Zeziphi izinto eziluncedo kwisikhululo sokusebenza kwakhona seBGA?

Ziziphi iingenelo zeBGA rework station?Makhe sijonge.

1. Ukhetho olunamandla kunye nolugqibeleleyo lomsebenzi, inkumbulo yeentlobo ezisibhozo zeqondo lokushisa, abasebenzisi banokukhetha nayiphi na i-curve yokufudumeza ngokweemfuno ze-desoldering.

2. Ukufudumeza okuhlakaniphile kwegophe, unokuzigqibezela ngokuzenzekelayo yonke inkqubo ye-desoldering ngokwe-curve yakho yokushisa esetyenzisiweyo, ukwenza yonke inkqubo yokuchithwa kwenzululwazi ngakumbi.

3. Ulungelelwaniso olunemilinganiselo emithathu yesibane somzimba, inkqubo yesakhelo sesilayidi esirhoxiswayo, esilungele naziphi na iinxalenye ze-angle desoldering, umzimba wesibane se-infrared ngokubeka indawo yelaser, ukuze uhlengahlengiso lube lula ngakumbi ukubeka indawo echanekileyo.

4. I-PID iteknoloji yokulawula ubushushu obukrelekrele, ulawulo lobushushu luchaneke ngakumbi, ijika ligqibelele ngakumbi, linokuphepha ngokufanelekileyo ukunyuka kwamaqondo obushushu okanye ukunyuka kobushushu obungaphazanyiswa kwaye kubangele umonakalo kwi-chip okanye kwibhodi yesekethe.

I-5.I-Ultra-high power preheating inyibilika inkqubo yeglue, kunye nokusetyenziswa kwezixhobo zokufudumeza kwe-infrared self-developed, ukungena okunamandla, ukufudumeza okufanayo kwesixhobo, ulawulo oluchanekileyo lokushisa.Ngaba i-desoldering okanye iphinda isebenze kwakhona i-BGA, i-SMD, i-CSP, i-LGA, i-QFP, i-PLCC kunye ne-BGA yokufakela ibhola, umqolo ohlukeneyo wemigca yeplagi kunye neesokethi ze-pin (ezifana ne-CPU socket kunye ne-GAP plug row), ekwazi ngokupheleleyo ukuhlangabezana nekhompyutha, i-notebook, i-e- imidlalo kunye nezinye iimfuno BGA desoldering / rework, ingakumbi efanelekileyo computer emantla nasezantsi ibhulorho desoldering.

I-6.I-interface ye-man-machine interface, umboniso ogqibeleleyo we-LCD, yonke inkqubo yokufudumeza ukuze uqonde ngokukhawuleza.

I-7.Imbonakalo eqinile, ivolumu elula, ukususela ekuqaleni ukuya ekupheleni ukubonakalisa i-teknoloji-based based, imodi yokubeka itafile, ukuze ube neendawo ezininzi, imiyalelo yokusebenza elula, ukuze ukwazi ukuyifunda.

Inkcazo yeSikhululo sokuSebenza kwakhona se-BGA

Ubonelelo lwamandla: AC220V±10% 50/60HZ

Amandla: 5.65KW(Max), isifudumezisi esiphezulu (1.45KW)

Isifudumezisi esisezantsi (1.2KW)，IR Preheater (2.7KW), Okunye (0.3KW)

Ubungakanani bePCB: 412*370mm(Max);6*6mm(Min)

Ubungakanani be-BGA Chip: 60 * 60mm(Max); 2 * 2mm (Min)

Ubungakanani bokufudumala kwe-IR: 285 * 375mm

Inzwa yobushushu: 1 pcs

Indlela yokuSebenza: 7″ isikrini se-HD esichukumisayo

Inkqubo yokulawula: Inkqubo yokulawula ukufudumeza okuzisebenzelayo ye-V2 (ilungelo lokushicilela lesoftware)

Inkqubo yokubonisa: 15″ SD isiboniso soshishino (720P isikrini sangaphambili)

Inkqubo yoLungelelaniso: I-2 yezigidi zePixel SD inkqubo yokucinga yedijithali, ukusondeza okuzenzekelayo okubonakalayo ngelaser: isalathisi esinechaphaza elibomvu

Vacuum Adsorption: Ngokuzenzekelayo

Ulungelelwaniso oluchanekileyo: ± 0.02mm

Ulawulo lobushushu: K-uhlobo lwe-thermocouple oluvaliweyo-loop ulawulo ngokuchaneka ukuya kuthi ga kwi-±3℃

Isixhobo sokutyisa: Hayi

Indawo: V-groove enendawo yonke

Imilinganiselo: L685 * W633 * H850mm

Ubunzima: 76KG