Ziziphi iiNkqubo eziPhambili ze-Oveni yokuBonelela kwakhona?

SMT khetha kwaye ubeke umatshiniibhekisa kwisifinyezo sothotho lweenkqubo zobuchwepheshe ngokwesiseko sePCB.I-PCB ithetha iBhodi yeSekethe eprintiweyo.

ITekhnoloji eFakelweyo iTekhnoloji yeyona nto idumileyo kunye nenkqubo kwishishini lokuhlanganisa i-elektroniki ngoku.Ibhodi yeSekethe eprintiweyo yiTekhnoloji yendibano yeSekethe apho amacandelo endibano yomphezulu ngaphandle kwezikhonkwane okanye iintambo ezimfutshane zifakwe kumphezulu weebhodi zeSekethe eziprintiweyo okanye ezinye ii-substrates kwaye zithengiswa kunye ngendlela ye-welding ye-reflow, i-welding ye-dip, njl.

Ngokubanzi, iimveliso zombane esizisebenzisayo zenziwe nge-PCB kunye neentlobo ngeentlobo ze-capacitors, i-resistors kunye namanye amacandelo e-elektroniki ngokoyilo loyilo lwedayagramu yesekethe, ngoko ke zonke iintlobo zezixhobo zombane zifuna iintlobo ezahlukeneyo zeteknoloji ye-SMT yokucubungula.

Izinto ezisisiseko zenkqubo ye-SMT: ushicilelo lwe-solder paste -> ukunyuswa kwe-SMT ->reflow oven->AOIizixhoboukuhlolwa kwamehlo -> ukugcinwa -> ibhodi.

Ngenxa yenkqubo yobuchwepheshe yokusetyenzwa kwe-SMT okuntsonkothileyo, ngoko kukho iifektri ezininzi zokusetyenzwa kwe-SMT, umgangatho we-SMT uphuculwe, kunye nenkqubo ye-SMT, lonke ikhonkco libalulekile, alinakuba nayo nayiphi na impazamo, namhlanje i-make up encinci kunye nomntu wonke kunye bafunde ukugeleza kwakhona kwe-SMT. umatshini wokuwelda waziswa kwaye iteknoloji engundoqo ekuqhubeni.

Isixhobo sokuthengisa i-Reflow sisixhobo esiphambili kwinkqubo yendibano ye-SMT.Umgangatho wePCBA solder joint ixhomekeke ngokupheleleyo ekusebenzeni kwezixhobo zokuphinda zifakwe kwi-solder kunye nokumisela ijika lobushushu.

Itekhnoloji ye-welding ye-reflow ifumene uphuhliso lwe-plate radiation heat heat, i-quartz infrared tube heat, i-infrared air heat heat, ukufudumeza komoya okunyanzeliswayo, ukufudumeza komoya okunyanzeliswayo kunye nokukhusela i-nitrogen kunye nezinye iifom.
Iimfuno ezongeziweyo zenkqubo yokupholisa ye-reflow soldering nazo zikhuthaze uphuhliso lweendawo zokupholisa zezixhobo zokuphinda zifakwe kwi-solder, ukusuka ekupholiseni kwendalo kunye nokupholisa komoya kwindawo yobushushu begumbi ukuya kwiinkqubo zokupholisa zamanzi ezilungiselelwe ukusoda okungenalothe.

Isixhobo sokuthengisa i-reflow ngenxa yenkqubo yokuvelisa ukuchaneka kokulawula ubushushu, ukufana kweqondo lokushisa kwindawo yokushisa, isantya sokudlulisa kunye nezinye iimfuno.Kwaye iphuhliswe ukusuka kwindawo yobushushu emithathu kwindawo yobushushu emihlanu, indawo yobushushu emithandathu, indawo yobushushu esixhenxe, indawo yobushushu esibhozo, indawo yobushushu elishumi kunye nezinye iinkqubo zokuwelda ezahlukeneyo.

Iiparamitha eziphambili zezixhobo zokuphinda zifakwe kwi-solder
1. Inani, ubude kunye nobubanzi bommandla wobushushu;
2. I-Symmetry yezifudumezi eziphezulu nezisezantsi;
3. Ukufana kokusasazwa kweqondo lokushisa kwindawo yokushisa;
4. Ukuzimela kokulawulwa kwesantya sokuhanjiswa koluhlu lobushushu;
I-5, umsebenzi we-welding ye-inert yokukhusela igesi;
6. Ulawulo lwemithamo yokuhla kobushushu kwindawo yokupholisa;
7. Ubushushu obukhulu be-reflow welding heater;
8. Ukuchaneka kokulawula ubushushu be-reflow soldering heater;