Ngenkqubela phambili yesayensi kunye nethekhinoloji, iiselfowuni, iikhompyuter zethebhulethi kunye nezinye iimveliso zombane zilula, zincinci, ziphathwa ngendlela yophuhliso, kwi-SMT processing yamacandelo e-elektroniki nawo aya esiba mancinci, iindawo zangaphambili ze-0402 ze-capacitive nazo zinenani elikhulu. ka 0201 ubukhulu ukuze kubuyiselwe.Indlela yokuqinisekisa umgangatho wee-solder joints ibe ngumba obalulekileyo we-SMD ephezulu.Amalungu e-Solder njengebhulorho ye-welding, umgangatho wayo kunye nokuthembeka kwayo kumisela umgangatho weemveliso ze-elektroniki.Ngamanye amazwi, kwinkqubo yokuvelisa, umgangatho we-SMT ekugqibeleni ubonakaliswe kumgangatho we-solder joints.
Okwangoku, kwishishini le-electronics, nangona uphando lwe-solder-free solder yenze inkqubela phambili kwaye sele iqalile ukukhuthaza ukusetyenziswa kwayo emhlabeni wonke, kwaye imiba yokusingqongileyo ixhalabele ngokubanzi, ukusetyenziswa kwe-Sn-Pb solder alloy soft brazing technology. ngoku iseyeyona teknoloji yoqhagamshelwano iphambili kwiisekethe zombane.
Ukudibanisa okuhle kwe-solder kufuneka kube kumjikelezo wobomi bezixhobo, iimpawu zayo zomatshini kunye nombane aziphumeleli.Ukubonakala kwayo kuboniswa ngolu hlobo:
(1) Umhlaba opheleleyo nogudileyo umenyezelayo.
(2) Ubungakanani obufanelekileyo be-solder kunye ne-solder ukugubungela ngokupheleleyo iipads kunye neentambo zeendawo ezithengiswayo, ukuphakama kwecandelo kumodareyitha.
(3) ukumanzisa okulungileyo;Umphetho wendawo yokuthambisa kufuneka ube mncinci, i-solder kunye ne-pad surface wetting angle ye-300 okanye ngaphantsi ilungile, ubuninzi abudluli kwi-600.
I-SMT iqhubekisa umxholo wokuhlola inkangeleko:
(1) ingaba iinxalenye azikho kusini na.
(2) Ingaba amacandelo afakwe ngokungalunganga.
(3) Akukho siphaluka sifutshane.
(4) ingaba i-welding virtual;welding virtual zizizathu ezintsonkothileyo noko.
I. umgwebo welding yobuxoki
1. Ukusetyenziswa komvavanyi we-intanethi izixhobo ezikhethekileyo zokuhlolwa.
2. Okubonakalayo okanyeUkuhlolwa kwe-AOI.Xa amalungu solder afunyanwe kakhulu encinane solder solder ukumanzisa embi, okanye amalungu solder phakathi komthungo eyaphukileyo, okanye umphezulu solder yaba ibhola convex, okanye solder kunye SMD musa ukwanga Fusion, njl, kufuneka sinikele ingqalelo, nokuba isenzeko sengozi encinci efihliweyo, kufuneka kwangoko iqinisekise ukuba kukho ibhetshi yeengxaki ze-solder.Isigwebo kukuba: ukubona ukuba PCB ngaphezulu kwindawo enye yamalungu solder baneengxaki, ezifana nje iingxaki PCB ngamnye, inokuba solder paste iyakrwelwa, pin deformation kunye nezinye izizathu, ezifana kwi PCB ezininzi kwindawo enye baneengxaki, ngeli xesha kunokwenzeka ukuba licandelo elibi okanye ingxaki ebangelwa yi-pad.
II.Oonobangela kunye nezisombululo kwi welding virtual
1. Uyilo lwephedi oluneziphene.Ubukho be-pad-hole pad sisiphene esikhulu kuyilo lwe-PCB, akufuneki, ungasebenzisi, ngomngxuma uya kwenza ilahleko ye-solder ebangelwa yi-solder engonelanga;isithuba pad, indawo nayo kufuneka ibe ngumdlalo osemgangathweni, okanye kufuneka ilungiswe ngokukhawuleza ukuyila.
2. Ibhodi ye-PCB ine-oxidation phenomenon, oko kukuthi, i-pad ayikhanyisi.Ukuba i-phenomenon ye-oxidation, i-rubber ingasetyenziselwa ukusula i-oxide layer, ukuze ibonakale kwakhona eqaqambileyo.pcb ibhodi ukufuma, ezifana kurhanelwa zingafakwa ukomisa oveni.ibhodi pcb has amabala oyile, amabala umbilo kunye nolunye ungcoliseko, eli xesha ukusebenzisa ethanol anhydrous ukucoca.
3. Iprinta ye-solder eprintiweyo ye-PCB, i-solder paste ikhutshiwe, ikhuhla, ukwenzela ukuba inani le-solder linamathele kwiipads ezifanelekileyo ukunciphisa inani le-solder, ukwenzela ukuba i-solder ayanelanga.Ifanele yenziwe ngexesha elifanelekileyo.Iindlela ezongezelelweyo ezifumanekayo kwi-dispenser okanye ukhethe kancinane ngentonga ye-bamboo ukuze wenze ngokupheleleyo.
4. I-SMD (i-surface-mounted components) yomgangatho ophantsi, ukuphelelwa yisikhathi, i-oxidation, i-deformation, okubangelwa i-soldering yobuxoki.Esi sesona sizathu siqhelekileyo.
Amalungu e-Oxidised awaqaqambi.Indawo yokunyibilika yeoksidi iyanda.
Ngeli xesha ngaphezu kwamakhulu amathathu edigri zentsimbi yombane yechromium kunye nerosin-type flux inokudityaniswa, kodwa ngaphezu kwamakhulu amabini edigri ze-SMT reflow soldering kunye nokusetyenziswa kwento edlekayo engacocekanga nesolder iya kuba nzima nyibilika.Ke ngoko, i-SMD ene-oxidised ayifanele ithengiswe ngesithando somlilo.Izinto zokuthenga kufuneka zibone ukuba kukho i-oxidation, kwaye uthenge emva kwexesha lokusebenzisa.Ngokufanayo, i-oxidised solder paste ayinakusetyenziswa.
Ixesha lokuposa: Aug-03-2023