Ezinye iingxaki eziqhelekileyo kunye nezisombululo kwi-soldering

Ugwebu kwi-PCB substrate emva kokuthengiswa kwe-SMA

Esona sizathu siphambili sokubonakala kwamadyungudyungu obungakanani bezikhonkwane emva kokuwelda kwe-SMA kwakhona kukufuma okufakwe kwi-PCB substrate, ngakumbi ekusetyenzweni kweebhodi ezininzi.Ngenxa yokuba ibhodi ye-multilayer yenziwe nge-multi-layer epoxy resin prepreg kwaye emva koko icinezelwe kushushu, ukuba ixesha lokugcinwa kwe-epoxy resin semi curing piece lifutshane kakhulu, umxholo we-resin akwanelanga, kwaye ukususwa komswakama ngokomiswa kwangaphambili akucocekanga, kulula ukuthwala umphunga wamanzi emva koxinzelelo olushushu.Kwakhona ngenxa ye-semi-solid ngokwayo umxholo weglue akwanelanga, ukunamathela phakathi kweengqimba akwanele kwaye ushiye amaqamza.Ukongeza, emva kokuba i-PCB ithengiwe, ngenxa yexesha elide lokugcinwa kunye nemekobume yokugcina efumileyo, i-chip ayibhakwanga kwangethuba ngaphambi kokuveliswa, kwaye i-PCB efumileyo iyakwazi ukuba namadyungudyungu.

Isisombululo: I-PCB inokufakwa kwindawo yokugcina emva kokwamkelwa;I-PCB kufuneka ifakwe ngaphambili kwi-(120 ± 5) ℃ iiyure ezi-4 phambi kokubekwa.

Vula isekethe okanye i-solder yobuxoki ye-IC pin emva kwe-soldering

Oonobangela:

I-1) I-coplanarity engalunganga, ngakumbi kwizixhobo ze-fqfp, ikhokelela kwi-pin deformation ngenxa yokugcinwa okungafanelekanga.Ukuba i-mounter ayinawo umsebenzi wokukhangela i-coplanarity, akukho lula ukuyifumana.

I-2) I-solderability engafanelekanga yezikhonkwane, ixesha elide lokugcina i-IC, i-yellowing yezikhonkwane kunye ne-solderability engafanelekanga yizona zizathu eziphambili ze-solder yobuxoki.

I-3) I-solder paste inomgangatho ophantsi, umxholo wesinyithi ophantsi kunye ne-solderability embi.I-solder paste edla ngokusetyenziselwa ukuwelda izixhobo ze-fqfp kufuneka ibe nomxholo wesinyithi ongekho ngaphantsi kwe-90%.

4) Ukuba ukushisa kwangaphambili kuphezulu kakhulu, kulula ukubangela i-oxidation ye-IC pins kwaye yenza ukuba i-solderability ibe yimbi.

5) Ubungakanani befestile yetemplate yokushicilela buncinci, ukwenzela ukuba inani le-solder paste akwanele.

imiqathango yolungiso:

6) Nika ingqalelo ukugcinwa kwesixhobo, musa ukuthatha icandelo okanye uvule ipakethe.

I-7) Ngexesha lokuvelisa, i-solderability yamacandelo kufuneka ihlolwe, ngokukodwa ixesha lokugcina i-IC akufanele libe lide kakhulu (ngaphakathi konyaka omnye ukususela kumhla wokwenziwa), kwaye i-IC ayifanele ibonakaliswe kwiqondo lokushisa eliphezulu kunye nomswakama ngexesha lokugcinwa.

8) Khangela ngononophelo ubungakanani befestile yetemplate, engafanele ibe nkulu kakhulu okanye incinci, kwaye ubeke ingqalelo ukufanisa ubungakanani bepadi yePCB.