Kwiminyaka yakutshanje, ngokunyuka kweemfuno zokusebenza kwezixhobo ze-terminal ezihlakaniphile ezifana neefowuni ezihlakaniphile kunye neekhompyutha zethebhulethi, ishishini lokuvelisa i-SMT linemfuno eyomeleleyo yokwenziwa kweminiaturization kunye nokucuthwa kwezinto zombane.Ngokunyuka kwezixhobo ezinxitywayo, le mfuno inkulu ngakumbi.Ngokunyukayo.Umfanekiso ongezantsi uthelekiso lwe-I-phone 3G kunye ne-I-phone 7 motherboards.Ifowuni entsha ye-I-ifowuni inamandla ngakumbi, kodwa i-motherboard edibeneyo incinci, efuna izinto ezincinci kunye nezinto ezixineneyo.INdibano inokwenziwa.Ngamacandelo amancinci kunye amancinci, kuya kuba nzima ngakumbi kwinkqubo yethu yokuvelisa.Ukuphuculwa komlinganiselo kube yinjongo ephambili yeenjineli zenkqubo ye-SMT.Ngokuqhelekileyo, ngaphezu kwe-60% yeziphene kwishishini le-SMT lihambelana nokuprintwa kwe-solder paste, eyona nkqubo iphambili kwimveliso ye-SMT.Ukusombulula ingxaki yoshicilelo lwe-solder paste lulingana nokusombulula uninzi lweengxaki zenkqubo kuyo yonke inkqubo ye-SMT.
Umzobo ongezantsi yitheyibhile yokuthelekisa yemetric kunye ne-imperial dimensions yamacandelo e-SMT.
Lo mfanekiso ulandelayo ubonisa imbali yophuhliso lwamacandelo e-SMT kunye nentsingiselo yophuhliso ejonge phambili kwixesha elizayo.Okwangoku, izixhobo zeBritish 01005 SMD kunye ne-0.4 pitch BGA / CSP zisetyenziswa ngokuqhelekileyo kwimveliso ye-SMT.Inani elincinci lezixhobo ze-metric 03015 ze-SMD nazo zisetyenziselwa ukuveliswa, ngelixa izixhobo ze-metric 0201 ze-SMD okwangoku kuphela kwinqanaba lemveliso yovavanyo kwaye kulindeleke ukuba zisetyenziswe ngokuthe ngcembe kwimveliso kwiminyaka embalwa ezayo.
Ixesha lokuposa: Aug-04-2020