Iindlela ezintandathu ze-SMT Patch Component Disassembly(II)

IV.Indlela yokutsala umkhondo
Le ndlela ifanelekile kwi-disassembly ye-chip - iisekethe ezihlanganisiweyo ezifakwe.Sebenzisa ucingo lwe-enameled lobukhulu obufanelekileyo, ngamandla athile, ngokusebenzisa i-gap yangaphakathi yepini yesekethe edibeneyo.Esinye isiphelo socingo lwe-enameled luqiniswe kwindawo kwaye enye iphelile ibanjwe ngesandla.Xa i-solder kwi-pin yesekethe edibeneyo iyanyibilika.Tsala ucingo olune-enameled "ukusika" i-solder joint kunye nezikhonkwane ze-IC zahlulwe kwi-PCB.
 
V. Umpu womoya we-soldering iron solder method
Lungisa iqondo lobushushu bompu womoya ukuya kuthi ga kwiqondo elingaphezulu kwama-500, umthamo womoya ophakathi, ukufudumeza okuqhubekayo kwemichilo emibini yetoti, i-solder iyanyibilika ngokupheleleyo emva kwemizuzwana engaphezu kweshumi, kulula ukuyisusa ngeentambo ezitsolo, kodwa le ndlela ilula. ukuchaphazela isiphaluka esijikelezileyo, ukusebenza ngononophelo.Okulandelayo ngokwesixhobo esitsha, okokuqala ngamanzi e-rosin besmear ikwintambo ye-solder, okanye sebenzisa umgubo werosin othe saa kwiphedi yokudibanisa, kunye nentsimbi ecocekileyo yokufudumeza ipleyiti yokufudumeza yelothe, ukukhanya okumanzi okukhokelela, inkonkxa yokukhokela ayicacanga ncam, xa welding intambo yokufudumeza intloko, zama ukuya ngasemdeni, yenza intsalela yetoti yelethe kwipleyiti yewelding peripheral.Sebenzisa isixhobo esincinci ukucoca i-rosin debris kwi-pad lead.Thatha iqhekeza le-IC entsha, ngoncedo lwe-rosin kwi-tin kwi-IC pin, i-pin emanzi ukukhanya ngaphandle kwe-burr, i-IC ikwi-desktop, cinezela ngomnwe, wenze i-IC pin up inkuku encinci, ubeke i-IC are welding plate. , ngepini echongiweyo yepini ye-IC ephakathi, amehlo angekho mhle amaqabane angasebenzisa iglasi yokukhulisa ukubukela, Emva kokubeka intsimbi yentsimbi etsolo ingasetyenziselwa ukufudumeza itoti kumda wepadi, intloko yentsimbi yokuthambisa ityhala iphini ye-IC ngaphakathi. emva kokuba i-tin inyibilika, ukwenzela ukuba i-pin yenza i-Angle efanelekileyo kwi-pad.Kuyimfuneko ukuba udibanise ii-engile ezine diagonal kuqala, uphumle emva kwe-welding, uze udibanise ezinye iinyawo.Emva kwayo yonke i-welding, iglasi yokukhulisa ingasetyenziselwa ukujonga, kwaye inani elincinci letoti linokusetyenziswa kwiindawo ezimbi.

VI.Indlela yokususa i-tin absorber
Kukho iintlobo ezimbini zentsimbi yokuthambisa kunye ne-tin absorber.Xa i-absorber ye-tin eqhelekileyo isetyenzisiweyo, intonga ye-piston ye-tin absorber icinezelwe phantsi.Xa i-solder ye-solder yentsimbi yombane iyancibilika, umlomo wokufunxa we-tin absorber usondele kwindawo yokunyibilika, kwaye iqhosha lokukhulula le-tin absorber licinezelekile.Intonga yepiston yesibambisi senkcenkce iya kuphuma emva kwaye ifunxe inkonkxa etyhidiweyo.Ukuphindaphinda amaxesha amaninzi, kunokususwa kwibhodi eprintiweyo.

I-NeoDen ibonelela ngezisombululo ezipheleleyo zomgca we-SMT, kubandakanywa i-oven ye-SMT reflow, umatshini we-wave soldering, pick and place machine, solder paste printer, Reflow oven,PCB umlayishi, PCB yokothula,chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, izixhobo ze-SMT zomgca wokuhlanganisa, ukuveliswa kwe-PCB Izixhobo ze-SMT zangasese, njl.

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