Iimbangela zeSekethe eziMfutshane ze-SMT kunye nezisombululo

Khetha kwaye ubeke umatshinikunye nezinye izixhobo ze-SMT kwimveliso kunye nokucubungula ziya kuvela izinto ezininzi ezimbi, ezifana nesikhumbuzo, ibhulorho, i-welding virtual, i-welding fake, ibhola yeediliya, i-tin bead njalo njalo.I-SMT ye-SMT yokucubungula isiphaluka esifutshane ixhaphake kakhulu kwisithuba esihle phakathi kwe-IC pins, ixhaphake kakhulu kwi-0.5mm nangaphantsi kwesithuba phakathi kwezikhonkwane ze-IC, ngenxa yesithuba esincinci, ukuyila kwetemplate engafanelekanga okanye ukuprinta kulula ukuvelisa ukushiyeka okuncinci.

Izizathu kunye nezisombululo:

Isizathu 1:Itemplate yestencil

Isisombululo:

Udonga lomngxuma we-mesh yensimbi luhamba kakuhle, kwaye unyango lwe-electropolishing luyafuneka kwinkqubo yokuvelisa.Ukuvulwa kwe-mesh kufuneka kube yi-0.01mm okanye i-0.02mm ububanzi kunokuvulwa kwe-mesh.Ukuvula i-conical inverted, ehambelana nokukhululwa okusebenzayo kwe-tin paste phantsi kwe-tin, kwaye inokunciphisa amaxesha okucoca i-mesh plate.

Unobangela 2: i-solder paste

Isisombululo:

I-0.5mm nangaphantsi kwe-pitch ye-IC solder paste kufuneka ikhethwe ngobukhulu be-20 ~ 45um, i-viscosity kwi-800 ~ 1200pa.S

Unobangela 3: Umshicileli wokuncamathisela we-Solderushicilelo

Isisombululo:

1. Uhlobo lwe-scraper: i-scraper ineentlobo ezimbini zeplastiki kunye ne-steel scraper.Ukuprintwa kwe-0.5 IC kufuneka kukhethe i-scraper yensimbi, ehambelana ne-solder paste eyenza emva kokushicilela.

2. Isantya sokushicilela: i-solder paste iya kuqhubela phambili kwi-template phantsi kwe-push ye-scraper.Isantya soshicilelo esikhawulezayo sifanelekile kwi-springback yetemplate, kodwa siya kuthintela ukuvuza kwe-solder paste;Kodwa isantya sicotha kakhulu, uncamathiselo lwe-solder aluyi kuqengqeleka kwitemplate, okukhokelela kwisisombululo esibi se-solder paste eprintwe kwi-solder pad.Ngesiqhelo, uluhlu lwesantya soshicilelo lwesithuba esihle yi-10 ~ 20mm/s

Imowudi yoshicilelo ye-3: okwangoku eyona modi yoshicilelo ixhaphakileyo yahlulwe yaba “kushicilelo loqhagamshelwano” kunye “noshicilelo olungaqhagamshelwanga”.
Kukho umsantsa phakathi template kunye PCB imo yoshicilelo yi "non-contact yoshicilelo", ixabiso gap jikelele 0.5 ~ 1.0mm, inzuzo yayo ifanelekile ezahlukeneyo viscosity solder paste.

Akukho msantsa phakathi koshicilelo lwethemplethi kunye nePCB ibizwa ngokuba “kuprinta lonxibelelwano”.Ifuna uzinzo lwesakhiwo ngokubanzi, ilungele ushicilelo oluchanekileyo eliphezulu tin template kunye PCB ukugcina umfowunelwa tyaba kakhulu, emva koshicilelo kunye nokwahlulwa PCB, ngoko le ndlela ukufezekisa ukuchaneka eliphezulu ushicilelo, ingakumbi ilungele isithuba esihle, ultra-fine. isithuba sokuprinta intlama ye-solder.

Isizathu 4: Umatshini we-SMTukuphakama kwentaba

Isisombululo:

Kuba 0.5mm IC ekufakeni kufuneka isetyenziswe 0 umgama okanye 0 ~ 0.1mm ukuphakama enyukayo, ukuze kuphetshwe ngenxa yokuphakama ukuphakama liphantsi kakhulu ukuze solder intlama ezenza ukudilika, okukhokelela reflux isiphaluka elifutshane.