Indlela yokuhlola okubonwayo
Ukusebenzisa i-glass magnifying glass (X5) okanye i-microscope ye-optical kwi-PCBA, umgangatho wokucoca uvavanywa ngokuqwalasela ubukho beentsalela eziqinileyo ze-solder, i-dross kunye ne-tin beads, iincinci zetsimbi ezingagxinanga kunye nezinye izinto ezingcolileyo.Ngokuqhelekileyo kufuneka ukuba umphezulu we-PCBA ucoceke ngokusemandleni kwaye kungabikho mikhondo yeentsalela okanye izinto ezingcolileyo kufuneka zibonakale.Esi sisalathisi somgangatho kwaye sikholisa ukujoliswa kwiimfuno zomsebenzisi, iindlela zabo zokugweba zovavanyo kunye nenani lokwandiswa okusetyenziswe ngexesha lokuhlolwa.Le ndlela ibonakaliswe ngokulula kwayo kunye nokulula ukuyisebenzisa.Ukungalungi kukuba akwenzeki ukujonga ungcoliseko emazantsi amacandelo kunye nentsalela ye-ionic engcolisekileyo kwaye ilungele izicelo ezingabalulekanga kangako.
Indlela yokutsalwa kwesinyibilikisi
Indlela yokutsalwa kwe-solvent yaziwa ngokuba luvavanyo lomxholo we-ionic.Luhlobo lovavanyo oluqhelekileyo lwe-ionic engcolisekileyo, uvavanyo lusetyenziswa ngokubanzi indlela ye-IPC (IPC-TM-610.2.3.25), iyacocwa i-PCBA, intywiliselwe kwisisombululo sovavanyo lomvavanyi we-ionic degree (75% ± 2% isopropyl ecocekileyo). utywala kunye ne-25% yamanzi e-DI), intsalela ye-ionic iya kunyibilika kwi-solvent, iqokelele ngononophelo i-solvent, inqume ukumelana kwayo.
Ukungcola kwe-Ionic ngokuqhelekileyo kuphuma kwizinto ezisebenzayo ze-solder, ezifana ne-halogen ions, i-acid ions, kunye ne-ion zetsimbi ezivela kwi-corrosion, kwaye iziphumo zibonakaliswa njengenani le-sodium chloride (NaCl) elinganayo kwindawo nganye yeyunithi.Okokuthi, isixa esipheleleyo sezi ngcoliseko ze-ionic (kubandakanywa kuphela ezo zinokuthi zinyibilike kwi-solvent) zilingana nexabiso le-NaCl, kungekhona okanye likhona kuphela kumphezulu we-PCBA.
UVavanyo lwe-Surface Insulation Resistance (SIR)
Le ndlela ilinganisa ukumelana nokugquma komphezulu phakathi kwee-conductor kwi-PCBA.Umlinganiselo wokumelana nokugquma komhlaba ubonisa ukuvuza ngenxa yokungcoliseka phantsi kweemeko ezahlukeneyo zobushushu, ukufuma, umbane kunye nexesha.Iingenelo kumlinganiselo othe ngqo kunye nobungakanani;kunye nobukho beendawo ezihlala kwindawo ye-solder paste zingabonwa.Njengoko flux eshiyekileyo kwi PCBA solder paste ikakhulu ekhoyo umthungo phakathi isixhobo kunye PCB, ingakumbi kumalungu solder BGAs, leyo kunzima kakhulu ukususa, ukwenzela ukuqinisekisa ngakumbi isiphumo ukucoca, okanye ukuqinisekisa ukhuseleko. (intsebenzo yombane) ye-solder paste esetyenzisiweyo, umlinganiselo wokumelana nomphezulu kwi-seam phakathi kwecandelo kunye ne-PCB idla ngokusetyenziselwa ukujonga umphumo wokucoca we-PCBA.
Iimeko zomlinganiselo we-SIR jikelele luvavanyo lweyure ezingama-170 kumaqondo obushushu obungama-85°C ambient, ama-85% e-RH yokufuma okungqongileyo kunye nokuthambekela komlinganiselo we-100V.
Umatshini wokucoca weNeoDen PCB
Inkcazo
Inkxaso yomatshini wokucoca umphezulu wePCB: Iseti enye yesakhelo esixhasayo
Ibhrashi: Ibhrashi engagungqiyo, enoxinaniso oluphezulu
Iqela lokuqokelela uthuli: Ibhokisi yokuqokelela umthamo
Isixhobo se-Antistatic: Iseti yesixhobo sokungena kunye neseti yesixhobo sokuphuma
Inkcazo
| Igama lemveliso | PCB umatshini wokucoca umphezulu |
| Umzekelo | PCF-250 |
| Ubungakanani bePCB(L*W) | 50 * 50mm-350 * 250mm |
| Ubungakanani(L*W*H) | 555*820*1350mm |
| PCB ubukhulu | 0.4 ~ 5mm |
| Umthombo wamandla | 1Ph 300W 220VAC 50/60Hz |
| Ukubonelela ngomoya | Ubungakanani bombhobho wokungenisa umoya 8mm |
| Ukucoca i-roller encangathi | Phezulu*2 |
| Iphepha elincangathi lothuli | Phezulu*1 umqulu |
| Isantya | 0～9m/min(Inokulungiswa) |
| Track ubude | 900±20mm/(okanye ngokwezifiso) |
| Indlela yezothutho | L→R okanye R→L |
| Ubunzima(kg) | 80Kg |
Ixesha lokuposa: Nov-22-2022