1. Ubunzima bebhodi ngokwayo buya kubangela ibhodi yokudakumba deformation
Ngokubanzireflow oveniya kusebenzisa ikhonkco ukuqhubela ibhodi phambili, oko kukuthi, amacala amabini ebhodi njenge-fulcrum yokuxhasa ibhodi yonke.
Ukuba kukho iindawo ezinzima kakhulu ebhodini, okanye ubukhulu bebhodi bukhulu kakhulu, buya kubonisa ukudakumba okuphakathi ngenxa yobunzima bayo, kubangela ukuba ibhodi igobe.
2. Ubunzulu be-V-Cut kunye nomgca wokudibanisa kuya kuchaphazela ukuguqulwa kwebhodi.
Ngokwenene, i-V-Cut iyona nto ibangela ukutshabalalisa isakhiwo sebhodi, kuba i-V-Cut kukusika i-grooves kwiphepha elikhulu lebhodi yokuqala, ngoko ke indawo ye-V-Cut ixhomekeke kwi-deformation.
Isiphumo se-lamination material, isakhiwo kunye nemizobo kwi-deformation yebhodi.
Ibhodi PCB yenziwe ngebhodi engundoqo kunye nephepha semi-waphiliswa kunye nefoyile yobhedu yangaphandle icinezelwe kunye, apho ibhodi engundoqo kunye nefoyile yobhedu zikhubazeke bubushushu xa zicinezelwe kunye, kwaye ubungakanani deformation ixhomekeke coefficient yokwandiswa thermal (CTE) of izixhobo ezimbini.
I-coefficient yokwandiswa kwe-thermal (CTE) ye-foil yobhedu malunga ne-17X10-6;ngelixa i-CTE ye-Z-directional ye-FR-4 substrate eqhelekileyo (50 ~ 70) i-X10-6 phantsi kwendawo ye-Tg;(250 ~ 350) X10-6 ngasentla TG point, kunye X-directional CTE ngokubanzi iyafana nefoyile yobhedu ngenxa yobukho ilaphu iglasi.
Deformation ebangelwa ngexesha PCB ibhodi processing.
PCB ibhodi processing inkqubo deformation oonobangela zintsonkothile kakhulu zinokwahlulwa ibe uxinzelelo thermal kunye noxinzelelo koomatshini okubangelwa iintlobo ezimbini zoxinzelelo.
Phakathi kwabo, uxinzelelo lwe-thermal luveliswa ngokukodwa kwinkqubo yokucinezela kunye, uxinzelelo lomatshini lwenziwa ikakhulu kwi-stacking yebhodi, ukuphatha, inkqubo yokubhaka.Oku kulandelayo yingxoxo emfutshane yolandelelwano lwenkqubo.
1. Laminate imathiriyeli engenayo.
I-Laminate inamacala amabini, i-symmetrical structure, akukho mizobo, i-foil yobhedu kunye nelaphu leglasi ye-CTE ayahlukanga kakhulu, ngoko kwinkqubo yokucinezela kunye phantse akukho deformation ebangelwa yi-CTE eyahlukileyo.
Nangona kunjalo, ubungakanani obukhulu bokushicilela i-laminate kunye nokwahlukana kweqondo lokushisa phakathi kweendawo ezahlukeneyo zepleyiti eshushu kunokukhokelela ekuhlukeni okuncinci kwisantya kunye neqondo lokunyanga i-resin kwiindawo ezahlukeneyo zenkqubo ye-lamination, kunye nokwahlukana okukhulu kwi-viscosity eguquguqukayo. kumazinga ahlukeneyo okufudumeza, ngoko ke kuya kubakho uxinzelelo lwasekhaya ngenxa yomahluko kwinkqubo yokunyanga.
Ngokuqhelekileyo, olu xinzelelo luya kugcinwa ngokulinganayo emva kokunyanyiswa, kodwa luya kukhululwa ngokuthe ngcembe kwi-processing ezayo ukuvelisa i-deformation.
2. Lamination.
PCB lamination inkqubo yeyona nkqubo iphambili ukuvelisa uxinzelelo thermal, efana laminate lamination, uya kuvelisa kwakhona uxinzelelo lwasekuhlaleni eziziswa umahluko kwinkqubo yokunyanga, PCB ibhodi ngenxa ngqindilili, ukuhanjiswa kwemizobo, sheet ngaphezulu semi-wanyanga, njl. uxinzelelo lwayo lwe-thermal luya kuba nzima ngakumbi ukuphelisa ngaphezu kwe-laminate yobhedu.
Uxinzelelo olukhoyo kwibhodi yePCB lukhululwa kwiinkqubo ezilandelayo ezifana nokubhola, ukubunjwa okanye ukugcoba, okubangela ukuguqulwa kwebhodi.
3. Iinkqubo zokubhaka ezifana ne-solder ukumelana kunye nomlingiswa.
Njengoko i-solder ukumelana ne-inki yokuphilisa ayikwazi ukupakishwa phezu komnye, ngoko ke ibhodi ye-PCB iya kufakwa ngokuthe nkqo kwibhodi yokubhaka yokunyanga, i-solder ukumelana nobushushu obumalunga ne-150 ℃, ngaphezu kwendawo ye-Tg yezinto eziphantsi ze-Tg, inqaku le-Tg. ngaphezu kwe-resin ye-high elastic state, ibhodi ilula ukuguqulwa phantsi kwefuthe le-self-weight okanye i-oven yomoya enamandla.
4. Ukulinganisa i-solder yomoya oshushu.
Ibhodi eqhelekileyo eshushu emoyeni solder iqondo lobushushu eziko 225 ℃ ~ 265 ℃, ixesha 3S-6S.iqondo lobushushu bomoya 280 ℃ ~ 300 ℃.
Ibhodi yokulinganisa i-Solder ukusuka kwiqondo lobushushu begumbi ukuya kwiziko, ngaphandle kweziko kwimizuzu emibini kwaye emva koko iqondo lobushushu begumbi emva kokucoca amanzi.Yonke inkqubo yokulinganisa i-solder yomoya oshushu yenkqubo eshushu kunye nebanda ngokukhawuleza.
Ngenxa yokuba izinto zebhodi zihlukile, kwaye isakhiwo asifani, kwinkqubo eshushu kunye nebandayo ibophelelwe kuxinzelelo lwe-thermal, okubangelwa yi-micro-strain kunye ne-deformation warpage jikelele.
5. Ugcino.
PCB ibhodi kwisigaba semi-ogqityiweyo yogcino ngokubanzi nkqo ifakwe kwishelufa, ulungelelwaniso loxinzelelo lweshelufa ayifanelekanga, okanye inkqubo yogcino ukupakisha ukubeka ibhodi kuya kwenza ibhodi deformation oomatshini.Ngokukodwa kwi-2.0mm ngaphantsi kwempembelelo yebhodi encinci ibaluleke kakhulu.
Ukongeza kule miba ingasentla, kukho izinto ezininzi ezichaphazela deformation PCB ibhodi.
Ixesha lokuposa: Sep-01-2022