Ulwazi olusisiseko lwe-SMT
1. I-Surface Mount Technology-SMT (i-Surface Mount Technology)
Yintoni i-SMT:
Ngokubanzi ibhekisa kusetyenziso lwezixhobo zokudityaniswa okuzenzekelayo ukuncamathisela ngokuthe ngqo kunye nohlobo lwetshiphu ye-solder kunye ne-miniaturized leadless okanye i-short-lead yomphezulu amacandelo/izixhobo (ekubhekiswa kuzo njenge-SMC/SMD, edla ngokubizwa ngokuba ngamacandelo etshiphu) kumphezulu webhodi yesekethe eprintiweyo. (PCB) Okanye obunye ubuchwephesha bokuhlanganisa i-elektroniki kwindawo echaziweyo kumphezulu we-substrate, ekwaziwa ngokuba yitekhnoloji yokunyuka komphezulu okanye itekhnoloji yokunyuswa komphezulu, ekubhekiselwa kuyo njenge-SMT (i-Surface Mount Technology).
I-SMT (i-Surface Mount Technology) bubuchwephesha bemizi-mveliso esakhulayo kushishino lwe-elektroniki.Ukunyuka kwayo kunye nophuhliso olukhawulezayo lutshintsho kushishino lwendibano ye-elektroniki.Yaziwa ngokuba yi "Rising Star" yoshishino lombane.Yenza indibano ye-elektroniki ngakumbi nangakumbi Xa ikhawuleza kwaye ilula, ngokukhawuleza nangokukhawuleza ukutshintshwa kweemveliso ezahlukeneyo ze-elektroniki, inqanaba eliphezulu lokudibanisa, kunye nexabiso eliphantsi, libe negalelo elikhulu kuphuhliso olukhawulezayo lwe-IT. iTekhnoloji yoLwazi) ishishini.
Itekhnoloji yokunyuka komphezulu iphuhliswe kwitekhnoloji yokwenziwa kweesekethe zamacandelo.Ukusukela ngo-1957 ukuza kuthi ga ngoku, uphuhliso lwe-SMT ludlule kwizigaba ezithathu:
Inqanaba lokuqala (1970-1975): Eyona njongo yobuchwephesha kukusebenzisa amacandelo etshiphu amancinci ekuveliseni nasekuveliseni umbane oxutyiweyo (obizwa ngokuba ziisekethe zefilimu eshinyeneyo eTshayina).Ngokwale mbono, i-SMT ibaluleke kakhulu ekudityanisweni kwenkqubo yokwenziwa kwemveliso kunye nophuhliso lobuchwepheshe beesekethe zenze igalelo elibalulekileyo;kwangaxeshanye, i-SMT iqalisile ukusetyenziswa ngokubanzi kwiimveliso zasekuhlaleni ezifana neewotshi zombane zequartz kunye nezibali zombane.
Inqanaba lesibini (1976-1985): ukukhuthaza i-miniaturization ngokukhawuleza kunye nokusebenza kwezinto ezininzi zeemveliso ze-elektroniki, kwaye yaqala ukusetyenziswa ngokubanzi kwiimveliso ezifana neekhamera zevidiyo, ii-headset radios kunye neekhamera zombane;ngelo xesha, inani elikhulu lezixhobo ezizenzekelayo zokuhlanganisa umphezulu zaphuhliswa Emva kophuhliso, iteknoloji yokufakela kunye nezixhobo zenkxaso yamacandelo e-chip nawo akhulile, abeka isiseko sophuhliso olukhulu lwe-SMT.
Inqanaba lesithathu (1986-ngoku): Injongo ephambili kukunciphisa iindleko kunye nokuphucula ngakumbi umlinganiselo wexabiso lentsebenzo yeemveliso zombane.Ngokukhula kobuchwepheshe be-SMT kunye nokuphuculwa kokuthembeka kwenkqubo, iimveliso zombane ezisetyenziswa emkhosini kunye notyalo-mali (izixhobo zonxibelelwano zekhompyutha yemoto izixhobo zoshishino) ziye zaphuhliswa ngokukhawuleza.Ngelo xesha, inani elikhulu lezixhobo zokuhlanganisana ezizenzekelayo kunye neendlela zenkqubo ziye zavela ukwenza amacandelo e-chip Ukukhula ngokukhawuleza kokusetyenziswa kwe-PCBs kukhawulezise ukuhla kweendleko ezipheleleyo zeemveliso ze-elektroniki.
2. Iimpawu ze-SMT:
①Ukuxinana okuphezulu kwendibano, ubungakanani obuncinci kunye nobunzima obulula beemveliso zombane.Umthamo kunye nobunzima bamacandelo e-SMD kuphela malunga ne-1/10 yezinto eziqhelekileyo zeplagi-in.Ngokuqhelekileyo, emva kokuba i-SMT yamkelwe, umthamo wemveliso ye-elektroniki uyancitshiswa ngama-40% ~ 60% kwaye ubunzima buncitshiswe ngama-60%.~80%.
②Ukuthembeka okuphezulu, amandla okuchasana nokungcangcazela, kunye nenqanaba eliphantsi le-solder yesiphene esidibeneyo.
③Iimpawu ezilungileyo zefrikhwensi ephezulu, ukunciphisa uphazamiseko lwe-electromagnetic kunye nerediyo.
④ Kulula ukuqonda i-automation kunye nokuphucula ukusebenza kakuhle kwemveliso.
⑤ Gcina izinto, amandla, izixhobo, abasebenzi, ixesha, njl.
3. Ukuhlelwa kweendlela zokunyuka kwendawo: Ngokweenkqubo ezahlukeneyo ze-SMT, i-SMT yahlulahlulwe kwinkqubo yokusabalalisa (i-wave soldering) kunye nenkqubo yokunamathisela i-solder (i-reflow soldering).
Umahluko wabo ophambili ngu:
①Inkqubo phambi kokuchwetheza yahlukile.Owokuqala usebenzisa i-patch glue kwaye umva usebenzisa i-solder paste.
②Inkqubo emva kokupakisha yahlukile.Owangaphambili udlula kwi-oven yokubuyisela ukunyanga iglu kwaye uncamathisele izinto kwibhodi yePCB.I-Wave soldering iyafuneka;le yokugqibela idlula kwi-oven yokuphinda ikhuphe i-soldering.
4. Ngokwenkqubo ye-SMT, inokwahlulwa ngokwezi ntlobo zilandelayo: inkqubo yokuxhoma kwicala elinye, inkqubo yokufakwa kwamacala amabini, inkqubo yokupakisha exutywe macala omabini.
①Hlanganisa usebenzisa izixhobo zokuxhoma phezulu kuphela
A. Idibaniso enecala-linye elinonyuko lomphezulu kuphela (inkqubo yokunyuswa kwecala-linye) Inkqubo: intlama yesoda yoshicilelo lwekhusi → izinto zokuxhoma → ukuphinda kufakwe i-solder
B. Idibaniso enamacala amabini anonyuso lomphezulu kuphela (inkqubo yokunyuswa kwamacala amabini) Inkqubo: intlama yesoda yoshicilelo lwekhusi → izixhobo zokunyusela → ukuphinda kufakwe i-solder → icala elingasemva → incama yesolda yoshicilelo lwekhusi → izixhobo zokunyusa
②Hlanganisa kunye nezinto zokunyuka komphezulu kwelinye icala kunye nomxube wezinto zokuxhoma umphezulu kunye nezinto ezinemingxuma kwelinye icala (inkqubo yokuhlanganisana emacaleni amabini)
Inkqubo 1: Ushicilelo lwekhusi intlama yesoda (kwicala eliphezulu) → ukunyuswa amacandelo → ukuphinda-phinda ukusoda → icala elingasemva → ukukhupha (icala elisezantsi) → ukunyuswa kwamalungu → ubushushu obuphezulu ukunyanga → icala elibuyisela umva → izixhobo ezifakwe ngesandla → ukusoda kwamaza
Inkqubo 2: Ushicilelo lwekhusi intlama yesoda (kwicala eliphezulu) → ukunyuswa kwezixhobo → ukuphinda kufakwe i-solder → iplagi yomatshini (kwicala eliphezulu) → icala elingasemva → ukukhupha (icala elisezantsi) → isiziba → ukunyanga ubushushu obuphezulu → ukuthambisa ngamaza
③Umphezulu ongaphezulu usebenzisa iinxalenye ezinemingxuma kunye nomphezulu ongezantsi usebenzisa izixhobo zokuxhoma umphezulu (inkqubo yokuhlanganisa exutywe macala amabini)
Inkqubo 1: Ukuhambisa → ukunyuswa kwamalungu → ukunyanga ubushushu obuphezulu → icala elingasemva → izixhobo zokufaka isandla → ukusoda kwamaza
Inkqubo 2: Umatshini wokufaka iplagi → icala elingasemva → ukuhambisa → isiziba → ukunyanga ubushushu obuphezulu → ukuthambisa ngamaza
Inkqubo ethile
1. Ukuhamba kwenkqubo yokudityaniswa komphezulu kwicala elinye Faka intlama ye-solder ukunyusela izinto kunye nokuphinda kufakwe i-solder
2. Umqukuqelo wenkqubo yokudityaniswa komphezulu omacala omabini A icala lisebenzisa intlama yesolder ukunyuswa kwezixhobo kunye neflap yesolder ephinda iqukunjelwe B icala lifaka intlama yesolder ukunyusela amacandelo kunye nokuphinda kufakwe i-solder.
3. Udibaniso oluxubene kwicala elinye (i-SMD kunye ne-THC zikwicala elinye) Icala lisebenzisa intlama ye-solder ukukhwela i-SMD reflow soldering.
4. Indibano enecala elinye elixubeneyo (i-SMD kunye ne-THC macala omabini e-PCB) Faka i-SMD encamathelayo kwicala le-B ukunyusela i-SMD encamathelayo yokunyanga i-flap A ecaleni faka i-THC B icala le-solder ye-wave wave.
5. Ukuxhoma okuxutyiweyo okumacala omabini (i-THC ikwicala A, omabini amacala A kunye no-B ane-SMD) Faka intlama ye-solder kwicala A ukukhwela i-SMD uze uqukuqelele ibhodi ye-solder B icala sebenzisa iglu ye-SMD ukugalela i-SMD iglu yokunyanga ibhodi A. icala ukufaka iTHC B Surface wave soldering
6. Indibano exutyiweyo enamacala amabini (i-SMD kunye ne-THC kumacala omabini ka-A no-B) A icala sebenzisa intlama ye-solder ukukhwelisa i-SMD reflow soldering flap B icala faka i-SMD glue efakela i-SMD intlama yokunyanga i-flap ukuwelda ngesandla ngesandla
Abahlanu.Ulwazi lwecandelo le-SMT
Iintlobo zecandelo le-SMT ezisetyenziswa ngokuqhelekileyo:
1. I-resistors ye-Surface Mount kunye ne-potentiometers: i-resistors ye-rectangular chip, i-cylindrical fixed resistors, i-networking resistant network networks, i-chip potentiometers.
2. I-Surface Mount capacitors: i-multilayer chip ceramic capacitors, i-tantalum electrolytic capacitors, i-aluminium electrolytic capacitors, i-mica capacitors
3. Ii-inductors ze-Surface Mount: ii-inductors zetshiphu zamanxeba, ii-multilayer chip inductors.
4. Amaso amagnetic: I-Chip Bead, i-Multilayer Chip Bead
5. Amanye amacandelo e-chip: i-chip multilayer varistor, i-thermistor ye-chip, i-chip surface wave filter, i-chip multilayer LC filter, i-chip multilayer line yokulibazisa.
6. Izixhobo ze-semiconductor ze-Surface mount mount: i-diodes, i-transistors encinci epakishweyo, i-outline encinci epakishwe iisekethe ezihlanganisiweyo ze-SOP, iphakheji yeplastiki ehamba phambili iisekethe ezidibeneyo ze-PLCC, i-quad flat package ye-QFP, i-ceramic chip carrier, i-gate array spherical package BGA, CSP (Chip Scale Package)
I-NeoDen ibonelela ngezisombululo zomgca wendibano ye-SMT epheleleyo, kubandakanywa i-oven ye-SMT reflow, umatshini wokuthengisa amaza, umatshini wokukhetha kunye nendawo, umshicileli we-solder paste, isilayishi se-PCB, i-PCB yokothula, i-chip mounter, umatshini we-SMT AOI, umatshini we-SMT SPI, umatshini we-SMT X-Ray, Isixhobo somgca we-SMT, imveliso ye-PCB Izixhobo ze-SMT ezisecaleni, njl.njl naluphi na uhlobo oomatshini be-SMT onokubafuna, nceda uqhagamshelane nathi ngolwazi oluthe kratya:
Ixesha lokuposa: Jul-23-2020