I-Wave Soldering Surface Components IiMfuno zoYilo loYilo

I. Inkcazo yangasemva

Umatshini we-wave solderingi-welding idlula kwi-solder etyhidiweyo kwizikhonkwane zecandelo ukwenzela ukusetyenziswa kwe-solder kunye nokufudumeza, ngenxa yentshukumo ehambelanayo ye-wave kunye ne-PCB kunye ne-solder etyhidiweyo "encamathelayo", inkqubo yokuthengiswa kwamaza inzima kakhulu kune-reflow soldering, ukuba ifakwe iphakheji. isithuba isikhonkwane, isikhonkwane ngaphandle ubude, ubungakanani iphedi ziyafuneka, kwi-PCB Ubeko lwesalathiso sebhodi, isithuba, kunye nofakelo lomgca womngxuma nazo zineemfuno, ngokufutshane, inkqubo yokuthengisela amaza imbi, ifuna, ukuwelda. isivuno ngokusisiseko sixhomekeke kuyilo.

II.Iimfuno zokupakisha

1. ilungele indawo yokubeka i-solder ye-solder kufuneka ibe nesiphelo se-solder okanye i-lead end eveziweyo;Umzimba wokupakisha ukusuka kwindawo yokucoca umhlaba (Yima) <0.15mm;Ubude <4mm iimfuno ezisisiseko.Ukuhlangabezana nale miqathango yamacandelo okubekwa kubandakanya:

0603 ~ 1206 ubungakanani bepakethe uluhlu lwamacandelo e-chip resistive.

I-SOP eneziko elikhokelayo lomgama ≥1.0mm kunye nobude <4mm.

I-chip inductors enobude ≤ 4mm.

Ii-coil chip inductors ezingavezwanga (okt C, uhlobo lwe-M)

2. ilungele ukuthengiswa kwamaza amacandelo ekhatriji yonyawo oluxineneyo kumgama omncinci phakathi kwezikhonkwane ezikufutshane ≥ 1.75mm ipakethe.

III.Umkhombandlela wothumelo

Phambi kobeko lwecandelo lomphezulu we-soldering yamaza, eyokuqala kufuneka imisele i-PCB ngaphezulu kwendlela yokuhanjiswa kweziko, luyilo lwamacandelo ekhatriji “ibenchmark yenkqubo”.Ngoko ke, ngaphambi kokuba i-wave soldering surface components ibekwe, eyokuqala kufuneka inqume indlela yokudluliselwa.

1. Ngokubanzi, icala elide kufuneka libe lilo lokuhambisa.

2. Ukuba i-layout ine-closet foot cartridge connector (i-pitch <2.54mm), isalathiso se-layout yesiqhagamshelo kufuneka sibe yi-direction of transmission.

3. kumphezulu soldering amaza, kufuneka isilika-screened okanye ifoyile yobhedu efakwe utolo olumakisha indlela yosasazo, ukuze uchonge xa ​​ukuwelda.

IV.Umkhombandlela woyilo

Isalathiso soyilo samacandelo ikakhulu sibandakanya amacandelo e-chip kunye nezihlanganisi ezininzi.

1. icala elide lepakethe yesixhobo se-SOP kufuneka ihambelane noyilo lwesalathiso sosasazo lwamaza, icala elide lamacandelo etshiphu, kufuneka libe perpendicular kwicala lothumelo lwe-soldering.

2. Amacandelo amaninzi eekhatriji ezimbini, isalathiso somgca we-jack center kufuneka sibe yi-perpendicular ukuya kwi-direction of transmission, ukwenzela ukunciphisa isenzeko sesinye isiphelo secandelo elidadayo.

V. Iimfuno zesithuba

Kumacandelo e-SMD, i-pad spacing ibhekisela kwixesha eliphakathi kweempawu eziphezulu zokufikelela kwiiphakheji ezikufutshane (kubandakanywa neepads);kumacandelo ekhatriji, isithuba sepadi sibhekisa kwisithuba esiphakathi kweepadi ze-solder.

Kumacandelo e-SMD, i-pad spacing ayikho ngokupheleleyo kwimiba yoqhagamshelo lwebhulorho, kubandakanywa nefuthe lokuthintela lomzimba wepakethi kunokubangela ukuvuza kwe-solder.

1. icandelo lekhatriji isithuba sepadi kufuneka ngokubanzi sibe ≥ 1.00mm.kwizixhumi zekhatriji ezicolekileyo, vumela ukunciphisa okufanelekileyo, kodwa ubuncinci akufunekanga bube <0.60mm.

2. i-cartridge component pads kunye ne-wave soldering SMD iipads zecandelo kufuneka zibe ≥ 1.25mm ikhefu.

VI.Iimfuno ezizodwa zoyilo lwePad

1. ukwenzela ukunciphisa ukuvuza kwe-soldering, kwi-0805/0603, i-SOT, i-SOP, i-tantalum capacitor pads, kucetyiswa ukuba uyilo ngokuhambelana nezi mfuno zilandelayo.

Kumacandelo 0805/0603, ngokuhambelana IPC-7351 kucetyiswa uyilo (pad flare 0.2mm, ububanzi kuncitshiswe 30%).

Kwi-SOT kunye ne-tantalum capacitors, iipads kufuneka zandiswe ngaphandle nge-0.3mm xa kuthelekiswa neepads eziqhelekileyo eziyilwe.

2. ngokuba ipleyiti metalized umngxuma, amandla solder joint ikakhulu ixhomekeke uqhagamshelo umngxuma, pad ring ububanzi ≥ 0.25mm kungaba.

3. Kwi-plate ye-hole ye-non-metallized (iphaneli enye), amandla okudibanisa i-solder anqunywe ngubukhulu be-pad, ububanzi bepadi jikelele kufuneka bube ≥ amaxesha angama-2.5 ububanzi bomngxuma.

4. iphakheji ye-SOP, kufuneka iyilwe ekupheleni kwezikhonkwane eziba i-tin pads, ukuba i-SOP pitch inkulu kakhulu, i-deal tin pad design ingaba nkulu.

5. kwizihlanganisi ze-multi-pin, kufuneka ziyilwe kwi-off-tin ekupheleni kweepads ezibiweyo.

VII.Ukukhokelela ngaphandle ubude

1. ubude obuphambili bokubunjwa kwebhulorho bunobudlelwane obukhulu, isithuba esincinci se-pin, impembelelo enkulu yeengcebiso ngokubanzi:

Ukuba i-pitch pitch iphakathi kwe-2 ~ 2.54mm, ubude bokwandisa okukhokelela kufuneka balawulwe kwi-0.8 ~ 1.3mm

Ukuba i-pitch pitch <2mm, ubude bokwandisa okukhokelayo kufuneka bulawuleke kwi-0.5 ~ 1.0mm

2. ukukhokelela ngaphandle ubude kuphela kwicandelo ubeko ulwalathiso ukuhlangabezana neemfuno iimeko zokuthambisa amaza kunokudlala indima, kungenjalo ukupheliswa isiphumo uqhagamshelo ibhulorho ayicacanga.

VIII.ukusetyenziswa kwe-inki yokuxhathisa i-solder

1. sihlala sibona indawo yemizobo yepedi yesinxibelelanisi eprintwe ngemizobo ye-inki, uyilo olunjalo luqwalaselwa ngokubanzi ukunciphisa isenzeko sokubopha ibhulorho.Umtshini usenokuba umphezulu we-inki umaleko urhabaxa ngokwentelekiso, kulula ukuwubhengeza ngakumbi uguquguquko, ukuguquguquka okudibene nobushushu obuphezulu obunyibilikisiweyo be-solder volatilization kunye nokwakheka kwamaqamza okuzahlula, ngokwenjenjalo kuncitshiswe ukwenzeka kwebhulorho.

2. Ukuba umgama phakathi pin pads <1.0mm, uyakwazi ukuyila solder ukumelana inki umaleko ngaphandle pads ukunciphisa amathuba ibhulorho, nto leyo ikakhulu ukuphelisa pads ashinyeneyo phakathi embindini solder joint ibhulorho, kunye nokubiwa inkonkxa. iipads ikakhulu ukuphelisa iqela iphedi eshinyeneyo yokugqibela desoldering ekupheleni solder joint ibhulorho imisebenzi yabo eyahlukileyo.Ngoko ke, isithuba isikhonkwane sincinane ngokwentelekiso pads ezixineneyo, solder ukumelana inki kunye nobusela pad solder kufuneka zisetyenziswe kunye.