Ukusetyenzwa kokubekwa kwe-SMT, ngomlinganiselo ubizwa ngokuba ngumgca wokuphila weplanti yokubeka, ezinye iinkampani kufuneka zifikelele kwi-95% ngesantya sifikelele kumgca osemgangathweni, ngoko ke ngesantya esiphezulu nesisezantsi, esibonisa amandla obugcisa beplanti yokubekwa, umgangatho wenkqubo. , ngomlinganiselo unokuphucula ukusebenza kakuhle kwenkampani, ukunciphisa iindleko zemveliso, i-Z ibalulekile ukukwazi ukuzisa uzinzo, ukwandisa ukwaneliseka kwabathengi.
Inkcazo yomlinganiselo othe ngqo
Izinga lokufikelela kwinqanaba lokuthumela ngenqanawa ngexesha elinye.
Izinga elithe ngqo (iSivuno sokuQala sokuPhuma, i-FPY) lithetha ngokuthe ngqo: inani leemveliso ezilungileyo eziye zadlula zonke iimvavanyo okokuqala inkqubo ifakwe kwiiseti ze-PCB ze-100 kumgca wokuvelisa.Ngoko ke, emva kokuba umgca wemveliso uphinda usebenze okanye ulungise ukuphumelela iimveliso zovavanyo, kungekhona inxalenye yokubala isantya esithe ngqo.
Ziziphi izinto ezichaphazela umlinganiselo othe ngqo
1. imathiriyeli (kubandakanywa amacandelo ahlukeneyo e-elektroniki kwisigaba sokuqala, kuquka iibhodi zePCB)
2. intlama ye-solder
3. umgangatho kunye nengqondo yabasebenzi
Indlela yokuphucula kunye nokuphucula umgangatho othe ngqo
Umyinge othe ngqo unxulumene nenzuzo kunye nendlela yokuphila yeshishini, ngoko ke umzi-mveliso ngamnye we-chip ubamba ukulungelelaniswa kunye nokuphuculwa komgangatho othe ngqo, ngokuqinisekileyo i-100% ayinakufikelela, kodwa inethemba lokuba ngaphezu kwe-98%.
Ke ngoko, ungaliphucula izinga elithe ngqo ngokusebenzisa ezinye zezi khonkco zilandelayo.
1. Lungiselela uyilo lwestencil sebhodi yepcb
Ngaphezulu kwe-70% yomgangatho we-welding kwinkqubo yoshicilelo lwe-solder paste, elishishini le-SMT lishwankathela idatha yamava, i-solder paste yoshicilelo yinkqubo yenkqubo yangaphambili ye-smt Z, i-solder paste offset, i-tip yokutsala, ukuwa, kwiimeko ezininzi Iziphene zoyilo lwestencil, istensile inokuba nkulu kakhulu / imingxuma emincinci, udonga lomngxuma westencil lurhabaxa, njl. njl izinga.
2. Khetha uhlobo olufanelekileyo lwe-solder paste
I-solder paste ngumxube weentlobo ezahlukeneyo zesinyithi kunye ne-fluxes, efana ne-toothpaste, i-solder paste yahlulwe ibe yi-5, i-3 kunye nezinye iintlobo ezahlukeneyo ze-solder paste, iimveliso ezahlukeneyo kufuneka zikhethe i-solder paste eyahlukeneyo yokuprinta.
Inqaku elineenkcukacha malunga ne-solder paste
SMT chip processing apho iintlobo solder paste, ukugcinwa kunye nokusetyenziswa ukuqonda okusisiseko kokusingqongileyo
3. Lungisa iUmatshini wokushicilela we-SMTsqueegee angle, uxinzelelo
Uxinzelelo lwe-scraper kumatshini wokushicilela, i-angle iya kuchaphazela imiba ye-solder paste, uxinzelelo lukhulu, luya kubangela ukuncamathisela kwe-solder encinci, kwaye ngokuphambene noko, i-angle Z ilungile yi-45-60 degrees.
4. Hlaziya i-oveniijiko lobushushu
Ngokweemveliso ezahlukeneyo, lungisa ixesha lokufudumeza, phinda utshintshe ijika lobushushu, usebenzisa umvavanyi weqondo lobushushu, kufutshane nobushushu bokwenyani bemveliso, emva koko ufumane igophe lobushushu, kwaye emva koko ulungelelanise igophe lobushushu bomlilo, ukuze ubushushu bomlilo. igophe ngokuhambelana ne-solder paste kunye neemfuno zokuthengisa imveliso.
Ixesha lokuposa: Feb-17-2022