Welding yi SMT chip inkqubo processing likhonkco eyimfuneko, ukuba kule ikhonkco thaca iimpazamo ziya kuchaphazela ngqo chip processing yesekethe ibhodi ayiphumelelanga kwaye ikhutshiwe, ngoko kwi welding kufuneka baqonde indlela welding echanekileyo, ukuqonda imiba efanelekileyo ingqalelo ukuphepha. iingxaki.
1. kwiprosesa ye-chip phambi kwe-welding kwi-pads eqatywe nge-flux, usebenzisa i-soldering iron ukujongana nayo kanye, ukuphepha i-pads ifakwe kakuhle okanye i-oxidized, ukwakheka kwe-welding embi, i-chip ngokubanzi ayifuni ukujongana nayo. .
2. Sebenzisa i-tweezers ukubeka ngokucophelela i-chip ye-PQFP kwibhodi ye-PCB, qaphela ukuba ungonakalisi izikhonkwane.Ukulungelelanisa kunye neepads kwaye uqinisekise ukuba i-chip ibekwe ngendlela echanekileyo.Cwangcisa iqondo lobushushu lentsimbi ukuya ngaphezulu kwama-300 degrees Celsius, yithi nkxu incam yentsimbi ibe sisixa esincinci, ucinezele itshiphu ngesixhobo esilungelelaniswe kwindawo, yongeza inani elincinci le-solder. izikhonkwane ezibini ezibekwe ngokwediagonally, usacinezela ezantsi kwitshiphu kwaye uthengise izikhonkwane ezibini ezibekwe ngokwediagonally ukuze itshiphu izinze kwaye ingakwazi ukuhamba.Emva kwe-soldering diagonal, khangela indawo ye-chip ukusuka ekuqaleni ukuze ubone ukuba ihambelana.Ukuba kuyimfuneko, lungisa okanye ususe kwaye ulungelelanise indawo kwi-PCB ukusuka ekuqaleni.
3. Qala ukudibanisa zonke izikhonkwane, kufuneka udibanise i-solder kwi-tip ye-soldering iron, zonke izikhonkwane ziya kufakwa nge-solder ukwenzela ukuba izikhonkwane zibambelele kumanzi.Chukumisa isiphelo sesikhonkwane ngasinye setshiphu ngencam yentsimbi yentsimbi ude ubone i-solder iqukuqela kwizikhonkwane.Xa i-soldering, unamathele kwincam yentsimbi ye-soldering kunye nezikhonkwane ezithengiswayo ngokuhambelanayo ukuze ugweme ukugqithwa ngenxa ye-solder eninzi.
4. Emva kokudibanisa zonke izikhonkwane, zimanzise zonke izikhonkwane nge-solder ukwenzela ukucoca i-solder.Z emva kokusebenzisa i-tweezers ukujonga ukuba kukho i-solder yobuxoki, khangela ukugqitywa, ukusuka kwibhodi yesekethe eqatywe nge-flux, iya kuba lula kwi-SMD resistive components solder ezinye, unokuqala kwindawo ye-solder kwi-tin, uze ubeke esinye isiphelo secandelo, kunye ne-tweezers ukubamba icandelo, i-solder kwelinye icala, kwaye ubone ukuba ifakwe kakuhle;Ukuba lithe lalungiswa, wolithengisa kwelinye, ukuba lithe lalunga, solder elinye icala.Uqheliselo oluninzi luyafuneka ukuze ubambe izakhono zokuthengisa.
Iimpawu zeNeoDen IN12Creflow oven
1. Inkqubo yokucoca i-welding eyakhiweyo, ukuhluzwa okusebenzayo kweegesi ezinobungozi, ukubonakala okuhle kunye nokukhuselwa kwendalo, ngakumbi ngokuhambelana nokusetyenziswa kwendawo ephezulu.
2. Inkqubo yokulawula ineempawu zokudibanisa okuphezulu, ukuphendula ngexesha elifanelekileyo, izinga lokungaphumeleli eliphantsi, ukugcinwa lula, njl.
3. Ukusetyenziswa kwe-high-performance aluminium alloy heat plate plate esikhundleni sokufudumala ityhubhu, kokubili ukonga amandla kunye nokusebenza kakuhle, xa kuthelekiswa nama-ovens okubuyisela afanayo kwiimarike, ukuphambuka kobushushu becala kuncitshiswe kakhulu.
4. Uyilo lokukhusela ukufudumala ukushisa, ukushisa kwegobolondo kunokulawulwa ngokufanelekileyo.
5. Ulawulo oluhlakaniphile, inzwa yobushushu obuphezulu, ukuqina kobushushu obusebenzayo.
6. I-motor ye-track drive ephuhliswe ngokwezifiso ngokweempawu zebhanti ye-B-uhlobo lwe-mesh, ukuqinisekisa isantya esifanayo kunye nobomi obude.
Ixesha lokuposa: Dec-13-2022