Amanqaku amabini okulawula isantya somoya kwi-oveni yokuqukuqela kwakhona

Ukuze uqonde ulawulo lwesantya somoya kunye nomthamo womoya, amanqaku amabini kufuneka athathelwe ingqalelo:

  1. Isantya sefeni kufuneka silawulwe ngokuguqulelwa rhoqo ukunciphisa impembelelo yokutshintsha kwamandla ombane kuyo;
  2. Ukunciphisa umthamo womoya wokukhutshwa kwezixhobo, kuba umthwalo ophakathi womoya wokukhupha udla ngokungazinzi, ochaphazela ngokulula ukuhamba komoya oshushu kwisithando somlilo.
  3. Uzinzo lwezixhobo

Ngoko nangoko sifumene isisetingi se-curve yesithando somlilo esifanelekileyo, kodwa ukufezekisa, ukuzinza, ukuphindaphinda kunye nokuhambelana kwezixhobo kuyadingeka ukuze kuqinisekiswe.Ngokukodwa kwimveliso ye-lead-free, ukuba ijika lobushushu beziko lihamba kancinci ngenxa yezizathu zezixhobo, kulula ukutsiba ngaphandle kwefestile yenkqubo kwaye kubangele i-solder ebandayo okanye umonakalo kwisixhobo sokuqala.Ke ngoko, ngakumbi nangakumbi abavelisi baqala ukubeka phambili iimfuno zovavanyo lozinzo lwezixhobo.

l Ukusetyenziswa kwenitrogen

Ngokufika kwexesha le-lead-free, nokuba i-reflow soldering igcwele i-nitrogen ibe ngumxholo oshushu wengxoxo.Ngenxa ye-fluidity, i-solderability, kunye nokumanzi kwee-solders ezingenalo i-load, azilungile njengee-lead solders, ngakumbi xa iibhodi zebhodi yesekethe zithatha inkqubo ye-OSP (ifilimu ekhuselayo ye-organic bare copper board), iipads zilula ukuba zixutywe, idla ngokubangela ukuba amalungu e-solder I-angle yokumanzisa inkulu kakhulu kwaye iphedi ibonakaliswe kubhedu.Ukuze kuphuculwe umgangatho wamalungu e-solder, ngamanye amaxesha kufuneka sisebenzise i-nitrogen ngexesha lokuphinda kufakwe i-solder.I-nitrojeni yigesi yokukhusela i-inert, enokukhusela iipadi zebhodi yesekethe kwi-oxidation ngexesha le-soldering, kwaye iphucule kakhulu i-solderability ye-lead-free solders (Umfanekiso 5).

reflow oven

Umfanekiso we-5 Welding of metal shield phantsi kwendawo ezaliswe yinitrogen

Nangona abavelisi abaninzi bemveliso ye-elektroniki abayisebenzisi initrogen okwexeshana ngenxa yoqwalaselo lweendleko zokusebenza, kunye nokuphuculwa okuqhubekayo kweemfuno zomgangatho we-lead-free soldering, ukusetyenziswa kwenitrogen kuya kuba yinto eqhelekileyo.Ngoko ke, ukhetho olungcono kukuba nangona i-nitrogen ayisetyenziswanga kwimveliso yangempela ngoku, kungcono ukushiya izixhobo kunye nojongano lokuzaliswa kwe-nitrogen ukuze kuqinisekiswe ukuba izixhobo zinoguquko lokuhlangabezana neemfuno zemveliso yokuzalisa i-nitrogen kwixesha elizayo.

l Isixhobo sokupholisa esisebenzayo kunye nenkqubo yokulawula i-flux

Ubushushu be-soldering yemveliso ye-lead-free iphezulu kakhulu kunelothe, ebeka phambili iimfuno eziphezulu zomsebenzi wokupholisa wezixhobo.Ukongeza, izinga lokupholisa elilawulekayo linokwenza i-lead-free joint solder idibanise ngakumbi, enceda ukuphucula amandla omatshini we-solder joint.Ngokukodwa xa sivelisa iibhodi zesekethe ezinomthamo omkhulu wokushisa ezifana ne-backplanes yokunxibelelana, ukuba sisebenzisa kuphela ukupholisa umoya, kuya kuba nzima kwiibhodi zeesekethe ukuhlangabezana neemfuno zokupholisa ii-3-5 degrees ngomzuzwana ngexesha lokupholisa, kunye ne-slope yokupholisa ayikwazi. ukufikelela Imfuno iya kukhulula i-solder joint structure kwaye ichaphazele ngokuthe ngqo ukuthembeka kwe-solder joint.Ngoko ke, imveliso engenalo i-lead iyacetyiswa ngakumbi ukuba iqwalasele ukusetyenziswa kwezixhobo zokupholisa amanzi ezijikeleza kabini, kunye ne-slope yokupholisa izixhobo kufuneka zibekwe njengoko zifunwa kwaye zilawuleke ngokupheleleyo.

I-lead-free solder paste isoloko iqulethe i-flux eninzi, kwaye intsalela ye-flux kulula ukuyiqokelela ngaphakathi eziko, echaphazela ukusebenza kokudluliselwa kobushushu kwezixhobo, kwaye ngamanye amaxesha ide iwele kwibhodi yesekethe eziko ukubangela ukungcola.Kukho iindlela ezimbini zokukhupha intsalela ye-flux ngexesha lenkqubo yokuvelisa;

(1) Ukukhupha umoya

Umoya otyhafileyo yeyona ndlela ilula yokukhupha iintsalela ze-flux.Nangona kunjalo, sikhankanyile kwinqaku elidlulileyo ukuba umoya ogqithiseleyo wokukhupha umoya uya kuchaphazela ukuzinza kokuhamba komoya oshushu kwisithando somlilo.Ukongezelela, ukwandisa umthamo womoya wokukhupha umoya uya kukhokelela ngokuthe ngqo ekunyuseni kokusetyenziswa kwamandla (kuquka umbane kunye ne-nitrogen).

(2) Inkqubo yolawulo lwe-multi-level flux

Inkqubo yokulawula i-flux ngokubanzi ibandakanya isixhobo sokucoca kunye nesixhobo sokunciphisa (Umfanekiso 6 kunye noMzobo 7).Isixhobo sokuhluza sahlula ngokufanelekileyo kwaye sihluza amasuntswana aqinileyo kwintsalela yokuqukuqela, ngelixa isixhobo sokupholisa sidibanisa intsalela yegesi eguquguqukayo ibe lulwelo kwisitshintshi sobushushu, kwaye ekugqibeleni siyiqokelele kwitreyi yokuqokelela ukusetyenzwa kwindawo esembindini.

reflow ovenILogo Simahla Akukho mlinganiselo Ipapashwe ngu- 插入图片

Umzobo 6 Isixhobo sokucoca kwinkqubo yolawulo lwe-flux

reflow oven

Umzobo 7 Isixhobo sokunciphisa kwisixokelelwano solawulo lwe-flux


Ixesha lokuposa: Aug-12-2020

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