwakhiwa koqhagamshelwano lwebhulorho, encinci isithuba se-pin, impembelelo enkulu.
Ukuba isithuba sephini yi-2 ~ 2.54mm, ubude belothe kufuneka bulawuleke kwi-0.8 ~ 1.3mm
Ukuba isithuba sephini singaphantsi kwe-2mm, ubude belothe kufuneka bulawuleke nge-0.5 ~ 1.0mm
b.Ubude bokwandiswa kwesikhokelo bunokudlala indima kuphela phantsi komqathango wokuba icandelo loyilo lwesalathiso lihlangabezana neemfuno zokubethelwa kwamaza, kungenjalo isiphumo sokuphelisa ibhulorho asicacanga.
[Amagqabantshintshi]Impembelelo yobude obukhokelela ekudibaneni kwebhulorho inzima ngakumbi, ngokuqhelekileyo> 2.5mm okanye <1.0mm, impembelelo yokudibanisa ibhuloho incinci, kodwa phakathi kwe-1.0-2.5m, impembelelo inkulu.Oko kukuthi, kusenokwenzeka ukuba ibangele isiganeko sokuvala ibhulorho xa ingende kakhulu okanye imfutshane kakhulu.
8. Ukusetyenziswa kwe-inki ye-welding
a.Sihlala sibona imizobo ye-inki eprintiweyo kwiphedi yesinxibelelanisi, uyilo olunjalo lukholelwa ngokubanzi ukuba lunciphisa isenzeko sokuvala.Umatshini usenokuba umphezulu womaleko we-inki urhabaxa, kulula ukufunxa ngakumbi uguquguquko, ukuguquguquka kubushushu obuphezulu be-solder volatilization kunye nokwakheka kwamaqamza okuzahlula, ukuze kuncitshiswe ukwenzeka kwebhulorho.
b.Ukuba umgama phakathi pin pads <1.0mm, uyakwazi ukuyila solder blocking inki umaleko ngaphandle iphedi ukunciphisa amathuba ebhulorho, ikakhulu ukuphelisa iphedi eshinyeneyo embindini webhulorho phakathi kwamalungu solder, kunye main ukupheliswa iqela pad eshinyeneyo ekupheleni ibhulorho solder joint imisebenzi yabo eyahlukileyo.Ke ngoko, isithuba se-pin sincinci ngokwentelekiso pad eshinyeneyo, i-inki ye-ink kunye ne-steal solder pad kufuneka zisetyenziswe kunye.
Ixesha lokuposa: Nov-29-2021