I. I-BGA epakishwe yinkqubo yokupakisha enezona mfuno ziphezulu ze-welding kwimveliso ye-PCB.Iinzuzo zayo zezi zilandelayo:
1. Iphini emfutshane, ukuphakama kwendibano ephantsi, inductance encinci yeparasitic kunye ne-capacitance, ukusebenza kakuhle kombane.
2. Ukuhlanganiswa okuphezulu kakhulu, izikhonkwane ezininzi, isithuba esikhulu se-pin, i-pin coplanar enhle.Umda we-pin spacing ye-electrode ye-QFP yi-0.3mm.Xa uhlanganisa ibhodi yesekethe edibeneyo, ukuchaneka kokunyuka kwe-QFP chip kungqongqo kakhulu.Ukuthembeka koqhagamshelo lombane kufuna ukunyamezelana okunyukayo kube yi-0.08mm.Izikhonkwane ze-electrode ze-QFP ezinezithuba ezimxinwa zincinci kwaye zibuthathaka, kulula ukuzijija okanye ukuphuka, nto leyo efuna ukuba ukuhambelana kunye nokucwangciswa phakathi kwezikhonkwane zebhodi yesekethe kufuneka kuqinisekiswe.Ngokwahlukileyo, inzuzo enkulu yephakheji ye-BGA kukuba isithuba se-10-electrode pin sikhulu, isithuba esiqhelekileyo yi-1.0mm.1.27mm, 1.5mm (Inch 40mil, 50mil, 60mil), ukunyamezela okunyukayo yi-0.3mm, kunye ne-multi eqhelekileyo -esebenzayoUmatshini we-SMTkwayereflow oveningahlangabezana neemfuno zendibano yeBGA.
II.Ngelixa i-BGA encapsulation ineenzuzo ezingentla, nayo inezi ngxaki zilandelayo.Oku kulandelayo kukungalungi kwe-BGA encapsulation:
1. Kunzima ukuhlola nokugcina i-BGA emva kwe-welding.Abavelisi be-PCB kufuneka basebenzise i-X-ray fluoroscopy okanye ukuhlolwa kwe-X-reyi ukuqinisekisa ukuthembeka koqhagamshelo lwebhodi yesekethe, kwaye iindleko zezixhobo ziphezulu.
2. Amalungu e-solder ngamnye ebhodini yesekethe aphukile, ngoko ke icandelo lonke kufuneka lisuswe, kwaye i-BGA esusiweyo ayinakuphinda isetyenziswe.
Ixesha lokuposa: Jul-20-2021