Inkqubo yokuqhubela phambili ye-SMT:
Okokuqala kumphezulu eprintiweyo ibhodi yesekethe solder ukutyabeka solder intlama, kwakhona ngeUmatshini we-SMTIzixhobo zetheminali enesinyithi okanye isikhonkwane ngokuchanekileyo kwidibaniso yokudibanisa ye-solder paste, emva koko ubeke iPCB enamalungu kwireflow ovenishushu ngokupheleleyo ukunyibilika intlama solder, emva kokupholisa, solder paste, solder ukunyangwa kuyenzeka phakathi amacandelo kunye nesekethe eprintiweyo uqhagamshelo oomatshini kunye nombane.Zeziphi iingenelo zeteknoloji yokusetyenzwa kwe-SMT?
I. Ukuthembeka okuphezulu kunye nokuxhathisa okunamandla kwe-vibration
Ukusetyenzwa kwe-SMT KUSEBENZISA amacandelo etshiphu, ukuthembeka okuphezulu, isixhobo esincinci kunye nesilula, ngoko ke ukuxhathisa ukungcangcazela komelele, kusetyenziswa imveliso ezenzekelayo, enokuthembeka okuphezulu, umlinganiselo ombi wokudityaniswa kwe-solder ungaphantsi kwesinye ngaphezu kwamawaka alishumi, ungaphantsi kunomngxuma wokuplaga icandelo lamaza. iteknoloji soldering umyalelo ubukhulu, ukuqinisekisa ukuba iimveliso zombane okanye amacandelo solder isiphene isantya joint iphantsi, Okwangoku, phantse 90% iimveliso elektroniki amkele ubuchwepheshe SMT.
II.Iimveliso ze-elektroniki zincinci ngobukhulu kwaye ziphezulu ekuxineni kwendibano
Umthamo kunye nobunzima bamacandelo e-SMT kuphela malunga ne-1/10 yalawo amacandelo e-plug-in yendabuko.Ngokuqhelekileyo, iteknoloji ye-SMT inokunciphisa umthamo kunye nobunzima beemveliso ze-elektroniki nge-40% -60% kunye ne-60% -80%, ngokulandelanayo.Igridi ye-SMT ye-SMT yokusetyenzwa kunye neenxalenye zendibano ukusuka kwi-1.27mm ukuya kwigridi ye-0.63mm yangoku, ezinye zifikelela kwigridi ye-0.5mm, ngokusebenzisa iteknoloji yokufakela umngxuma ukufaka amacandelo, inokwenza ubuninzi bendibano buphakame.
III.Iimpawu eziphezulu zefrikhwensi, ukusebenza okuthembekileyo
Ngenxa yokuncamathela okuqinileyo kwamacandelo e-chip, isixhobo sihlala singenalo isikhokelo okanye sifutshane, esinciphisa impembelelo ye-parasitic inductance kunye ne-parasitic capacitance, iphucula iimpawu ze-high-frequency zesekethe, kwaye inciphisa ukuphazamiseka kwe-electromagnetic kunye ne-rf.Iisekethe ze-SMC kunye ne-SMD ezilungiselelwe zine-frequency ephezulu ye-3GHz, ngelixa amacandelo e-chip angama-500MHz kuphela, anokunciphisa ixesha lokulibaziseka kokudluliselwa.Ingasetyenziswa kwiisekethe ezinamaza ewotshi ngaphezulu kwe-16MHz.Ngetekhnoloji ye-MCM, i-clock frequency yewotshi ephezulu yendawo yokusebenza yekhompyuter inokufikelela kwi-100MHz, kwaye ukusetyenziswa kombane okongeziweyo okubangelwa ukusabela kwe-parasitic kunokuncitshiswa ngamaxesha angama-2-3.
IV.Phucula imveliso kwaye uqaphele imveliso ezenzekelayo
Ukuzenzekela ngokupheleleyo, ukunyuswa kwe-PCB enemingxuma okwangoku kufuna ukwanda kwe-40% kwindawo ye-PCB yoqobo ukuze intloko yendibano yeplagi ezenzekelayo ifake icandelo, ngaphandle koko akukho ndawo yaneleyo yokwaphula inxalenye.Umatshini we-SMT ozenzekelayo (SM421/SM411) usebenzisa i-vacuum nozzle yokufunxa kunye nesixhobo sokukhupha, i-vacuum nozzle incinci kunembonakalo yecandelo, kodwa iphucula ukuxinana kofakelo.Enyanisweni, amacandelo amancinci kunye nesithuba esihle se-QFP ziveliswa ngumatshini we-SMT ozenzekelayo ukufikelela kwimveliso epheleleyo ezenzekelayo.
V. Ukunciphisa iindleko kunye neendleko
1. Indawo yokusetyenziswa kwebhodi eprintiweyo iyancitshiswa, kwaye indawo yi-1/12 yeteknoloji ye- through-hole .Ukuba ufakelo lwe-CSP lwamkelwa, indawo iya kuncitshiswa kakhulu.
2. Inani lemingxuma yokugaya kwibhodi eprintiweyo iyancitshiswa ukugcina iindleko zokulungisa.
3. Ngenxa yokuphuculwa kweempawu ze-frequency, iindleko zokuchithwa kweesekethe ziyancipha.
4. Ngenxa yobukhulu obuncinci kunye nobunzima bokukhanya kwamacandelo e-chip, ukupakishwa, ukuthutha kunye neendleko zokugcina ziyancipha.
5. Iteknoloji yokucubungula i-SMT SMT inokugcina izinto, amandla, izixhobo, abasebenzi, ixesha, njl., inokunciphisa iindleko ukuya kwi-30% -50%.
Ixesha lokuposa: Nov-19-2021