Indlela yokuvelisa iibhodi ezininzi zenziwa ngokubanzi kwimizobo yangaphakathi yomaleko kuqala, emva koko ngokuprinta kunye nendlela yokubhala ukwenza i-substrate enecala elinye okanye elicande-mbini, kwaye ibe kumgangatho obekiweyo phakathi, emva koko ngokufudumeza, ukucinezela kunye nokudibanisa, njengokugrumba okulandelayo kuyafana nendlela yokucwenga enamacala amabini ngomngxuma.
1. Okokuqala, ibhodi yesekethe yeFR4 kufuneka yenziwe kuqala.Emva kokubethelwa kobhedu olunemingxuma kwi-substrate, imingxuma izaliswe nge-resin kwaye imigca yomhlaba yenziwe nge-etching subtractive.Eli nyathelo liyafana nebhodi ye-FR4 jikelele ngaphandle kokuzaliswa kwe-perforations nge-resin.
2. I-photopolymer epoxy resin isetyenziswe njengoluhlu lokuqala lwe-insulation FV1, kwaye emva kokumisa, i-photomask isetyenziselwa inyathelo lokuvezwa, kwaye emva kokuvezwa, i-solvent isetyenziselwa ukuphuhlisa umngxuma ongezantsi we-peg hole.Ukuqina kwe-resin kuqhutyelwa emva kokuvulwa komngxuma.
3. Umphezulu we-epoxy resin urhabaxa yi-permanganic acid etching, kwaye emva kokukrolwa, umaleko wobhedu wenziwa kumphezulu ngokutyalwa kobhedu olungena-electro kwinyathelo elilandelayo lokutyabeka lobhedu.Emva kokufakwa, i-copper conductor layer yenziwa kwaye isiseko sesiseko senziwe nge-etching subtractive etching.
4. Udityaniswe ngomaleko wesibini wokugquma, usebenzisa amanyathelo afanayo ophuhliso lokuvezwa ukwenza umngxuma webholiti phantsi komngxuma.
5. Ukuba imfuneko yokugqobhoza, ungasebenzisa ukugrunjwa kwemingxuma ukwenza i-perforations emva kokuqulunqwa kobhedu lwe-electroplating etching ukwenza ucingo.
kumaleko angaphandle kwibhodi yesekethe eqatywe ngepeyinti ye-anti-tin, kunye nokusetyenziswa kwendlela yokuphuhlisa i-exposure ukuveza inxalenye yoqhagamshelwano.
6. Ukuba inani lamaleko liyanda, phinda nje la manyathelo angasentla.Ukuba kukho iileyile ezongezelelweyo kumacala omabini, i-insulation layer kufuneka ifakwe kumacala omabini omgangatho wesiseko, kodwa inkqubo yokucoca inokwenziwa kumacala omabini ngexesha elinye.
Ixesha lokuposa: Nov-09-2022