Izixhobo zeChip zincinci kwaye zincinci ngaphandle kwesikhokelo okanye iintambo ezimfutshane, ezifakwe ngqo kwiPCB kwaye zizixhobo ezikhethekileyoiteknoloji yokuhlanganisa umphezulu.Amacandelo e-chip anenzuzo yobukhulu obuncinci, ubunzima obulula, ubuninzi bofakelo oluphezulu, ukuthembeka okuphezulu, ukuxhathisa okunamandla kwe-seismic, iimpawu ezilungileyo zefrikhwensi ephezulu, amandla okumelana nokuphazamiseka, kodwa nangenxa yomthamo wabo omncinci kakhulu, uloyiko lobushushu, uloyiko lokubamba. , ezinye izikhonkwane ezikhokelayo zininzi, kunzima ukuqhaqha, okuzisa ubunzima obukhulu ekugcinweni.
Iindlela eziqhelekileyo zokuqhaqha zimi ngolu hlobo lulandelayo.Kubalulekile ukuba uqaphele ukuba: kwinkqubo yokufudumeza kwendawo, kufuneka sithintele umbane we-static, kwaye amandla entsimbi yombane kunye nobukhulu bentloko yentsimbi kufuneka ifaneleke.
I. Indlela yokufunxa isono sobhedu
Umnatha wobhedu wokufunxa wenziwa ngocingo olusulungekileyo lobhedu olulukiweyo kwibhanti edibeneyo, inokutshintshwa ngomgca wokhuselo lwesinyithi wentambo okanye imicu engaphezulu yocingo oluthambileyo.Xa usebenzisa, gubungela ikhebula kwi-multi-pin kwaye usebenzise i-rosin alcohol flux.Ukushisa ngentsimbi ye-soldering, kwaye utsale ucingo, i-solder ezinyaweni ibhengezwa ngocingo.Sika ucingo kunye nesolder kwaye uphinde amaxesha amaninzi ukufunxa i-solder.I-solder kwi-pin iyancipha ngokuthe ngcembe de i-pin yecandelo ihlulwe kwibhodi eprintiweyo.
II.Indlela ekhethekileyo yokuqhawula intloko yentsimbi yokukhetha kunye nokuthenga intloko yentsimbi ekhethekileyo "N" emise okwentsimbi, isiphelo sobubanzi benotshi (W) kunye nobude (L) sinokumiselwa ngokobungakanani bamacandelo adibeneyo.Intloko yentsimbi ekhethekileyo inokwenza i-solder yezikhonkwane ezikhokelayo kumacala omabini eendawo ezichithwayo zinyibilike ngexesha elifanayo, ukwenzela ukuba kube lula ukukhutshwa kwezinto ezichithwayo.Indlela eyenziwe ngokwayo yentloko yentsimbi kukukhetha ityhubhu ebomvu yobhedu kunye nobubanzi obungaphakathi obuhambelana nomphandle wentloko yentsimbi, ibambe isiphelo esinye nge-vice (okanye isando) kwaye uqhube umgodi omncinci, njengoko kuboniswe kuMzobo 1 (i-Figure 1). a).Emva koko iipleyiti ezimbini zobhedu (okanye iibhubhu zobhedu zinqunywe ngobude kwaye zicandwe) zisetyenziselwa ukucubungula ubungakanani obufanayo kunye neendawo eziqhekekileyo, kwaye imingxuma iqhutywe, njengoko kuboniswe kuMfanekiso 1 (b).Isiphelo sobuso bepleyiti yobhedu safakwa sicaba, sagudiswa sacoceka, saza sadityaniswa kwimilo njengoko kubonisiwe kuMfanekiso 1 (c) kunye neebholithi, ezazibekwe kwintloko yokuthambisa.Intloko ye-soldering ingasetyenziselwa ukufudumeza kunye nokudipha i-tin.Kumacandelo eflake exande enamabala amabini e-solder, okoko nje intloko yentsimbi ethengiswayo ibethelwa kwimilo ethe tyaba, ukuze ububanzi bobuso besiphelo bulingane nobude becandelo, amabala amabini e-solder anokufudunyezwa kwaye anyibilike ngaxeshanye. , kunye namacandelo e-flake anokususwa.
III.Indlela yokucoca i-solder
Xa i-solder ishushu nge-antistatic soldering iron, i-solder ihlanjululwa nge-toothbrush (okanye i-oyile ye-oyile, i-brush yepeyinti, njl.), kunye namacandelo anokususwa ngokukhawuleza.Emva kokuba amacandelo asusiwe, ibhodi eprintiweyo kufuneka ihlambuluke ngexesha lokuthintela isiphaluka esifutshane sezinye iindawo ezibangelwa yi-tin eseleyo.
I-NeoDen ibonelela ngesisombululo esipheleleyo somgca wendibano ye-SMT, kubandakanywaSMT reflow oven, umatshini wokuthengisa amaza, ukhethe kwaye ubeke umatshini, umshicileli we-solder paste, i-oven yokukhupha, i-PCB loader, i-PCB yokothula, i-chip mounter, Umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, izixhobo ze-SMT zokudibanisa, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl njl.
I-Zhejiang NeoDen Technology Co., Ltd
Iwebhu:www.smtneoden.com
I-imeyile:info@neodentech.com
Ixesha lokuposa: Jun-17-2021