Ngo-2020, ngaphezulu kweetriliyoni zeetshiphusi zaveliswa kwihlabathi liphela, ezilingana neetships ezili-130 ezizezabantu kwaye zisetyenziswa ngumntu ngamnye emhlabeni.Nangona kunjalo, ukunqongophala kwe-chip yamva nje kuyaqhubeka ukubonisa ukuba eli nani alikafikeleli kumda walo ophezulu.
Nangona iitshiphusi zinokuveliswa kwinqanaba elikhulu kangako, ukuvelisa akuwona msebenzi ulula.Inkqubo yokwenza iitshiphusi intsonkothile, kwaye namhlanje siza kugubungela awona manyathelo mathandathu abaluleke kakhulu: ukubekwa, ukugquma kwefotoresist, i-lithography, i-etching, ukufakwa kwe-ion, kunye nokupakishwa.
Ukubekwa
Inyathelo lokubeka liqala ngesiqwenga esisikiweyo, esisikwe kwi-99.99% yesilinda sesilicon ecocekileyo (ekwabizwa ngokuba yi "silicon ingot") kwaye yapolishwa ukuya kuthi ga kwisiphelo esigudileyo, emva koko kufakwe ifilimu ebhityileyo yomqhubi, isigqubuthelo, okanye imathiriyeli yesemiconductor. kwi-wafer, ngokuxhomekeke kwiimfuno zesakhiwo, ukwenzela ukuba umaleko wokuqala unokuprintwa kuwo.Eli nyathelo libalulekileyo lidla ngokubizwa ngokuba “yi-deposition”.
Njengoko iitshiphusi zisiba ncinci kwaye zincinci, iipateni zokuprinta kwii-wafers ziba nzima ngakumbi.Ukuqhubela phambili kwi-deposition, i-etching kunye ne-lithography ngundoqo ekwenzeni iitshiphusi zibe zincinci kwaye ngaloo ndlela kuqhuba ukuqhubeka koMthetho kaMoore.Oku kuquka ubuchule obutsha obusebenzisa imathiriyeli emitsha ukwenza inkqubo yokubeka ichaneke ngakumbi.
Photoresist Coating
Ii-wafers ke ziqatywe ngesixhobo sefotoresist ebizwa ngokuba yi-"photoresist" (ekwabizwa ngokuba yi-"photoresist").Kukho iintlobo ezimbini zeefotoresists - "photoresists positive" kunye "negative photoresists".
Umahluko ophambili phakathi kwe-photoresists elungileyo kunye nengalunganga yinkqubo yeekhemikhali zezinto kunye nendlela i-photoresist isabela ngayo ekukhanyeni.Kwimeko ye-photoresists elungileyo, indawo evezwe kukukhanya kwe-UV itshintsha ubume kwaye inyibilika ngakumbi, ngaloo ndlela ilungiselela ukukrolwa kunye nokubekwa.Ngakolunye uhlangothi, i-photoresists engalunganga, i-polymerize kwiindawo ezivezwe ekukhanyeni, okwenza kube nzima ukunyibilika.Iifotoresists ezintle zezona zisetyenziswa kakhulu kwimveliso ye-semiconductor ngenxa yokuba zinokufikelela kwisisombululo esiphezulu, zibenze ukhetho olungcono lwenqanaba le-lithography.Ngoku kukho inani leenkampani kwihlabathi liphela ezivelisa iifotoresists zokwenziwa kwesemiconductor.
Ifotolithography
I-Photolithography ibalulekile kwinkqubo yokwenziwa kwetshiphu kuba imisela ukuba zincinci kangakanani iitransistors kwitshiphu.Ngeli nqanaba, ama-wafers afakwe kumatshini we-photolithography kwaye abonakaliswe ekukhanyeni okunzulu kwe-ultraviolet.Amaxesha amaninzi ziba ncinane ngamaxesha angamawaka kunokhozo lwesanti.
Ukukhanya kuqikelelwa kwiwafer nge "mask plate" kunye ne-lithography optics (i-lens ye-DUV system) iyashwabana kwaye igxininise ipateni eyiliweyo yesekethe kwipleyiti yemaski kwiphotoresist kwiwafer.Njengoko kuchaziwe ngaphambili, xa ukukhanya kubetha i-photoresist, kwenzeka utshintsho lwekhemikhali oluprinta ipateni kwi-mask plate kwi-photoresist coating.
Ukufumana ipateni eveziweyo ichanekile ngumsebenzi okhohlisayo, kunye nokuphazamiseka kwamasuntswana, i-refraction kunye nezinye iziphene zomzimba okanye zekhemikhali konke okunokwenzeka kwinkqubo.Yiyo loo nto ngamanye amaxesha kufuneka songeze ipateni yokugqibela yokuvezwa ngokulungisa ngokukodwa ipateni kwisigqumathelo ukwenza ipateni eprintiweyo ijongeke ngendlela esifuna ngayo.Inkqubo yethu isebenzisa "i-computational lithography" ukudibanisa iimodeli ze-algorithmic kunye nedatha evela kumatshini we-lithography kunye ne-wafers zokuvavanya ukuvelisa uyilo lwemaski olwahluke ngokupheleleyo kwipatheni yokuvezwa kokugqibela, kodwa yiloo nto sifuna ukuyiphumeza kuba kuphela kwendlela yokufumana ipateni yokuvezwa efunekayo.
Etching
Isinyathelo esilandelayo kukususa i-photoresist eyonakeleyo ukuveza ipateni efunekayo.Ngexesha lenkqubo "ye-etch", i-wafer iyabhakwa kwaye iphuhliswe, kwaye enye ye-photoresist iyahlanjwa ukuze iveze iphethini ye-3D yetshaneli evulekileyo.Inkqubo ye-etching kufuneka yenze iimpawu zokuqhuba ngokuchanekileyo kwaye ngokuqhubekayo ngaphandle kokuphazamisa ukunyaniseka okupheleleyo kunye nokuzinza kwesakhiwo se-chip.Ubuchwephesha bokuchwetheza obukwinqanaba eliphezulu buvumela abavelisi beetshiphu ukuba basebenzise iipateni eziphindwe kabini, eziphindwe kane kunye nezisekwe kwisiphekepheke ukwenza imilinganiselo emincinci yoyilo lwetshiphu yale mihla.
Njengama-photoresists, i-etching yahlulwe yaba ziintlobo "zomileyo" kunye "nezimanzi".I-etching eyomileyo isebenzisa igesi ukuchaza ipateni eveziweyo kwi-wafer.Ukuchongwa okumanzi kusebenzisa iindlela zeekhemikhali ukucoca iwafa.
Itshiphu inamaleko amaninzi, ngoko ke ukuchongwa kufuneka kulawulwe ngocoselelo ukunqanda ukonakalisa iileya ezisezantsi zesakhiwo setshiphu eninzi.Ukuba injongo ye-etching kukudala i-cavity kwisakhiwo, kuyimfuneko ukuqinisekisa ukuba ubunzulu bombhobho buchanekile.Olunye uyilo lwetshiphu ukuya kuthi ga kwi-175 umaleko, olufana ne-3D NAND, lwenza inyathelo le-etching libaluleke ngakumbi kwaye libenzima.
Isitofu seIyoni
Nje ukuba ipateni ifakwe kwi-wafer, i-wafer ibhobhozwa ngee-ion ezilungileyo okanye ezimbi ukulungisa iipropati zokuqhuba zenxalenye yepateni.Njengemathiriyeli yee-wafers, i-silicon yezinto ekrwada ayisiyiyo i-insulator egqibeleleyo okanye umqhubi ogqibeleleyo.Iipropati ze-silicon eziqhubayo ziwela kwenye indawo phakathi.
Ukwalathisa i-ion ezihlawulweyo kwi-silicon crystal ukwenzela ukuba ukuhamba kombane kukwazi ukulawulwa ukwenza iiswitshi ze-elektroniki ezisisiseko sokwakha i-chip, i-transistors, ibizwa ngokuba yi "ionization", eyaziwa ngokuba yi "ion implantation".Emva kokuba umaleko u-ionized, i-photoresist eseleyo esetyenziselwa ukukhusela indawo engabonakaliyo iyasuswa.
Ukupakishwa
Amawakawaka amanyathelo afunekayo ukwenza i-chip kwi-wafer, kwaye kuthatha ngaphezu kweenyanga ezintathu ukusuka kuyilo ukuya kwimveliso.Ukususa i-chip kwi-wafer, inqunyulwe kwiichips ezizimeleyo usebenzisa isarha yedayimane.Ezi chips, ezibizwa ngokuba "yi-bare die," zahlulwe kwi-12-intshi ye-wafer, eyona sayizi iqhelekileyo esetyenziswa kwimveliso ye-semiconductor, kwaye ngenxa yokuba ubungakanani beetshiphusi buyahluka, ezinye ii-wafers zinokuqulatha amawaka eetshipsi, ngelixa ezinye ziqulathe ezimbalwa kuphela. ishumi elinesibini.
Ezi ziqwenga ezingenanto zibekwe "kwi-substrate" - i-substrate esebenzisa i-foil yensimbi yokuqondisa igalelo kunye nemiqondiso yokuphuma kwi-wafer engenanto ukuya kuyo yonke inkqubo.Ithi ke igqunywe “ngesinki yobushushu”, isikhongozeli esincinci, esisicaba sentsimbi esikhuselayo esinesipholisa ukuqinisekisa ukuba itshiphu ihlala ipholile ngexesha lokusebenza.
Iprofayile yekhampani
I-Zhejiang NeoDen Technology Co., Ltd. ibisenza kwaye ithumela ngaphandle koomatshini abancinci abancinci bokukhetha kunye nendawo ukusukela ngo-2010. Ukuthatha ithuba le-R&D yethu enamava, imveliso eqeqeshwe kakuhle, iNeoDen iphumelela igama elihle kubathengi behlabathi ngokubanzi.
ngobukho behlabathi kumazwe angaphezu kwe-130, ukusebenza kakuhle, ukuchaneka okuphezulu kunye nokuthembeka kweNeoDenoomatshini bePNPzenze zigqibelele kwi-R&D, iprototyping yobuchwephesha kunye nemveliso yebhetshi encinci ukuya kwephakathi.Sinikezela ngesisombululo sobungcali sesixhobo esinye sokumisa i-SMT.
Yongeza: No.18, Tianzihu Avenue, Tianzihu Town, Anji County, Huzhou City, Province Zhejiang, China
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Ixesha lokuposa: Apr-24-2022