1. Umatshini wokuSolisa wamazaInkqubo yezobuchwepheshe
Ukusasaza → isiziba → ukunyanga → ukunyibilikisa kwamaza
2. Iimpawu zenkqubo
Ubungakanani kunye nokuzaliswa kokubambisana kwe-solder kuxhomekeke kuyilo lwephedi kunye nesithuba sofakelo phakathi komngxuma kunye nesikhokelo.Ubungakanani bobushushu obusetyenzisiweyo kwi-PCB buxhomekeke ikakhulu kubushushu be-solder etyhidiweyo kunye nexesha loqhagamshelwano (ixesha le-welding) kunye nommandla phakathi kwe-solder etyhidiweyo kunye ne-PCB.
Ngokubanzi, ubushushu bokufudumala bunokufumaneka ngokulungelelanisa isantya sokudluliselwa kwePCB.Nangona kunjalo, ukhetho lwendawo yokudibanisa i-welding ye-mask ayixhomekeke kububanzi be-nozzle ye-crest, kodwa kwi-tray window size.Oku kufuna ukuba i-layout of components kwi-welding surface ye-mask kufuneka ihlangabezane neemfuno zobuncinci befestile yefestile yetreyi.
Kukho "impembelelo yokukhusela" kuhlobo lwe-welding chip, ekulula ukwenzeka into yokuvuza kwe-welding.Ukukhusela kubhekisa kwinto yokuba ipakethe yesiqalelo setshiphu ithintela amaza e-solder ekudibaneni nephedi/isiphelo somthengisi.Oku kufuna ukuba umkhombandlela omde wecandelo letshiphu elidityanisiweyo lilungelelaniswe ngokuthe ngqo kwicala lothumelo ukuze iziphelo ezibini ezidityanisiweyo zecandelo letshiphu zibe nokumanziswa kakuhle.
I-Wave soldering kukusetyenziswa kwe-solder ngamaza atyhidiweyo.Amaza e-Soldering anenkqubo yokungena kunye nokuphuma xa uthengisa indawo ngenxa yentshukumo yePCB.I-solder wave isoloko ishiya indawo ye-solder kwicala lokukhutshwa.Ke ngoko, ibhulorho yesidibanisi sentsimbi eqhelekileyo ihlala isenzeka kwiphini lokugqibela elikhupha i-solder wave.Oku kuluncedo ukusombulula uqhagamshelo lwebhulorho yesidibanisi sokuvala isikhonkwane sokufaka.Ngokubanzi, nje ukuba uyilo lwephedi ye-solder efanelekileyo emva kwepini yokugqibela ingasombululwa ngokufanelekileyo.
Ixesha lokuposa: Sep-26-2021