I-Reflow flow welding ibhekisa kwinkqubo ye-welding eqonda uqhagamshelo ngoomatshini kunye nombane phakathi kweziphelo ze-solder okanye izikhonkwane zamacandelo endibano yomphezulu kunye neepadi ze-solder ze-PCB ngokunyibilikisa i-solder paste eprintwe ngaphambili kwi-PCB pads.
1. Inkqubo yokuhamba
Inkqubo yokuhanjiswa kwe-reflow soldering: ukuprinta intlama ye-solder → isixhosi → i-reflow soldering.
2. Iimpawu zenkqubo
Ubungakanani bomdibaniso we-solder buyalawuleka.Ubungakanani obunqwenelekayo okanye ubume bomdibaniselwano we-solder bunokufumaneka kwi-design yesayizi ye-pad kunye nenani le-paste eprintiweyo.
I-Welding paste isetyenziswa ngokubanzi ngokuprintwa kwesikrini sentsimbi.Ukuze kube lula ukuhamba kwenkqubo kunye nokunciphisa iindleko zemveliso, ngokuqhelekileyo i-welding paste enye iprintwa kumphezulu ngamnye we-welding.Olu phawu lufuna ukuba amacandelo kubuso bendibano nganye akwazi ukusasaza i-solder paste usebenzisa i-mesh enye (kubandakanya i-mesh yobukhulu obufanayo kunye ne-mesh ene-steped).
I-reflow furnace eneneni liziko letonela elinamaqondo amaninzi obushushu umsebenzi walo ophambili kukufudumeza iPCBA.Amacandelo ahlelwe kumgangatho osezantsi (icala le-B) kufuneka ahlangabezane neemfuno ezimiselweyo zomatshini, njengephakheji ye-BGA, ubunzima becandelo kunye ne-pin yendawo yoqhagamshelwano ye-pin ≤0.05mg / mm2, ukwenzela ukukhusela amacandelo aphezulu aphezulu ukuba angawa xa u-welding.
Kwi-reflow soldering, icandelo lidada ngokupheleleyo kwi-solder etyhidiweyo (i-solder joint).Ukuba ubungakanani bepadi bukhulu kunobukhulu bephini, ubume becandelo bunzima, kwaye uyilo lwephini luncinci, luthanda ukufuduswa ngenxa yoxinzelelo lwe-asymmetric etyhidiweyo yesolder yomphezulu okanye ukunyanzeliswa komoya oshushu ovuthuza kwiziko lokubuyela umva.
Ngokuqhelekileyo, kumacandelo anokuthi alungise indawo yawo ngokwawo, umlinganiselo omkhulu wobungakanani bepadi ukuya kwindawo edibeneyo yesiphelo se-welding okanye i-pin, uqina umsebenzi wokumisa wamacandelo.Yile ngongoma esiyisebenzisayo kuyilo oluthile lweepads ezineemfuno zokubeka.
Ukubunjwa kwe-weld (ibala) morphology ikakhulu kuxhomekeke kwisenzo sokumanzisa amandla kunye noxinzelelo lomphezulu we-solder etyhidiweyo, efana ne-0.44mmqfp.Ipateni eprintiweyo yokunamathisela i-solder yi-cuboid eqhelekileyo.
Ixesha lokuposa: Dec-30-2020