Eli phepha libala imiqathango yobuchwephesha eqhelekileyo kunye neengcaciso zokusetyenzwa komgca wendibanoUmatshini we-SMT.
1. PCBA
INdibano yeBhodi yeSekethe eprintiweyo (PCBA) ibhekisa kwinkqubo apho iibhodi zePCB zicutshungulwa kwaye zenziwe, kubandakanywa imicu eprintiweyo ye-SMT, iiplagi ze-DIP, uvavanyo olusebenzayo, kunye neNdibano yemveliso egqityiweyo.
2. ibhodi PCB
Ibhodi yeSekethe eprintiweyo (PCB) lixesha elifutshane lebhodi yesekethe eShicileleyo, edla ngokuhlulwa ibe yiphaneli enye, iphaneli ephindwe kabini kunye nebhodi enamaleko amaninzi.Izinto ezisetyenziswa ngokuqhelekileyo ziquka i-FR-4, i-resin, i-glass fiber cloth kunye ne-aluminium substrate.
3. Iifayile zeGerber
ifayile Gerber ikakhulu ichaza ingqokelela yoxwebhu ifomathi yomfanekiso PCB (umgca umaleko, umaleko solder ukumelana, umaleko umlinganiswa, njl) ukugrumba kunye nedatha yokusila, ekufuneka inikwe PCBA processing plant xa PCBA ucaphulo lwenziwa.
4. Ifayile yeBOM
Ifayile ye-BOM luhlu lwezixhobo.Zonke izinto ezisetyenziswa kwi-PCBA processing, kubandakanywa ubuninzi bezinto kunye nendlela yenkqubo, zisisiseko esibalulekileyo sokuthengwa kwezinto.Xa PCBA kucatshulwe, kufuneka kwakhona ukuba inikwe PCBA processing plant.
5. SMT
I-SMT sisishunqulelo se-“Surface Mounted Technology”, esibhekisa kwinkqubo yoshicilelo lwe-solder paste, ukunyuswa kwezixhobo zeshiti kunyereflow oveni-soldering kwibhodi ye-PCB.
6. Umshicileli wokuncamathisela we-Solder
Ukuprintwa kwe-solder paste yinkqubo yokubeka i-solder paste kumnatha wensimbi, ukuvuza i-solder paste ngomngxuma wentsimbi yentsimbi nge-scraper, kunye nokushicilela ngokuchanekileyo i-solder paste kwi-PCB pad.
7. SPI
I-SPI sisikhangeli sobukhulu bencama ye-solder.Emva koshicilelo lwe-solder paste, ubhaqo lwe-SIP luyafuneka ukuze kubonwe imeko yoshicilelo lwe-solder paste kunye nokulawula isiphumo soshicilelo lwe-solder paste.
8. Reflow welding
I-Reflow soldering kukubeka i-PCB eqhotyoshelweyo kumatshini we-reflow solder, kwaye ngobushushu obuphezulu ngaphakathi, i-paste solder paste iya kufudumeza ibe ngulwelo, kwaye ekugqibeleni i-welding iya kugqitywa ngokupholisa kunye nokuqina.
9. AOI
I-AOI ibhekisa kubhaqo oluzenzekelayo lwamehlo.Ngokuthelekisa ukuskena, isiphumo sokuwelda kwebhodi yePCB sinokubonwa, kwaye iziphene zebhodi yePCB zinokubonwa.
10. Ukulungisa
Isenzo sokulungisa i-AOI okanye iibhodi ezichongiweyo ngesandla.
11. DIP
I-DIP imfutshane ye-“Dual In-line Package”, ebhekiselele kubuchwephesha bokwenza izinto ezinezikhonkwane kwibhodi yePCB, emva koko zisetyenzwe ngokuthengiswa kwamaza, ukusika unyawo, ukusoda ngeposi, kunye nokuhlamba iipleyiti.
12. Ukuthengiswa kwamaza
I-Wave soldering kukufaka i-PCB kwi-wave soldering eziko, emva kokutshiza, ukufudumeza, ukufudumeza kwamaza, ukupholisa kunye namanye amakhonkco ukugqiba ukuwelda kwebhodi yePCB.
13. Sika amacandelo
Sika amacandelo kwibhodi edityanisiweyo yePCB ukuya kubungakanani obufanelekileyo.
14. Emva kwe-welding processing
Emva kwe-welding processing kukulungisa ukuwelda kunye nokulungisa i-PCB engekho ngokupheleleyo emva kokuhlolwa.
15. Ukuhlamba iipleyiti
Ibhodi yokuhlamba kukucoca izinto eziyingozi ezishiyekileyo ezifana nokuguquguquka kwiimveliso ezigqityiweyo ze-PCBA ukuze kuhlangatyezwane nomgangatho wokucoceka okusingqongileyo okufunwa ngabathengi.
16. Ukutshiza iipeyinti ezintathu zokunqanda
Ukutshiza iipeyinti ezintathu zokutshiza kukutshiza umaleko wokwaleka okhethekileyo kwibhodi yeendleko zePCBA.Emva kokunyanga, inokudlala ukusebenza kwe-insulation, ubungqina bokufuma, ubungqina bokuvuza, ubungqina bomothuko, ubungqina bothuli, i-corrosion proof, ubungqina bokuguga, ubungqina bokungunda, iindawo ezikhululekile kunye nokumelana ne-corrosion.Inokwandisa ixesha lokugcina le-PCBA kwaye ihlukanise ukhukuliseko lwangaphandle kunye nongcoliseko.
17. I-Welding Plate
Ukuguquguquka yiPCB umphezulu owandisiweyo umkhombandlela wasekhaya, akukho sigqubuthelo sepeyinti yokugquma, enokusetyenziselwa izinto zokuwelda.
18. Ukubethelela
Ukupakishwa kubhekisela kwindlela yokupakisha yamacandelo, ukupakishwa kukwahlulwe ngokukodwa kwi-DIP kabini - umgca kunye ne-SMD patch packaging ezimbini.
19. Izithuba zepin
Isithuba sePin sibhekisa kumgama phakathi kwemigca esembindini yezikhonkwane ezikufutshane zecandelo lokuxhoma.
20. QFP
I-QFP imfutshane "I-Quad Flat Pack", ebhekisela kwisiphaluka esihlangeneyo esihlanganisiweyo kwi-package yeplastiki encinci kunye ne-airfoil emfutshane ehamba phambili kumacala amane.
Ixesha lokuposa: Jul-09-2021