Kwinkqubo PCBA processing, kukho iinkqubo ezininzi imveliso, ekulula ukuvelisa iingxaki ezininzi umgangatho.Ngeli xesha, kuyimfuneko ukuba rhoqo ukuphucula indlela PCBA welding kunye nokuphucula inkqubo ngempumelelo ukuphucula umgangatho imveliso.
I. Ukuphucula ubushushu kunye nexesha welding
I-intermetallic bond phakathi kobhedu kunye ne-tin yenza iinkozo, imilo kunye nobukhulu beenkozo zixhomekeke kwixesha kunye namandla obushushu xa izixhobo zokuthengisela ezifanareflow ovenokanyeumatshini wokuthambisa wamaza.Ixesha lokuphendula le-PCBA SMD lide kakhulu, nokuba kungenxa yexesha elide le-welding okanye ngenxa yobushushu obuphezulu okanye zombini, kuya kukhokelela kulwakhiwo lwekristale olurhabaxa, ulwakhiwo luluhlalutye kwaye lubhityile, amandla okucheba mancinci.
II.Nciphisa ukuxinana komphezulu
I-Tin-lead solder cohesion inkulu ngakumbi kunamanzi, ukuze i-solder ibe yingqukuva yokunciphisa indawo yayo ephezulu (umthamo ofanayo, i-sphere inommandla omncinci womhlaba xa kuthelekiswa nezinye iimilo zejometri, ukuhlangabezana neemfuno zelizwe lamandla aphantsi. ).Indima ye-flux ifana nendima yee-arhente zokucoca kwipleyiti yensimbi eqatywe ngegrisi, ukongeza, ukuxinezeleka komphezulu kuxhomekeke kakhulu kwiqondo lokucoceka komphezulu kunye nobushushu, kuphela xa amandla okunamathela makhulu kakhulu kunomhlaba. amandla (ubumbano), i-dip tin efanelekileyo inokwenzeka.
III.PCBA ibhodi dip engile yetin
Malunga ne-35 ℃ ngaphezulu kobushushu bendawo ye-eutectic ye-solder, xa ithontsi le-solder libekwe kwindawo eshushu egqunywe nge-flux, umphezulu wenyanga ogobayo wenziwa, ngendlela, ukukwazi komphezulu wesinyithi ukudipha i-tin kunokuvavanywa. ngokwemilo yenyanga egobayo.Ukuba i-solder egoba umphezulu wenyanga inomphetho ocacileyo osikiweyo osezantsi, omile okwepleyiti yentsimbi ethambisayo kumathontsi amanzi, okanye ithande ukungqukuva, intsimbi ayithengiswa.Kuphela umphezulu wenyanga ogobileyo wolulelwe kwi-engile encinci engaphantsi kwe-30. I-weldability elungileyo kuphela.
IV.Ingxaki ye-porosity eyenziwa yi-welding
1. Ukubhaka, i-PCB kunye namacandelo abonakaliswe emoyeni ixesha elide ukubhaka, ukukhusela ukufuma.
2. Ukulawulwa kwe-solder paste, i-solder paste equlethe ukufuma iphinda ithande ukuba i-porosity, amaso e-tin.Okokuqala, sebenzisa umgangatho omhle we-solder paste, i-solder paste i-teering, ivuselela ngokuhambelana nokusebenza kokuphunyezwa okungqongqo, i-solder paste evezwe emoyeni ixesha elifutshane kangangoko kunokwenzeka, emva kokushicilela intlama ye-solder, imfuno ye-solder ye-reflow kwangexesha.
3. Ulawulo lokufuma kwiworkshop, olucwangciswe ukubeka esweni ukufuma kweworkshop, ukulawula phakathi kwe-40-60%.
4. Cwangcisa ijika lobushushu obufanelekileyo, kabini ngemini kuvavanyo lobushushu besithando somlilo, lungisa ijika lobushushu bomlilo, izinga lokunyuka kweqondo lobushushu alinakukhawuleza.
5. Flux ukutshiza, kwi phezuUmatshini wokuthengisa amaza we-SMD, isixa sokutshiza nge-flux ayinakuba kakhulu, ukutshiza ngokufanelekileyo.
6. Lungiselela i-curve yokushisa kwesithando somlilo, ukushisa kwendawo yokutshisa i-preheating kufuneka ihlangabezane neemfuno, ingabi phantsi kakhulu, ukwenzela ukuba i-flux ikwazi ukuguquguquka ngokupheleleyo, kwaye isantya sesithando somlilo asikwazi ukukhawuleza.
Ixesha lokuposa: Jan-05-2022